PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 900 PIN PLASTIC BGA-900P-M09 900-pin plastic PBGA Lead pitch 1.00 mm Package width × package length 35.00 mm × 35.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.40 mm MAX Weight 5.00 g (BGA-900P-M09) 900-pin plastic PBGA (BGA-900P-M09) 35.00(1.378) B 33.00(1.299) 32.50±.0.10(1.280±.004) 1.00(.039) REF A 0.50(.020) 1.00(.039) 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1.00(.039) 35.00 (1.378) 33.00 (1.299) 32.50±.0.10 (1.280±.004) 0.50(.020) INDEX 1.00(.039) REF 0.20(.008) (4X) AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B ø0.60±0.10(.024±.004) ø0.25(.010) M C AB ø0.10(.004) M C C C 0.20(.008) C 2008-2010 FUJITSU SEMICONDUCTOR LIMITED BGA900009Sc-2-2 1.70±.0.10 (.067±.004) 2.40(.094) Max. 0.30(.012) Min. Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0806