EMPro Solving Challenges of 3D EM Designs 1 The Power Of Integration Agilent EEsof EDA August 4, 2009 Agilent EEsof EDA EM Product Vision Provide the industry’s most complete selection of EM simulation technologies (MoM, FEM and FDTD) closely integrated in a consistent design flow and suited to our customer’s applications. EMDS G2 EMPro RCS Large EM Automotive SAR Packaging Antenna SI – connector Wireless 3D µW RF SiP SI Planar Ant. RF Board RFIC MMIC LTCC Momentum G2 2 August 4, 2009 Three Most Popular EM Simulation Technologies Method of Moments (Momentum G2 in ADS 2009) – LTCC, Multilayer… Finite Element Method (EMDS G2 in ADS 2009) – Packages, Bondwires… Finite Difference Time Domain (EMPro 2008) – Antennas, SI… 3 August 4, 2009 What is EMPro Industry’s Latest 3DEM Design Platform • Most modern architecture • Interactive, Intuitive, Efficient, 3DEM design Environment • Windows & Linux Fastest, Highest Capacity • Full Wave 3D EM FDTD/FEM Simulation Technology • Up to 40x faster than traditional technology Integrates with ADS • Parameterize 3D EM components for co-simulation & optimization in ADS • Transfer ADS Layouts to EMPro for additional 3D-EM simulation • Access 3DEM without leaving your favorite RF-MW design environment 4 August 4, 2009 Advanced Design System: The HF/Hi-Speed Co-Design Platform “A major restriction in the adoption of full 3D electromagnetic simulation by designers is the overhead in learning how to draw and setup the simulator…integrating 3D EM into the familiar interface enables the next wave of electromagnetic simulations to be adopted by design engineers.” IC Design Package/Module Design Board Integration & Design 5 August 4, 2009 Typical Simulation Flow Without Integrated 3D EM 5 min. START ADS Layout Export GDS file (Simplified, octagonal vias) Import GDS file into other 3rd party EM tools Tech file Layer location Thickness REPEAT Export port locations to a .MSK file Run a custom program to obtain a script file to auto-generate ports in other 3rd party EM tools 20 min. Assign material information 10 min. Small geometry modifications for tool compliance 10 min. Auto-generate Ports (Only when needed) Run EM simulation and obtain .sNp file Hours of Simulation 5 min. END Run ADS again to include the rest of the passives and active devices, evaluate performance Run ADS to simulate .sNp with certain passives together (Reduced s-parameter file!) 20 min. 6 August 4, 2009 Integrated 3D EM in Flow Saves Cycle Time! Integrated Design Flow START ADS Layout Integrated EM flow removes: • Unnecessary layout data conversion • Custom tool development such as port generation utility REPEAT • Redundant Import/Export process EM simulation • Maintenance of two tech files for two design tools ADS simulation (layout component) with certain passives together (reduced s-parameter) Run ADS again to include the rest of the passives and active devices, evaluate performance END 7 August 4, 2009 Application Examples: Solder/Wafer Bumps Component Flip-chip, CSP, WLP (solder/wafer bumps) 8 QFN packages RF Module/LTCC August 4, 2009 Solder/Wafer Bumps Example Why use 3D EM? Solder/Wafer Bumps are very typical interconnect technology for Flip-Chip, CSP, and WLP applications 3D full wave EM simulations are required to characterize bumps due to the 3D shape Silicon Die PCB Board 9 Bumps August 4, 2009 Solder/Wafer Bumps Example 3D View in ADS Flip Chip PCB Solder bumps from 3D component design kit in ADS 10 August 4, 2009 Solder/Wafer Bumps Example Simulated Isolation Performance between Bumps Less than 20dB Isolation Simulation Time: Only 5 min 25s on quad-core processor! 11 August 4, 2009 Solder/Wafer Bumps Example 3D Meshes and Post Processing Wire Mesh Volume Mesh 3D Meshes Multiple E field plot 12 E field plot August 4, 2009 Solder/Wafer Bumps Example 3D EM Design Flow with 3D Components in ADS ¾ Integrated 3D EM design flow saves cycle time and increases first pass design success ¾ Allows designers to quickly draw 3D components such as solder bumps and codesign/optimize them with other schematic components 13 August 4, 2009 3D Design Kit Components: ADS Insert into Layout from: Library or: Palette 14 August 4, 2009 Types of Standard 3D Design Kit Components 1. Each component has a 2D model (footprint) for ADS layout, and a full 3D model for 3D Preview and EMDS simulation 2. Both 2D and 3D models are parameterized. 