MA-COM MA4AGSBP907

MA4AGSBP907
AlGaAs Solder Bump
Flip-Chip PIN Diode
RoHS Compliant
Features
♦
♦
♦
♦
♦
♦
♦
♦
♦
Rev. V4
Mounting Side with Solder Bumps
Low Series Resistance
Ultra Low Capacitance
Millimeter Wave Switching & Cutoff Frequency
2 Nanosecond Switching Speed
Can be Driven by a Buffered TTL
Silicon Nitride Passivation
Polyimide Scratch Protection
RoHS Compliant
Solderable Bump Die Attach
Description
M/A-COM's MA4AGSBP907 is an aluminum gallium
arsenide flip-chip PIN diode with solder bumps.
These devices are fabricated on OMCVD epitaxial
wafers using a process designed for high device
uniformity and extremely low parasitics. The diodes
exhibit an extremely low RC product, 0.1ps and 2nS
switching characteristics. The useable frequency
range is 100MHz to 40GHz. They are fully
passivated with silicon nitride and have an additional
layer of a polymer for scratch protection. The
protective coating prevents damage to the junction
and the anode airbridge during handling and circuit
attachment.
Applications
The 25fF capacitance of the MA4AGSBP907 allows
usage through millimeter frequencies for RF switches
and switched phase shifter applications. This diode is
designed for use in pulsed or CW applications,
where single digit nanosecond switching speed is
required. For surface mount assembly, the low
capacitance of the MA4AGSBP907 makes it ideal for
use in microwave multi-throw switch assemblies,
where the series capacitance of each “off” port
adversely loads the input and affects VSWR.
Absolute Maximum Ratings @ TAMB = 25°C
(unless otherwise specified)
Parameter
Absolute Maximum
Reverse Voltage
-50V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
Dissipated Power
( RF & DC )
50mW
C.W. Incident Power
+23 dBm
Mounting Temperature
+280°C for 10 seconds
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSBP907
AlGaAs Solder Bump
Flip-Chip PIN Diode
RoHS Compliant
Rev. V4
Electrical Specifications at TAMB = 25°C
1MHz & DC Specs.
Parameters and Test Conditions
Symbol
10GHz Reference Data
Units
Typ.
Max.
Typ.
1
Total Capacitance at –10V
Ct
pF
0.025
0.030
0.025
Series Resistance at +10mA
Rs
Ω
5.2
7.0
4.2
Forward Voltage at +10mA
VF
Volts
1.33
1.45
——-
VB
Volts
45
50
——-
TRISE
nS
——-
——-
2
3
Reverse Breakdown Voltage at 10μA
Switching Speed
4
10 to 90% RF Voltage
90 to 10% RF Voltage
4
TFALL
2
Notes:
1. Capacitance is determined by measuring single series diode isolation in a 50Ω line at 10GHz.
2. Forward series resistance is determined by measuring single series diode insertion loss in a 50Ω line at 10GHz.
3. Reverse current will not exceed 10μA at the maximum voltage rating.
4. Switching speed is measured between 10% to 90% or 90% to10% RF voltage for a single series mounted diode. driver delay
is not included.
INCHES
DIM
MM
MIN.
MAX.
MIN.
MAX.
A
0.026
0.027
0.6604
0.6858
B
0.0135
0.0145
0.3429
0.3683
C
0.0065
0.0075
0.1651
0.1905
D
0.0043
0.0053
0.1092
0.1346
E
0.0068
0.0073
0.1727
0.1854
F
0.0182
0.0192
0.4623
0.4877
Circuit Pad Layout
0.013”
0.012”
(2) PL
Note:
1. Yellow areas indicate solder bumps.
0.008”
(2) PL
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSBP907
AlGaAs Solder Bump
Flip-Chip PIN Diode
RoHS Compliant
Rev. V4
Electrical Specifications @ TAMB = 25°C (unless otherwise noted)
Single Series Diode Insertion Loss vs. Frequency
I. Loss @5mA
I. Loss @15mA
I. Loss @50mA
Insertion Loss (dB)
0.0
-0.2
-0.4
-0.6
-0.8
15
14
13
12
11
10
9
8
7
6
5
4
3
2
-1.0
Frequency (GHz)
Frequency ( G Hz )
Single Series Diode Return Loss vs. Frequency
R. Loss @5mA
R. Loss @15mA
R. Loss @50mA
-20.0
-22.0
Return Loss (dB)
-24.0
-26.0
-28.0
-30.0
-32.0
-34.0
-36.0
-38.0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
-40.0
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSBP907
AlGaAs Solder Bump
Flip-Chip PIN Diode
RoHS Compliant
Rev. V4
Electrical Specifications @ TA = 25°C (unless otherwise noted)
Single Series Diode Isolation vs. Frequency
Isolation @ -10V
Isolation @ 0V
Isolation @ -1V
-5.0
Isolation (dB)
-10.0
-15.0
-20.0
-25.0
-30.0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
-35.0
Frequency (GHz)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4AGSBP907
AlGaAs Solder Bump
Flip-Chip PIN Diode
RoHS Compliant
Rev. V4
Device Installation Guidelines
The following guidelines should be observed to avoid damaging the AlGaAs flip-chips.
Cleanliness
These devices should be handled in a clean environment.
Static Sensitivity
Aluminum gallium arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper
ESD techniques should be used when handling these devices. These devices are rated Class 0, (0-199V) per
HBM MIL-STD-883, method 3015.7 [C = 100pF±10%, R = 1.5kW±1%]. Even though tested die pass 50V ESD,
they must be handled in a static-free environment.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum
pencil.
Assembly Requirements using Tin / Lead Solder
The flip chip diode employs a 6μm thick, Sn/Pb, 63/37 solderable interface as part of the 50µm high solder
bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They
should be mounted onto silkscreened circuits using 63/37 Sn/Pb solder paste. A typical profile for a Sn/Pb
63/37 soldering process is provided in on the M/A-COM website at this address: http://www.macom.com/
Application%20Notes/pdf/M538.pdf.
Ordering Information
Part Number
Packaging
MA4AGSBP907
Die in Carrier
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 / Fax: 978.366.2266
is considering for development. Performance is based on target specifications, simulated results,
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
and/or prototype measurements. Commitment to develop is not guaranteed.
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.