GSDC048DX 48-Bump BGA (6 mm x 10 mm) DummyDie™ Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 48-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. The DummyDie™ incorporates a 3.84 mm x 8.36 mm die, which is not electrically connected. 6 mm x 10 mm FP-BGA (Package X) D Symbol E Pin A1 Index Top View A c A1 Pin A1 Index Side View Unit: mm A 1.10±0.10 A1 0.20~0.30 fb f0.30~0.40 c 0.36(TYP) D 10.0±0.05 D1 5.25 E 6.0±0.05 E1 3.75 e 0.75(TYP) aaa 0.10 aaa A B C D E F G H 1 2 3 4 5 6 fb Solder Ball e E1 e D1 Bottom View Rev: 1.00 11/2005 1/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GSDC048DX 6 mm x 10 mm Fine Pitch BGA Interconnection Diagram 1 2 3 4 5 6 A B C D E F G H Rev: 1.00 11/2005 2/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology GSDC048DX Ordering Information 48-Bump BGA (6 mm x 10 mm) Daisy Chain Package GSDC048DX Package Designator DummyDie™ Designator Ball Count Daisy Chain GSI Technology 48-Bump BGA (6 mm x 10 mm) Daisy Chain Package RoHS-compliant Option GSDC048DGX Package Designator RoHS-compliance designator DummyDie™ Designator Ball Count Daisy Chain GSI Technology Rev: 1.00 11/2005 3/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2005, GSI Technology