SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 EMC OPTIMIZED CAN TRANSCEIVER Check for Samples :SN65HVD1050-EP FEATURES 1 • 2 • • • • • • • • • • • Controlled Baseline – One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Improved Replacement for the TJA1050 High Electromagnetic Immunity (EMI) Very Low Electromagnetic Emissions (EME) Meets or Exceeds the Requirements of ISO 11898-2 Bus-Fault Protection of –27 V to 40 V Dominant Time-Out Function Thermal Shutdown Protection Power-Up/Down Glitch-Free Bus Inputs and Outputs – High Input Impedance With Low VCC – Monotonic Outputs During Power Cycling APPLICATIONS • • • • • (1) Industrial Automation – DeviceNET™ Data Buses (Vendor ID #806) SAE J2284 High-Speed CAN for Automotive Applications SAE J1939 Standard Data Bus Interface ISO 11783 Standard Data Bus Interface NMEA 2000 Standard Data Bus Interface Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. D PACKAGE (TOP VIEW) TXD GND VCC RXD 1 8 2 7 3 6 4 5 S CANH CANL Vref DESCRIPTION/ ORDERING INFORMATION The SN65HVD1050 meets or exceeds the specifications of the ISO 11898 standard for use in applications employing a controller area network (CAN). The device is also qualified for use in automotive applications in accordance with AEC-Q100. (2) As a CAN transceiver, this device provides differential transmit capability to the bus and differential receive capability to a CAN controller at signaling rates up to 1 megabit per second (Mbps) (3). Designed for operation in especially harsh environments, the SN65HVD1050 features cross-wire, overvoltage, and loss of ground protection from –27 V to 40 V, overtemperature protection, a –12-V to 12-V common-mode range, and withstands voltage transients from –200 V to 200 V, according to ISO 7637. Pin 8 provides for two different modes of operation: high-speed or silent mode. The high-speed mode of operation is selected by connecting S (pin 8) to ground. (2) (3) The device is available with Q100 qualification as the SN65HVD1050Q (Product Preview). The signaling rate of a line is the number of voltage transitions that are made, per second, expressed in the units bps (bits per second). blk blk ORDERING INFORMATION PART NUMBER PACKAGE MARKED AS ORDERING NUMBER SN65HVD1050M SOIC-8 1050EP SN65HVD1050MDREP (reel) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DeviceNET is a trademark of Open Devicenet Vendors Association, Inc. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2009, Texas Instruments Incorporated SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION/ORDERING INFORMATION (CONTINUED) If a high logic level is applied to the S pin of the SN65HVD1050, the device enters a listen-only silent mode, during which the driver is switched off while the receiver remains fully functional. In silent mode, all bus activity is passed by the receiver output to the local protocol controller. When data transmission is required, the local protocol controller reverses this low-current silent mode by placing a logic low on the S pin to resume full operation. A dominant-time-out circuit in the SN65HVD1050 prevents the driver from blocking network communication with a hardware or software failure. The time-out circuit is triggered by a falling edge on TXD (pin 1). If no rising edge is seen before the time-out constant of the circuit expires, the driver is disabled. The circuit is then reset by the next rising edge on TXD. Vref (pin 5) is available as a VCC/2 voltage reference. The SN65HVD1050M is characterized for operation from –55°C to 125°C. FUNCTION BLOCK DIAGRAM 8 Silent Mode VCC S VCC 3 Temperature Protection Dominant Time-Out 30 mA VCC/2 5 Vref 30 mA TXD 7 1 Driver 6 CANH CANL 2 RXD 4 Absolute Maximum Ratings (1) UNIT VCC Supply voltage (2) –0.3 V to 7 V Voltage range at any bus terminal (CANH, CANL, Vref) IO Receiver output current VI Voltage input, transient pulse VI Voltage input range (TXD, S) TJ Junction temperature (1) (2) (3) 2 –27 V to 40 V 20 mA (3) (CANH, CANL) –200 V to 200 V –0.5 V to 6 V –55°C to 170°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. Tested in accordance with ISO 7637, test pulses 1, 2, 3a, 3b, 5, 6, and 7 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 Electrostatic Discharge Protection over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS Human-Body Model (2) Electrostatic discharge (1) Charged-Device Model (3) UNIT Bus terminals and GND ±8 kV All pins ±4 kV All pins ±1.5 kV Machine Model (1) (2) (3) ±200 V All typical values at 25°C Tested in accordance with JEDEC Standard 22, Test Method A114-A Tested in accordance with JEDEC Standard 22, Test Method C101 Recommended Operating Conditions MIN MAX UNIT VCC Supply voltage 4.75 5.25 V VI or VIC Voltage at any bus terminal (separately or common mode) –12 12 V VIH High-level input voltage TXD, S 2 5.25 V VIL Low-level input voltage TXD, S 0 0.8 V VID Differential input voltage –6 6 V IOH High-level output current IOL Low-level output current TJ Junction temperature Driver –70 Receiver mA –2 Driver 70 Receiver 2 See Thermal Characteristics table, 1-Mbps minimum signaling rate with RL = 54 Ω 150 mA °C Supply Current over recommended operating conditions (unless otherwise noted) PARAMETER ICC 5-V supply current TEST CONDITIONS Silent mode S at VCC, VI = VCC Dominant VI = 0 V, 60-Ω load, S at 0 V Recessive VI = VCC, No load, S at 0 V MIN TYP MAX 6 10 50 70 6 10 UNIT mA Device Switching Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER td(LOOP1) td(LOOP2) TEST CONDITIONS Total loop delay, driver input to receiver output, recessive to dominant Total loop delay, driver input to receiver output, dominant to recessive MIN MAX 90 230 90 230 S at 0 V, See Figure 9 Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP UNIT ns Submit Documentation Feedback 3 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com Driver Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER VO(D) Bus output voltage (dominant) VO(R) Bus output voltage (recessive) VOD(D) TEST CONDITIONS CANH CANL Differential output voltage (recessive) TYP MAX 2.9 3.4 4.5 (1) 0.8 VI = 3 V, S at 0 V, RL = 60 Ω, See Figure 1 and Figure 2 Differential output voltage (dominant) VOD(R) VI = 0 V, S at 0 V, RL = 60 Ω, See Figure 1 and Figure 2 MIN 2 2.3 3 VI = 0 V, RL = 60 Ω, S at 0 V, See Figure 1, Figure 2, and Figure 3 1.5 3 VI = 0 V, RL = 45 Ω, S at 0 V, See Figure 1, Figure 2, and Figure 3 1.4 3 VI = 3 V, S at 0 V, See Figure 1 and Figure 2 –0.012 0.012 VI = 3 V, S at 0 V, No load –0.5 0.05 ΔVOC(ss) Change in steady-state common-mode output voltage S at 0 V, See Figure 8 IIH High-level input current, TXD input VI at VCC –2 2 IIL Low-level input current, TXD input VI at 0 V –50 –10 IO(off) Power-off TXD output current VCC at 0 V, TXD at 5 V 2 (1) 3 V mV μA 1 –105 VCANH = 12 V, CANL open, SeeFigure 11 VCANL = –12 V, CANH open, See Figure 11 –72 0.36 –1 VCANL = 12 V, CANH open, See Figure 11 Output capacitance 2.3 V 30 VCANH = –12 V, CANL open, See Figure 11 CO V V Steady-state common-mode output voltage Short-circuit steady-state output current V 1.5 VOC(ss) IOS(ss) UNIT 1 mA –0.5 71 105 MIN TYP MAX 25 65 120 25 45 120 See receiver input capacitance All typical values are at 25°C, with a 5-V supply. Driver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tr Differential output signal rise time tf Differential output signal fall time ten Enable time from silent mode to dominant See Figure 7 t(dom) Dominant time-out ↓VI, See Figure 10 4 Submit Documentation Feedback S at 0 V, See Figure 4 25 S at 0 V, See Figure 4 450 ns ns 50 300 UNIT 1 μs 700 μs Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 Receiver Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN (1) MAX UNIT 800 900 mV TYP VIT+ Positive-going input threshold voltage S at 0 V, See Table 3 VIT– Negative-going input threshold voltage S at 0 V, See Table 3 Vhys Hysteresis