VISHAY CGP30

CGP30, DGP30
Vishay General Semiconductor
Clamper/Damper Glass Passivated Rectifier
FEATURES
• Superectifier structure
• Cavity-free glass passivated junction
• Low forward voltage drop
• Typical IR less than 0.1 μA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
DO-201AD
TYPICAL APPLICATIONS
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
VRRM
1400 V, 1500 V
IFSM
100 A
IR
5.0 μA
VF
1.2 V
TJ max.
175 °C
For use in high voltage rectification of power supplies,
inverters, converters and freewheeling diodes specially
designed for clamping circuits, horizontal deflection
systems and damper applications.
MECHANICAL DATA
Case: DO-201AD, molded epoxy over glass body
Molding compound meets UL 94 V-0 flammability rating
Base P/N-E3 - RoHS compliant, commercial grade
Terminals: Matte tin plated leads, solderable
J-STD-002 and JESD 22-B102
E3 suffix meets JESD 201 class 1A whisker test
per
Polarity: Color band denotes cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
CGP30
DGP30
UNIT
Maximum repetitive peak reverse voltage
VRRM
1400
1500
V
Maximum RMS voltage
VRMS
980
1050
V
Maximum DC blocking voltage
VDC
1400
1500
V
Maximum average forward rectified current
0.375" (9.5 mm) lead lengths at TA = 50 °C
IF(AV)
3.0
A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
100
A
Maximum full load reverse current, full cycle average
0.375" (9.5 mm) lead length at TA = 70 °C
IR(AV)
200
μA
TJ, TSTG
- 65 to + 175
°C
Operating junction and storage temperature range
Document Number: 88569
Revision: 20-Jan-11
For technical questions within your region, please contact one of the following:
DiodesAmer[email protected], [email protected], [email protected]
www.vishay.com
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CGP30, DGP30
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Maximum instantaneous
forward voltage
IF = 3.0 A
Maximum reverse current
Rated VR
CGP30
VF (1)
TA = 25 °C
IF = 0.5 A, IR = 50 mA
Reverse recovery time
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
DGP30
UNIT
1.2
V
5.0
IR
TA = 100 °C
Maximum reverse recovery time
Typical junction capacitance
SYMBOL
μA
100
trr
15
20
Typical
μs
1.0
trr
Maximum
4.0 V, 1 MHz
μs
2.0
CJ
40
pF
Note
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
CGP30
RJA (1)
Typical thermal resistance
DGP30
20
UNIT
°C/W
Note
Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, with leads attached to heat sink
(1)
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
CGP30-E3/54
1.28
54
1400
13" diameter paper tape and reel
CGP30-E3/73
1.28
73
1000
Ammo pack packaging
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
1000
Peak Forward Surge Current (A)
Average Forward Rectified Current (A)
4.0
3.0
2.0
1.0
60 Hz
Resistive or Inductive Load
0.375" (9.5 mm) Lead Length
TA = 50 °C
8.3 ms Single Half Sine-Wave
(JEDEC Method)
100
10
0
0
25
50
75
100
125
150
175
1
10
100
Ambient Temperature (°C)
Number of Cycles at 60 Hz
Fig. 1 - Forward Current Derating Curve
Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 88569
Revision: 20-Jan-11
CGP30, DGP30
Vishay General Semiconductor
100
10
1
0.1
TJ = 25 °C
Pulse Width = 300 μs
1 % Duty Cycle
0.01
0.2
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
10
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1
100
10
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 5 - Typical Junction Capacitance
Instantaneous Reverse Current (μA)
10
TJ = 100 °C
1
0.1
TJ = 25 °C
0.01
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Fig. 4 - Typical Reverse Characteristics
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-201AD
1.0 (25.4)
MIN.
0.210 (5.3)
0.190 (4.8)
DIA.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
0.052 (1.32)
0.048 (1.22)
DIA.
Document Number: 88569
Revision: 20-Jan-11
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
3
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Vishay
Disclaimer
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Document Number: 91000
Revision: 11-Mar-11
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