3. Layout components only: no schematic components Basic : Block; SolderBall, Cylinder - Span : basic objects that span a substrate layer - Arrays : NxM arrays of basic objects - Span arrays : NxM arrays of span objects - Array outlines : 2(N-1)+2(M-1) basic objects, forming the outline of an array - Span array outline : 2(N-1)+2(M-1) span objects, forming the outline of an array 15 August 4, 2009 An example of Component Parameters: SolderBall minRadius division s height maxRadius arcResolution=30 arcResolution=45 16 August 4, 2009 Component Parameters: Materials ‘material‘ is a property defined in EMPro, and stored in the XML model file for the 3D component . 17 August 4, 2009 Application Examples: QFN Package Typical QFN packages Freescale Source: Freescale RFMD 18 Skyworks August 4, 2009 QFN Package Example 3x3 [mm] 16 Pin QFN Package Top metal – 0.1 mm thick Top View Plastic encasement 0.2 mm thick Bottom View 19 Bottom metal – 0.1 mm thick August 4, 2009 QFN Package Example EMDS G2 simulation with typical interconnect scheme PCB Vias from QFN to ground Microstrip Line on ThinFilm Substrate Bottom View Chip Top View Board Microstrip Feed Board Double Bonding Wires Good Up to 15GHz! 20 August 4, 2009 QFN Package Example Improving Package Performance With EMDS G2 1. Increase the width of input/output transmission lines to make 50-Ohm impedance – Very simple to do in EMDS G2! 2. Use two lead frames instead of single to minimize the transitional impedance profile and split the double bonding to the two lead frames Wider line width 21 Two lead frames and split bondwires August 4, 2009 QFN Package Example Improved Package Performance With EMDS G2 dB(S11) dB(S21) Red & Blue: Improved Design Cyan & Dark Green: Original Design 22 August 4, 2009 Application Examples: Laminate/LTCC/Module Typical Test Configuration Laminate/LTCC/Module components are typically assembled and measured on PCB 3D full wave EM simulations are required for the best simulation accuracy, that can be directly compared to the measured data • Dielectric brick simulation capability • Accurate analysis of parasitics due to dielectric substrate change Measurement System Test PCB Component 23 August 4, 2009 Laminate/LTCC/Module Component Example LTCC L/C Balun Design Process L/C Balun Transmission Line Balun Final Design 24 AMC Design August 4, 2009 Laminate/LTCC/Module Component Example 3D View for 3D EM Simulations (includes dielectric bricks) Planar View VIA 25 PCB August 4, 2009 Laminate/LTCC/Module Component Example Simulation Results S11 S21 & S31 Design Frequency: 2.45GHz Simulation Time: Total Elapsed Time = 01:30:04 on quad-core processor! 26 August 4, 2009 Application Examples: C-Band Linear Antenna Array Example 27 August 4, 2009 Lab2-Radome Possible Effects of Radome on Antenna ‐ Change in S Parameter ‐ Change in Radiation pattern ‐ Gain Reduction This kind of analysis is normally avoided because of 1) Modeling Radome structures in 3D are not easy: • In EMPro Modeling 3D Geometries are easy • Robust CAD import allows to bring any complicated structure within EMPro and develop Kit 2) Even if one gets success in drawing geometry then making a planar antenna along feed network is not easy in 3D drawing environment • EMPro Kit in ADS gives an option utilizing best of 3D Environment and 2D layout environment together • Optimization capability of ADS can be used to tune the Performance 28 August 4, 2009 Lab2-Radome Design Flow Step 2 Antenna in ADS along with Radome Step 1 Radome Structure in EMPro 3D EM Component Kit 29 August 4, 2009 Step1: Creating Radome Structure in EMPro 1. Start EMPro 2. Select Geometry Tools and Choose Create> Extrude 30 August 4, 2009 Step2: Create 3D Design Kit •Foot Print is displaced by 30 mm wrt ARC_OU •Move ARC_OU( Right Click Specify Orientation> Advance mode>V’=30mm in Translations) by 30 mm •ARC_OU will align with footprint 31 August 4, 2009 •Drag and Drop ARC_OU to MY3D Component •Export the Kit to EMProRadome_DesignKit.zip 32 August 4, 2009 Step 3: Using the Radome 3D Comp in ADS •Install the EMPro Kit in ADS •Place the Radome Library Component on the Antenna Structure and align it so that Antenna Lies in the middle of radome 33 August 4, 2009 •Antenna with Radome in ADS Layout