THIN SHRINK SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20PIN PLASTIC FPT-20P-M10 20-pin plastic TSSOP Lead pitch 0.65 mm Package width package length 4.40 mm 6.50 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX Weight 0.08 g (FPT-20P-M10) 20-pin plastic TSSOP (FPT-20P-M10) Note 1) Pins width and pins thickness include plating thickness. Note 2) Pins width do not include tie bar cutting remainder. Note 3) # : These dimensions do not include resin protrusion. +0.05 #6.50±0.10(.256±.004) 0.14 –0.04 +.002 .006 –.002 11 20 BTM E-MARK #4.40±0.10 6.40±0.20 (.173±.004) (.252±.008) INDEX Details of "A" part LEAD No. 1 1.20(.047) (Mounting height) MAX 10 0.65(.026) "A" 0.24±0.04 (.009±.002) 0~8° 0.60±0.15 (.024±.006) 0.10(.004) C 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F20031S-c-1-2 0.10±0.05 (.004±.002) (Stand off) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0902