0.8mm Pitch 4mm Mounting Height S.O. DIMM Socket SX6E Series SX6E-144S-0.8SH ■Features 4mm Mounting Height, 69.6mm Width Socket 1. 144pos. 8 Byte Small Outline DIMM SX6E series is a 0.8mm pitch parallel SMT type socket applicable to 144pos. 8 Byte Small Outline DIMM standardized by JEDEC. mm 69.6 2. 4mm Mounting Height This socket achieves 4mm mounting height and is designed in a small and light structure. 3. 69.6mm Socket Width This socket achieves 69.6mm width with mold latch and reduces the prohibition area to mount the mother board. 4mm 4. Easy Insertion and Extraction of Module Board (1) One-touch operation to insert the module board slantly and push it downward. (2) Widen latches right and left, and the module board will be automatically raised.This mechanism allows easy automatic extraction. (3) The original mold twin-latch mechanism allows click sensible Insertion and extraction. 5. Solder Reparability Considering solder reparability, the contact SMT is designed so as to widen the insulation case interval. ■Applications Note PC, business equipment, measuring instruments, telecommunication equipment, medical equipment, FA, game appliances, EWS D24 Easy Insertion and Extraction Operation of Module Board ■Product Specifications Current rating -55ç+85ç Voltage rating 25V AC Operating Temperature Range 0.3A Rating Item Operating Humidity Range -55ç to +85ç Specification Condition 1. Contact Resistance 35m ohms min. 100mA DC 2. Insulation Resistance 1000M ohms min. 250V DC 3. Withstanding voltage No flashover or insulation breakdown. 250V AC / 1 minute 4. Durability Contact resistance: 55m ohms max. (Insertion/withdrawal) No damage, cracks, or parts looseness. No electrical discontinuity of 1µs or more 5. Vibration Contact resistance: 55m ohms max. No damage, cracks, or parts looseness. No electrical discontinuity of 1µs or more 6. Shock Contact resistance: 55m ohms max. No damage, cracks, or parts looseness. 7. Temperature Cycle 8. Humidity (Steady state) 9. Salt spray 30 cycles Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis Contact resistance: 55m ohms max. 5 cycles under following conditions: Insulation resistance: 1000M ohms max. Temperature : -55➝ +5 to 35➝ +85➝ +5 to 35ç No damage, cracks, or parts looseness. Time Contact resistance: 55m ohms max. Insulation resistance: 1000M ohms max. No damage, cracks, or parts looseness. Contact resistance: 55m ohms max. : -30➝ 10 to 15➝ +30➝ 10 to 15 minutes 96 hours at temperature of 40ç and humidity of 90% to 95% Exposed to density 5% salt water for 48 hours ■Material Part Material Finish Contact Phosphor copper Gold plating Insulator Metal fitting LCP(UL94V-0) Phosphor copper Solder plating D25 ■Socket SX6E-144S-0.8SH (4) (30) (4.8) CL ) (30° (69.6) (2.1) (63) D26 Part Number CL No. Number of Contacts Key position SX6E-144S-0.8SH(20) 530-0303-5-20 144 Right, 4.8 BPCB mounting pattern SX6E-144S-0.8SH 60.6±0.03 23.2±0.03 32.8±0.03 1±0.03 CONNECTOR OUTER LINE 4.6±0.03 0.5±0.03 No.1 (2.5) No.143 No.2 No.144 1.4±0.03 Ø1.6±0.05 10.46±0.1 2±0.05 2±0.05 3.1±0.05 16.1±0.1 (2.1) 4.6±0.03 4±0.1 (4.8) 4.6±0.1 26±0.1 3.1±0.05 Ø1.1±0.05 NO COMPONENT AREA 0.8±0.03 7.5±0.1 3.5±0.1 30.3±0.03 30.3±0.03 32.8±0.03 20° 23.2±0.03 60.6±0.03 63±0.08 Module insertion direction D27 BRecommended Module Board Dimensions 67.6 ±0.15 63.6 ±0.15 3.8MAX 24.5 ±0.05 R2 ±0.05 2.5 ±0.02 3.3 ±0.05 4.6 ±0.03 B A 1 32.8 23.2 ±0.03 ±0.03 ±0.15 Mounting area 6 ±0.08 25.4 R3MIN Ø1.8 2.1 ±0.02 4.6 ±0.03 3.7 ±0.05 32.8 ±0.03 23.2 ±0.03 A (5 : 1) B (5 : 1) ±0.1 (2.55) R0.75 0.1+0.15 _0.05 4 (4.2) (4) 0.6 ±0.05 1.5 ±0.1 D28 4MIN 3.2MIN 20 ±0.1 Mounting area 0.8 ±0.03 ±0.1 BPrecausions for use Latch section Latch knob Side notch Latch claw Latch arm Polarizing key Key Procedures for Board Insertion 1. Adjust the socket polarizing key and the board key to the same direction. 2. Insert the board slantly. Moreover, lay the board in parallel to the opening at angle of 20° to 30° , and softly insert the board so as to hit the socket bottom. Stopping insertion halfway will result in improper insertion. Procedures for Board Insertion q 3. Applying the board side notch in parallel to the socket bottom so that the board position cannot be displaced, press the board side notch up, and fix the both socket edges to the latch area. Press the board side notch, and release the notch with a snap "click" tone, if the printed board passes through the latch claw head. 3. With this action, the board has been completely installed in the socket. At this time, pressing force is equivalent to the extent of turning on the electric product switch. If the stronger pressing force is needed, check whether the direction and depth to insert the board is adequate or not, and then re-push the board. w Procedures for Board Extraction 3. Apply the thumb nail to the latch knob at both socket edges. Forcibly widen the latch knobs to right and left ways, and release the latch. Then, draw the board out along the angle where the board is raised. Cautions ● The latch has strength enough to endure. However, if force is applied according to other operation methods instead of the Procedures for Handling Sockets, or if further force is given in the state where the module board is raised, products could be damaged. Be sure to observe the Procedures for Handling Sockets. e ● The board is designed in compliance with JEDEC "Small Outline DIMM (Dual Inline Memory Module". However, if other boards are used instead of the recommended module board, or if the mounting product is used for other devices than DRAM memory IC, troubles due to vibration or other failures could occur. If needed, consult the HRS company. ● The recommended module board pad or sharp angle edges could cause failure in contacts. Therefore, it is recommended to offset the tie-bar from the center line, set the internal pad, or remove sharp corners or burrs according to the recommended sizes. ● Don't provide the external contact surface of the module board with the Procedures for Board Extraction convex/concave and chamfer areas at both edges. Comply with the recommended sizes. ● When the board is mounted or housing is installed, if warpage or flexure has occurred, an excessive load could cause changes in the solder bonding area and the strength. Be sure to check individual points. ● If the board is used under environments where corrosive gas is apt to occur, consult the HRS company. D29 BRecommended Temperature Profile ● IR Reflow: Recommended Temperature Profile (Up to second reflow) ● Manual Soldering Manual soldering time: 3 seconds max. 240 235 220 Temperature Soldering iron temperature: 300±10ç 5 seconds max. 250 200 180 150 140 (ç) Preheating, 80 seconds ●Applicable Conditions Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 11 wt%) Test board Glass epoxy 110mm x 85mm x 1.6 mm Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount. D30 Soldering, 30 seconds (Time) Naturally exposed