and 3D Preview 34 August 4, 2009 Lab2-Radome Simulation Results S Parameter Without Radome With Radome 35 August 4, 2009 Lab2-Radome Radiation Pattern Rectangular Plot( freq=5.116 GHz) 36 Side lobe Rise Dip at theta=0deg for phi=0deg cut Without Radome With Radome Gain=13.50 dB Gain=12.46 dB August 4, 2009 Lab2-Radome Radiation Pattern Polar Plot( freq=5.116 GHz) Increased Power in Back Lobe Without Radome 37 With Radome August 4, 2009 Application Example: SATA Connector SATA Connector Details Appearance of Serial ATA Connectors Device plug connector Housing Material - LCP, Er- 2.9 Ground Pin Differential Ports (Transmit) Ground Pin Differential Ports (Receive) Ground Pin Pin-1 Pin-2 Serial ATA signa lconnector (pin S1) Serial ATA power connector (pin P1) Pin-3 Pin-4 Pin-5 Pin-6 Pin-7 Host receptacle connector 38 August 4, 2009 SATA Connector Example EMPro Simulation Steps 1 SAT File import in EMPro 2 Assign Materials 3 39 Define Mesh August 4, 2009 SATA Connector Example Defining EMPro Ports and Excitation Source Port-2 Port-4 Port-6 Port-8 4 Ports GND Voltage Source Tx/Rx Pin 5 Port-1 40 Port-3 Port-5 Port-7 EMPro Simulation Simulate and view the result in EMPro August 4, 2009 SATA Connector Example EMPro Simulation Results (Return Loss, Insertion Loss) GND Port-7 Port-5 GND Port-3 Port-1 GND GND Port-8 Port-6 GND Port-4 Port-2 GND IL Plots RL Plots 41 August 4, 2009 SATA Connector Example EMPro Simulation Results (Isolation of Adjacent Pins) GND Port-7 Port-5 GND Port-3 Port-1 GND 42 GND Port-8 Port-6 GND Port-4 Port-2 GND August 4, 2009 SATA Connector Example EMPro 3D EM Model Link in ADS using Design Kits Generate ADS Design Kit ( EMPro) Install design kit in ADS Select EMPro simulated Connector from ADS component Library 43 August 4, 2009 SATA Connector Example SI Analysis (co-simulating SATA Connector with channel) High Speed Multi-pin SATA Connector (3D EM = EMPro) Board traces (Planar EM = Momentum) S-Parameter Simulation Linear Frequency Sweep T erm T erm1 Num=1 Z=100 Ohm T erm T erm3 Num=3 Z=100 Ohm 8 6 Ref 3 44 7 1 2 T erm T erm2 Num=2 Z=100 Ohm S-PARAMETERS S_Param SP1 Start=0 GHz Stop=6 GHz Step=100 MHz 5 4 AMDS_T woConnectors_half AMDS_T woConnectors_half4 Diff_line Diff_line_1 ModelType=MW T erm T erm4 Num=4 Z=100 Ohm SI Analysis August 4, 2009 Changing the playing field: Adding complete 3DEM to ADS Industry proven design flow Momentum ADS Environment Layout Pre-processing Visualization Nlog(N) Solver Multithreading Momentum Turbo Parallelization EMDS G2 EMPro 2008 3D Models New Mesher Symmetry plane Multi-threaded Solver Unbeatable Price! Create 3D Models Import/create Complex CAD FDTD solver Innovative Environment Windows/Linux Create Radome model & import in ADS Layout 45 August 4, 2009 Application – Technology Matrix ADS Integrated Momentum G2 EMDS G2 (FEM) EMPro 2008 (FDTD) RFIC Spirals, Capacitors, Interconnects (GoldenGate) Wells, trenches, Under-Etching SiP/LTCC Package traces, vias, power/ground (Large) 3D components, Bondwires, mixed technologies SI / PI Complex Board, Digital, board traces, vias, power/ground RF Board EM-circuit cosim with active devices A&D 46 Connectors, Shielding Complex Connectors, Shielding Cavities, Cavity filters Packages RF Packages Wireless Complex Connectors / EMC EMI Planar, large antennas, EMcircuit cosim EM-Circuit cosim, 3D components & antennas MMIC, Spirals, Capacitors, Interconnects Waveguides in EMPro 2009 3D Antennas in complex environment, Wideband Human interaction, Compliance Large EM, RCS August 4, 2009 Agilent EEsof EDA Leadership in High Frequency EDA • Over 25 years of high-frequency simulation leadership. • Only company to integrate the 3 key EM simulation technologies within a circuit and system simulation flow. • Best Price/Performance value of the integrated design framework. EMDS G2 EMPro RCS Large EM Automotive SAR Packaging Antenna SI – connector Wireless 3D µW RF SiP SI Planar Ant. RF Board RFIC MMIC LTCC • For more details about these products or to request an evaluation: Momentum G2 47 August 4, 2009 www.agilent.com For more information about Agilent EEsof EDA, visit: www.agilent.com/find/eesof For more information on Agilent Technologies’ products, applications or services, please contact your local Agilent office. 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