voltage (VIT+ – VIT–) VOH High-level output voltage IO = –2 mA, See Figure 6 VOL Low-level output voltage IO = 2 mA, See Figure 6 0.2 0.4 V II(off) Power-off bus input current CANH or CANL = 5 V, Other pin at 0 V, VCC at 0 V, TXD at 0 V 165 250 μA IO(off) Power-off RXD leakage current VCC at 0 V, RXD at 5 V 20 μA CI Input capacitance to ground (CANH or CANL) TXD at 3 V, VI = 0.4 sin (4E6πt) + 2.5 V CID Differential input capacitance TXD at 3 V, VI = 0.4 sin (4E6πt) RID Differential input resistance TXD at 3 V, S at 0 V 30 80 kΩ RIN Input resistance (CANH or CANL) TXD at 3 V, S at 0 V 15 30 40 kΩ RI(m) Input resistance matching [1 – (RIN (CANH) / RIN (CANL))] ×100% VO(CANH) = VO(CANL) –3% 0% 3% MIN TYP MAX 60 100 130 45 70 130 (1) 500 650 mV 100 125 mV 4 4.6 V 13 pF 5 pF All typical values are at 25 C with a 5-V supply. Receiver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tr Output signal rise time tf Output signal fall time S at 0 V or VCC, See Figure 6 8 S at 0 V or VCC, See Figure 6 UNIT ns ns 8 S-Pin Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS IIH High-level input current S at 2 V IIL Low-level input current S at 0.8 V MIN TYP MAX UNIT 20 40 70 μA 5 20 30 μA Vref-PIN Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VO TEST CONDITIONS –50 μA < IO < 50 μA Reference output voltage MIN 0.4 VCC TYP MAX 0.5 VCC 0.6 VCC UNIT V Thermal Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS Low-K thermal resistance (1) MIN TYP MAX 211 UNIT θJA Junction to Air θJB Junction-to-board thermal resistance 53 °C/W θJC Junction-to-case thermal resistance 79 °C/W (1) High-K thermal resistance 131 °C/W Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface-mount packages Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 5 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com Thermal Characteristics (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER PD TEST CONDITIONS MIN VCC = 5 V, TJ = 27°C, RL = 60 Ω, S at 0 V, Input to TXD a 500-kHz, 50% duty-cycle square wave, CL at RXD = 15 pF Average power dissipation TYP MAX UNIT 112 mW VCC = 5.5 V, Tj = 130°C, RL = 45 Ω, S at 0 V, Input to TXD a 500-kHz, 50% duty-cycle square wave, CL at RXD = 15 pF 170 Thermal shutdown temperature 190 °C FUNCTION TABLES Table 1. DRIVER INPUTS TXD (1) (1) OUTPUTS S (1) CANH (1) BUS STATE (1) CANL L L or Open H L Dominant H X Z Z Recessive Open X Z Z Recessive X H Z Z Recessive H = high level, L = low level, X = irrelevant, Z = high impedance Table 2. RECEIVER DIFFERENTIAL INPUTS VID = V(CANH) – V(CANL) (1) 6 OUTPUT RXD (1) BUS STATE VID ≥ 0.9 V L 0.5 V < VID < 0.9 V ? ? VID ≤ 0.5 V H Recessive Open H Recessive Dominant H = high level, L = low level, X = irrelevant, ? = indeterminate Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION IO(CANH) VO (CANH) TXD II VOD RL VO(CANH) + VO(CANL) 2 I I(S) S VI VOC I O(CANL) + VI(S) _ V O(CANL) Figure 1. Driver Voltage, Current, and Test Definition Dominant 3.5 V Recessive VO(CANH) 2.5 V VO(CANL) 1.5 V Figure 2. Bus Logic State Voltage Definitions CANH 0V TXD VOD 330 W +1% RL + _ S CANL −2 V 3 VTEST 3 7 V 330 W +1% Figure 3. Driver VOD Test Circuit CANH VCC VI TXD VO tPLH CL = 100 pF (see Note B) VO S VCC/2 0V RL = 60 W ±1% VI (See Note A) VCC/2 tPHL 10% CANL VO(D) 90% 0.9 V tr tf 0.5 V VO(R) Figure 4. Driver Test Circuit and Voltage Waveforms Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 7 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) CANH RXD VI (CANH) IO VID V + VI (CANL) VIC = I (CANH) 2 VI (CANL) VO CANL Figure 5. Receiver Voltage and Current Definitions 3.5 V CANH VI V RXD 1.5 V tPLH CANL 1.5 V CL = 15 pF + 20% (See Note B) S 2.4 V IO I (See Note A) 2V VO tPHL 90% 0.7 VCC VO 10% VOH 0.3 VCC VOL tf tr A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 125 kHz, 50% duty cycle, tr ≤ 6 ns, tf ≤ 6 ns, ZO = 50 Ω. B. CL includes instrumentation and fixture capacitance within ±20%. Figure 6. Receiver Test