DESD3V3S1BLP3 A D V A N C E IN F O R M A T IO N Features

DESD3V3S1BLP3
LOW CAPACITANCE BIDIRECTIONAL TVS DIODE
ADVANCE INFORMATION
Features
•
Mechanical Data
Ultra-Small, Low Profile Leadless Surface Mount Package (0.6 x
0.3 x 0.3mm)
•
Case: X3-DFN0603-2
•
Case Material: Molded Plastic, “Green” Molding Compound.
•
Provides ESD Protection per IEC 61000-4-2 Standard:
Air – ±30kV, Contact – ±25kV
•
•
1 Channel of ESD Protection
•
•
Low Channel Input Capacitance
•
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish − Matte Tin over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
•
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
Weight: 0.0002 grams (Approximate)
X3-DFN0603-2
Top View
Bottom View
Device Schematic
Ordering Information (Note 4)
Product
DESD3V3S1BLP3-7
Notes:
Compliance
Standard
Marking
S
Reel size(inches)
7
Tape width(mm)
8
Quantity per reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
X3-DFN0603-2
S = Product Type Marking Code
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
DESD3V3S1BLP3
Document number: DS36098 Rev. 4 – 2
Symbol
PPP
IPP
VESD_Contact
VESD_Air
Value
35
5
±25
Unit
W
A
kV
Conditions
8/20µs, Per Fig. 3
8/20µs, Per Fig. 3
IEC 61000-4-2 Standard
±30
kV
IEC 61000-4-2 Standard
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DESD3V3S1BLP3
Characteristic
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Symbol
VRWM
IRM
Clamping Voltage, Positive Transients
VCL
Breakdown Voltage
Differential Resistance
Channel Input Capacitance
VBR
RDIF
CT
Notes:
Min
—
—
Typ
—
10
4.5
5.8
—
0.3
10
—
—
3.8
—
—
Max
3.3
100
5.4
7.0
6.5
—
13
Unit
V
nA
V
V
Ω
pF
Test Conditions
—
VRWM = 3.3V
IPP = 1A, tp = 8/20µS
IPP = 5A, tp = 8/20µS
IR = 1mA
IR = 1A
VR = 0V, f = 1MHz
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website
at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
100
11
10.5
CT, TOTAL CAPACITANCE (pF)
PEAK PULSE DERATING % OF P EAK
POWER OR CURRENT
ADVANCE INFORMATION
Thermal Characteristics
75
50
25
f = 1MHz
10
9.5
9
8.5
8
7.5
7
6.5
6
5.5
0
0
25
50
75
100 125 150 175
TA AMBIENT TEMPERATURE ( °C)
Figure 1 Pulse Derating Curve
DESD3V3S1BLP3
Document number: DS36098 Rev. 4 – 2
200
5
0
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0.5
2
2.5
1
1.5
V R, REVERSE VOLTAGE (V)
Figure 2 Typical Capacitance
3
3.3
March 2015
© Diodes Incorporated
ADVANCE INFORMATION
DESD3V3S1BLP3
10
120
8
100
IESD , DISCHARGE CURRENT (%)
VC (V)
Rise time = 0.7ns to 1ns
6
4
2
2
4
6
60
53
40
27
20
0
-10
0
0
80
8
0
10
20
30 40
50
60 70
80 90 100
TIME (ns)
Figure 6 ESD Discharge Current Wave Form
IEC 6100-4-2 (330 Ω/150pF)
IP P (A)
Figure 5 Typical Peak Clamping Voltage V
C vs.
Peak Pulse Current IP P
45
20
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 +8kV Contact Discharge
40
15
35
10
Positive
30
V C-ESD (V)
VC-ESD (V)
5
0
-5
25
20
15
10
-10
5
-15
Negative
0
-20
-5
0
10
20
30
VESD (kV)
Figure 7 Typical Clamping Voltage vs.
Contact Discharge Voltage
DESD3V3S1BLP3
Document number: DS36098 Rev. 4 – 2
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0
20
40
60
80 100 120 140 160 180
t (ns)
Figure 8 Typical Clamping Performance
@ 8kV Contact Discharge
March 2015
© Diodes Incorporated
DESD3V3S1BLP3
5
IEC 61000-4-2 -8kV Contact Discharge
0
-10
VC-ESD (V)
ADVANCE INFORMATION
-5
-15
-20
-25
-30
-35
-40
-45
0
20
40
60
80 100 120 140 160 180
t (ns)
Figure 9 Typical Clamping Performance
@ -8kV Contact Discharge
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
A1 (2x)
D
e
E
b (2x)
X3-DFN0603-2
Dim
Min
Max
Typ
A
0.27
0.35
0.30
A1
0.00
0.03
0.02
b
0.19
0.29
0.24
D
0.595 0.645 0.62
E
0.295 0.345 0.32
e
0.355
L
0.14
0.24
0.19
All Dimensions in mm
L (2x)
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
X1
Dimensions
Y
C
X
X1
Y
Value
(in mm)
0.380
0.230
0.610
0.300
C
DESD3V3S1BLP3
Document number: DS36098 Rev. 4 – 2
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DESD3V3S1BLP3
ADVANCE INFORMATION
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
DESD3V3S1BLP3
Document number: DS36098 Rev. 4 – 2
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March 2015
© Diodes Incorporated