TOSHIBA TLP714F

TLP714F
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP714F
1. Applications
•
Intelligent Power Module Signal Isolation
•
Factory Automation (FA)
•
Transistor Inverters
2. General
The TLP714F is a photocoupler in a 6-pin SDIP package that consists of a GaAℓAs infrared light-emitting diode
(LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed
performance and specifications at temperatures up to 125.
The TLP714F is physically smaller than the one in an 8-pin DIP package and compliant with international safety
standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require
safety standard certification. An internal noise shield provides a guaranteed commonmode transient immunity
of 20 kV/µs. The TLP714F guarantees minimum and maximum of propagation delay time, pulse width distortion.
Therefore it is suitable for isolation interface between IPM and control IC circuits in motor control application.
Leads of the TLP714F is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and
electrical characteristics are the same as in the TLP714.
3. Features
(1)
Inverter logic type (open collector output)
(2)
Package: SDIP6
(3)
Operating temperature: -40 to 125
(4)
Supply voltage: -0.5 to 30 V
(5)
Threshold input current: 5.0 mA (max)
(6)
Supply current: 1.3 mA (max)
(7)
Propagation delay time: tpHL = 400 ns (max), tpLH = 550 ns (max)
(8)
Pulse width distortion: |tpHL - tpLH| = 400 ns (max)
(9)
Common-mode transient immunity: ±20 kV/µs (min)
(10) Isolation voltage: 5000 Vrms (min)
(11) Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
VDE-approved: Option (D4) EN60747-5-2 (Note)
Note: When an EN60747-5-2 approved type is needed, please designate the Option (D4).
4. Packaging and Pin Configuration
1: Anode
2: N.C.
3: Cathode
4: GND
5: VO (Output)
6: VCC
11-5J101S
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TLP714F
5. Internal Circuit
Fig. 5.1 Internal Circuit
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
6.2. Mechanical Parameters
7.62-mm Pitch
TLP714
10.16-mm Pitch
TLP714F
Unit
Creepage distances
7.0 (min)
8.0 (min)
mm
Clearance distances
7.0 (min)
8.0 (min)
Internal isolation thickness
0.4 (min)
0.4 (min)
Characteristics
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)
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25
25
Characteristics
LED
Symbol
Input forward current
Note
Rating
Unit
IF
20
mA
(Ta ≥ 116)
∆IF/∆Ta
-0.6
mA/
50
mA
(Ta ≥ 110)
∆IFP/∆Ta
-1.25
mA/
PD
40
mW
∆PD/∆Ta
-1.0
mW/
VR
5
V
IO
15
mA
Output voltage
VO
-0.5 to 30
V
Supply voltage
VCC
-0.5 to 30
Output power dissipation
PO
80
mW
∆PO/∆Ta
-2.0
mW/
Topr
-40 to 125

Input forward current derating
Input forward current (pulsed)
Input forward current derating
(pulsed)
IFP
Input power dissipation
Input power dissipation
derating
(Ta ≥ 110)
Input reverse voltage
Detector Output current
Output power dissipation
derating
(Ta ≥ 110)
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(Note 1)
Tstg
-55 to 150
(10 s)
Tsol
260
AC, 1 min, R.H. ≤ 60%
BVS
(Note 2)
5000
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 ms, duty = 50%
Note 2: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
IF(ON)
(Note 1)
7.5

15
mA
Input off-state voltage
VF(OFF)
V
0

0.8
Supply voltage
VCC
(Note 2)
4.5

30
Operating temperature
Topr
(Note 2)
-40

125

Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.
Note 2: Denotes the operating range, not the recommended operating condition.
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9. Electrical Characteristics (Note)
(Unless otherwise specified, Ta = -40 to 125
, VCC = 4.5 to 30 V)
125
Characteristics
Symbol
Input forward voltage
Input forward voltage
temperature coefficient
Note
Test Circuit
Test Condition
Min
Typ.
Max
Unit
VF

IF = 10 mA, Ta = 25
1.45
1.55
1.7
V
∆VF/∆Ta

IF = 10 mA

-2.0

mV/
IR

VR = 5 V, Ta = 25


10
µA

V = 0 V, f = 1 MHz
Input reverse current
Input capacitance
Ct

60

pF
High-level output current
IOH
Fig. 12.1.1 VF = 0.8 V, VO < VCC


50
µA
Low-level output voltage
VOL
Fig. 12.1.2 IF = 10 mA, IO = 2.4 mA

0.2
0.6
V
High-level supply current
ICCH
Fig. 12.1.3 IF = 0 mA

1.0
1.3
mA
Low-level supply current
ICCL
Fig. 12.1.4 IF = 10 mA

1.0
1.3
Fig. 12.1.5 IF = 10 mA, VO = 0.6 V
Output current
4.0


Threshold input current (H/L)
IFHL

IO = 0.75 mA, VO < 0.8 V

1.0
5.0
Threshold input voltage (L/H)
VFLH

IO = 0.75 mA, VO > 2.0 V
0.8


V
Min
Typ.
Max
Unit

0.8

pF
1×1012
1014

Ω
Vrms
Note:
IO
All typical values are at Ta = 25.
)
10. Isolation Characteristics (Unless otherwise specified, Ta = 25
25
Characteristics
Symbol
Note
Test Conditions
Total capacitance (input to output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60%
Isolation voltage
BVS
(Note 1) AC, 1 min
5000


AC, 1 s in oil

10000

DC, 1 min in oil

10000

Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
11. Switching Characteristics (Note)
, VCC = 15 V)
(Unless otherwise specified, Ta = -40 to 125
125
Characteristics
Propagation delay time (H/L)
Propagation delay time (L/H)
Pulse width distortion
Symbol
Note
tpHL
(Note 1)
tpLH
Test
Circuit
Fig.
12.1.6
(Note 1)
|tpHLtpLH|
(Note 1)
Propagation delay skew
(device to device)
tpsk
(Note 1),
(Note 2)
Common-mode transient
immunity at output high
CMH
Common-mode transient
immunity at output low
CML
Fig.
12.1.7
Test Condition
Min
Typ.
Max
Unit
IF = 0 → 10 mA, RL = 20 kΩ,
CL = 100 pF
30
150
400
ns
IF = 0 → 10 mA, RL = 20 kΩ,
CL = 10 pF

70

IF = 10 → 0 mA, RL = 20 kΩ,
CL = 100 pF
150
350
550
IF = 10 → 0 mA, RL = 20 kΩ,
CL = 10 pF

110

IF = 10 mA, RL = 20 kΩ,
CL = 100 pF


400
-50

450
VCM = 1500 Vp-p, IF = 0 mA,
RL = 20 kΩ, Ta = 25,
CL = 10 pF or 100 pF
±20
±25

VCM = 1500 Vp-p, IF = 10 mA,
RL = 20 kΩ, Ta = 25,
CL = 10 pF or 100 pF
±20
±25

kV/µs
Note: All typical values are at Ta = 25.
Note 1: Input signal (f = 10 kHz, duty = 10%, input current tr = tf = 5 ns or less )
Note 2: The propagation delay skew, tpsk, is defined as the propagation delay time of the largest or smallest tpLH minus
the largest or smallest tpHL of multiple samples. Evaluations of these samples are conducted under identical
test conditions (supply voltage, input current, temperature, etc).
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TLP714F
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 IOH Test Circuit
Fig. 12.1.2 VOL Test Circuit
Fig. 12.1.3 ICCH Test Circuit
Fig. 12.1.4 ICCL Test Circuit
Fig. 12.1.5 IO Test Circuit
Fig. 12.1.6 Switching Time Test Circuit and Waveform
Fig. 12.1.7 Common-Mode Transient Immunity and Waveform
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TLP714F
12.2. Characteristics Curves (Note)
Fig. 12.2.1 IF - VF
Fig. 12.2.2 IF - Ta
Fig. 12.2.3 IFHL - Ta
Fig. 12.2.4 IOH - Ta
Fig. 12.2.5 ICCL - Ta
Fig. 12.2.6 ICCH - Ta
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TLP714F
Fig. 12.2.7 IO - Ta
Fig. 12.2.8 Normalized IO - Ta
Fig. 12.2.9 VOL - Ta
Fig. 12.2.10 tpLH,tpHL,|tpHL-tpLH| - Ta
Fig. 12.2.11 tpLH,tpHL,|tpHL-tpLH| - IF
Fig. 12.2.12 tpLH,tpHL,|tpHL-tpLH| - VCC
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TLP714F
Fig. 12.2.13 tpLH,tpHL,|tpHL-tpLH| - RL
Fig. 12.2.14 tpLH,tpHL,|tpHL-tpLH| - RL
Fig. 12.2.15 tpLH,tpHL,|tpHL-tpLH| - CL
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP714F
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used
When Lead(Pb)-free Solder Is Used
•
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP714F
14. Land Pattern Dimensions for Reference Only
Fig. 14.1 7.62-mm Pitch (unit: mm)
Fig. 14.2 10.16-mm Pitch (unit: mm)
15. Marking
Fig. 15.1 Marking
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TLP714F
16. EN60747-5-2 Option (D4) Specification
•
Part number: TLP714, TLP714F (Note)
•
The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP714(D4-TP, F)
D4: EN60747 option
TP: Tape type
F: [[G]]/RoHS COMPATIBLE (Note 1)
Note:
Use TOSHIBA standard type number for safety standard application.
e.g., TLP714(D4-TP,F) → TLP714
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the
product's
RoHS compatibility.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 16.1 EN60747 Isolation Characteristics
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TLP714F
Fig. 16.2 Insulation Related Specifications (Note)
Note:
Note:
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall
take suitable measures.
This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking Example (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.
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TLP714F
Fig. 16.4 Measurement Procedure
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TLP714F
Package Dimensions
Unit: mm
Weight: 0.26 g (typ.)
Package Name(s)
TOSHIBA: 11-5J101S
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TLP714F
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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