Circuit and Voltage Waveforms Table 3. Differential Input Voltage Threshold Test INPUT 8 OUTPUT VCANH VCANL |VID| –11.1 V –12 V 900 mV L 12 V 11.1 V 900 mV L –6 V –12 V 6V L 12 V 6V 6V L –11.5 V –12 V 500 mV H 12 V 11.5 V 500 mV H –12 V –6 V 6V H 6V 12 V 6V H Open Open X H Submit Documentation Feedback R VOL VOH Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 DUT CANH TXD 0V CL S VI 60 W +1% 0V VOH CANL NOTE: CL = 100 pF includes instrumentation and fixture capacitance within ±20% RXD + VO _ VCC 50 % VI 15 pF +20% 50 % VO VOL ten NOTE: All VI input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 6 ns, Pulse Repetition Rate (PRR) = 25 kHz, 50% duty cycle Figure 7. ten Test Circuit and Waveforms 27 W +1% VI DVOC(SS) CANH TXD VOC CANL S 27 W +1% 47 nF V = VO(CANH) + VO(CANL) +20% OC 2 NOTE: All VI input pulses are from 0 V to VCC and supplied by a generator having the following characteristics: tr or tf ≤ 6 ns. Pulse Repetition Rate (PRR) = 125 kHz, 50% duty cycle. Figure 8. Common-Mode Output Voltage Test and Waveform DUT VCC CANH VI TXD S CL 60 W ±1% TXD Input 0V + tloop1 tloop2 VOH CANL RXD Output RXD 50% 50% 50% NOTE: CL = 100 pF includes instrumentation and fixture capacitance within ±20% VOL VO _ 15 pF ±20% A. All VI input pulses are from 0 V to VCC and supplied by a generator having the following characteristics: tr or tf ≤ 6 ns. Pulse Repetition Rate (PRR) = 125 kHz, 50% duty cycle. Figure 9. t(LOOP) Test Circuit and Waveform Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 9 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com VCC VI TXD RL = 60 W +1% VI (See Note A) S 0V VOD CL (See Note B) VOD(D) VOD 900 mV 500 mV CANH 0V tdom A. All VI input pulses are from 0 V to VCC and supplied by a generator having the following characteristics: tr or tf ≤ 6 ns. Pulse Repetition Rate (PRR) = 500 Hz, 50% duty cycle. B. CL = 100 pF includes instrumentation and fixture capacitance within ±20%. Figure 10. Dominant Time-Out Test Circuit and Waveforms | IOS(SS) | | IOS(P) | IOS 200 ms CANH TXD 0V 0 V or VCC 12 V S CANL VIN −12 V or 12 V Vin 0V or 0V 10 ms Vin −12 V Figure 11. Driver Short-Circuit Current Test and Waveforms 10 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 DEVICE INFORMATION Table 4. Parametric Cross-Reference With the TJA1050 TJA1050 (1) PARAMETER HVD1050 Transmitter Section VIH High-level input voltage Recommended VIH VIL Low-level input voltage Recommended VIL IIH High-level input current Driver IIH IIL Low-level input current Driver IIL ILI Power-off bus input current Receiver II(off) IO(SC) Short-circuit output current Driver IOS(SS) VO(dom) Dominant output voltage Driver VO(D) Vi(dif)(th) Differential input voltage Receiver VIT and recommended VID Vi(dif)(hys) Differential input hysteresis Receiver Vhys VO(reces) Recessive output voltage Driver VO(R) VO(dif)(bus) Differential bus voltage Driver VOD(D) and VOD(R) Ri(cm) CANH, CANL input resistance Receiver RIN Ri(dif) Differential input resistance Receiver RID Ri(cm) (m) Input resistance matching Receiver RI (m) CI Input capacitance to ground Receiver CI Ci(dif) Differential input capacitance Receiver CID Bus Section Receiver Section IOH High-level output current Recommended IOH IOL Low-level output current Recommended IOL Vref-Pin Section Vref Reference output voltage VO td(TXD-BUSon) Delay TXD to bus active Driver tPLH td(TXD-BUSoff) Delay TXD to bus inactive Driver tPHL td(BUSon-RXD) Delay bus active to RXD Receiver tPHL td(BUSoff-RXD) Delay bus inactive to RXD Receiver tPLH td(TXD-BUSon) + td(BUSon-RXD) Device tLOOP1 td(TXD-BUSoff) + td(BUSoff-RXD) Device tLOOP2 Dominant time-out Driver t(dom) VIH High-level input voltage Recommended VIH VIL Low-level input voltage Recommended VIL IIH High-level input current IIH IIL Low-level input current IIL Timing Section tdom(TXD) S-Pin Section (1) From TJA1050 Product Specification, Philips Semiconductors, 2002 May 16 Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 11 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com Equivalent Input and Output Schematic Diagrams TXD Input Vcc RXD Output Vcc 25 W 4.3 kW Output Input 6V 6V CANL Input CANH Input Vcc Vcc 10 kW 10 kW 20 kW 20 kW Input Input 10 kW 40 V 10 kW 40 V CANH and CANL Outputs S Input Vcc Vcc CANH 4.3 kW Input 6V CANL 40 kW 40 V 40 V Vref Output Vcc 2 kW Output 2 kW 40 V 12 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 TYPICAL CHARACTERISTICS 150 145 140 DOMINANT-TO-RECESSIVE LOOP TIME vs FREE-AIR TEMPERATURE (Across VCC) t LOOP2 − Dominant-to-Recessive Loop Time − ns t LOOP1− Recessive-to-Dominant Loop Time − ns RECESSIVE-TO-DOMINANT LOOP TIME vs FREE-AIR TEMPERATURE (Across VCC) S at 0 V RL = 60 W CL = 100 pF Air Flow at 7 cf/m TXD Input is a 125-kHz 50% Duty Cycle Pulse VCC = 4.75 V 135 130 VCC = 5 V 125 VCC = 5.25 V 120 −40 0 25 70 TA − Free-Air Temperature − °C 160 S at 0 V RL = 60 W CL = 100 pF Air Flow at 7 cf/m TXD Input is a 125-kHz 50% Duty Cycle Pulse VCC = 5.25 V 155 VCC = 5 V 150 145 VCC = 4.75 V 140 −40 0 25 70 125 TA − Free-Air Temperature − °C Figure 12. Figure 13. SUPPLY CURRENT (RMS) vs SIGNALING RATE DRIVER LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 90 TA = 25°C VCC = 5 V S at 0 V RL = 60 W RXD = 15 pF I OL − Low-Level Output Current − mA I CC − RMS Supply Current − mA 40 165 125 50 45 170 35 30 25 20 15 10 5 80 70 60 50 40 30 20 TA = 25°C VCC = 5 V S at 0 V TXD Input is a 125-kHz 1% Duty Cycle Pulse 10 0 0 200 400 500 600 800 Signaling Rate − kbps 1000 −10 0 1 2 3 4 5 VO(CANL) − Low-Level Output Voltage – V Figure 14. Figure 15. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 13 SN65HVD1050-EP SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C VCC = 5 V S at 0 V TXD Input is a 125-kHz 1% Duty Cycle Pulse -70 -60 -50 -40 -30 -20 -10 -0 1 S at 0 V RL = 60 W Air Flow at 7 cf/m TXD Input is a 125-kHz 1% Duty Cycle Pulse 0.5 0 25 70 TA − Free-Air Temperature − °C Figure 16. Figure 17. DRIVER OUTPUT CURRENT vs SUPPLY VOLTAGE RECEIVER OUTPUT VOLTAGE vs DIFFERENTIAL INPUT VOLTAGE 125 6 TA = 25°C VCC = 5 V S at 0 V RL = 60 W TXD Input is a 125-kHz 1% Duty Cycle Pulse VIT+ VIT− 5 30 25 20 15 10 VCM = 12 V 4 VCM = 2.5 V 3 VCM = −12 V 2 TA = 255C, VCC = 5 V, S at 0 V, RXD = 15 pF 1 0.60 0.65 0.70 5.25 0.75 3.5 4 4.5 5 VCC − Supply Voltage − V 0.80 3 0.85 2 0.85 1 −1 1 0.80 0 0.75 0 5 0.70 35 VCC = 4.75 V 1.5 0.65 40 VCC = 5.25 V 2 −40 VO − Receiver Output Voltage − V I O − Differential Driver Output Current − mA 45 VCC = 5 V 2.5 0 0 1 2 3 4 5 VO(CANH) − High-Level Output Voltage − V 50 3 0.60 I OH − High-Level Output Current − mA -80 DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE (Across VCC) Dominant Driver Differential Output Voltage − V DRIVER HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT VID − Differential Input Voltage − V Figure 18. 14 Submit Documentation Feedback Figure 19. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP SN65HVD1050-EP www.ti.com SLLS772A – DECEMBER 2006 – REVISED OCTOBER 2009 TYPICAL CHARACTERISTICS (continued) TYPICAL ELECTROMAGNETIC EMISSIONS UP TO 50 MHZ (Peak Amplitude) TYPICAL ELECTROMAGNETIC IMMUNITY PERFORMANCE 80 dBm DB mV 60 40 20 0 0.1 Figure 20. 1 10 f − Frequency − MHz 100 1000 Figure 21. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s) :SN65HVD1050-EP Submit Documentation Feedback 15 PACKAGE OPTION ADDENDUM www.ti.com 22-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65HVD1050MDREP ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65HVD1050MDREPG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/07608-01XE ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN65HVD1050-EP : SN65HVD1050 • Catalog: • Automotive: SN65HVD1050-Q1 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65HVD1050MDREP Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65HVD1050MDREP SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated