RENESAS HD74HC238P

HD74HC238
3-to-8-line Decoder/Demultiplexer
REJ03D0593–0200
(Previous ADE-205-470)
Rev.2.00
Jan 31, 2006
Description
The HD74HC238 has 3 binary select inputs (A, B and C). If the device is enabled these inputs determine which one of
the eight normally high outputs will go low. Two active low and one active high enables (G1, G2A and G2B) are
provided to ease the cascading of decoders.
Features
•
•
•
•
•
•
High Speed Operation: tpd (Data to Y) = 15 ns typ (CL = 50 pF)
High Output Current: Fanout of 10 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Ordering Information
Part Name
Package Code
(Previous Code)
Package Type
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74HC238P
DILP-16 pin
PRDP0016AE-B
(DP-16FV)
P
—
HD74HC238FPEL
SOP-16 pin (JEITA)
PRSP0016DH-B
(FP-16DAV)
FP
EL (2,000 pcs/reel)
PRSP0016DG-A
RP
(FP-16DNV)
Note: Please consult the sales office for the above package availability.
HD74HC238RPEL
SOP-16 pin (JEDEC)
EL (2,500 pcs/reel)
Function Table
Inputs
G1
X
X
L
H
H
H
H
H
H
H
H
H:
L:
X:
Enable
G2A
G2B
X
H
H
X
X
X
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
High level
Low level
Irrelevant
C
X
X
X
L
L
L
L
H
H
H
H
Select
B
X
X
X
L
L
H
H
L
L
H
H
Rev.2.00 Jan 31, 2006 page 1 of 6
Outputs
A
X
X
X
L
H
L
H
L
H
L
H
Y0
L
L
L
H
L
L
L
L
L
L
L
Y1
L
L
L
L
H
L
L
L
L
L
L
Y2
L
L
L
L
L
H
L
L
L
L
L
Y3
L
L
L
L
L
L
H
L
L
L
L
Y4
L
L
L
L
L
L
L
H
L
L
L
Y5
L
L
L
L
L
L
L
L
H
L
L
Y6
L
L
L
L
L
L
L
L
L
H
L
Y7
L
L
L
L
L
L
L
L
L
L
H
HD74HC238
Pin Arrangement
Select
Inputs
A
1
B
2
B
C
3
G2A
16 VCC
A
15 Y0
C
Y1
14 Y1
4
G2A
Y2
13 Y2
G2B
5
G2B
Y3
12 Y3
G1
6
G1
Y4
11 Y4
Y7
7
Y7
Y5
10 Y5
GND
8
Enable
Inputs
Y0
Output
Y6
Outputs
9 Y6
(Top view)
Logic Diagram
G1
G2B
Y0
G2A
A
B
Y1
Y2
Y3
C
Y4
Y5
Y6
Y7
Rev.2.00 Jan 31, 2006 page 2 of 6
HD74HC238
Absolute Maximum Ratings
Item
Supply voltage range
Input / Output voltage
Input / Output diode current
Output current
VCC, GND current
Power dissipation
Storage temperature
Symbol
VCC
VIN, VOUT
IIK, IOK
IO
ICC or IGND
PT
Tstg
Ratings
–0.5 to 7.0
–0.5 to VCC +0.5
±20
±35
±75
500
–65 to +150
Unit
V
V
mA
mA
mA
mW
°C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Supply voltage
Input / Output voltage
Operating temperature
Input rise / fall time*1
Symbol
VCC
VIN, VOUT
Ta
tr, tf
Ratings
2 to 6
0 to VCC
–40 to 85
0 to 1000
0 to 500
0 to 400
Unit
V
V
°C
ns
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Notes: 1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Off-state output
current
Input current
IOZ
Quiescent supply
current
ICC
Iin
Min
Ta = 25°C
Typ Max
Ta = –40 to+85°C
Unit
Min
Max
2.0
4.5
6.0
2.0
4.5
1.5
3.15
4.2
—
—
—
—
—
—
—
—
—
—
0.5
1.35
1.5
3.15
4.2
—
—
—
—
—
0.5
1.35
6.0
2.0
4.5
6.0
4.5
6.0
—
1.9
4.4
5.9
4.18
5.68
—
2.0
4.5
6.0
—
—
1.8
—
—
—
—
—
—
1.9
4.4
5.9
4.13
5.63
1.8
—
—
—
—
—
2.0
4.5
6.0
4.5
6.0
6.0
—
—
—
—
—
—
0.0
0.0
0.0
—
—
—
0.1
0.1
0.1
0.26
0.26
±0.5
—
—
—
—
—
—
0.1
0.1
0.1
0.33
0.33
±5.0
6.0
6.0
—
—
—
—
±0.1
4.0
—
—
±1.0
40
Rev.2.00 Jan 31, 2006 page 3 of 6
Test Conditions
V
V
V
Vin = VIH or VIL IOH = –20 µA
IOH = –4 mA
IOH = –5.2 mA
V
Vin = VIH or VIL IOL = 20 µA
IOL = 4 mA
IOL = 5.2 mA
µA Vin = VIH or VIL,
Vout = VCC or GND
µA Vin = VCC or GND
µA Vin = VCC or GND, Iout = 0 µA
HD74HC238
Switching Characteristics
(CL = 50 pF, Input tr = tf = 6 ns)
Item
Symbol VCC (V)
Propagation delay
time
tPLH
tPHL
Output rise/fall
time
tTLH
tTHL
Input capacitance
Cin
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
—
Ta = 25°C
Min
Typ Max
—
—
150
—
15
30
—
—
26
—
—
150
—
13
30
—
—
26
—
—
75
—
5
15
—
—
13
—
5
10
Ta = –40 to +85°C
Unit
Test Conditions
Min
Max
—
190
ns Select to Y
—
38
—
33
ns Enable to Y
—
190
—
38
—
33
—
95
ns
—
19
—
16
—
10
pF
Test Circuit
Measurement point
CL*
Note: CL includes the probe and fig capacitance.
Waveforms
tr
tf
90 %
50 %
Input
10 %
10 %
t PLH
0V
t PHL
90 %
Same-phase output
VCC
90 %
50 %
VOH
90 %
50 %
10 %
t PHL
50 %
10 %
t TLH
t PLH
t THL
90 %
90 %
Inverse-phase output
50 %
10 %
t THL
VOL
50 %
10 %
VOH
VOL
t TLH
Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns
2. The output are measured one at a time with one transition per measurement.
Rev.2.00 Jan 31, 2006 page 4 of 6
HD74HC238
Package Dimensions
JEITA Package Code
P-DIP16-6.3x19.2-2.54
RENESAS Code
PRDP0016AE-B
MASS[Typ.]
1.05g
Previous Code
DP-16FV
D
9
E
16
1
8
b3
0.89
Z
A1
A
Reference
Symbol
L
e
Nom
θ
c
e1
D
19.2
E
6.3
JEITA Package Code
P-SOP16-5.5x10.06-1.27
RENESAS Code
PRSP0016DH-B
*1
Previous Code
FP-16DAV
7.4
A1
0.51
b
p
0.40
b
3
0.48
0.56
1.30
c
0.19
θ
0°
e
2.29
0.25
0.31
2.54
2.79
15°
1.12
L
2.54
MASS[Typ.]
0.24g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
D
F
16
20.32
5.06
Z
( Ni/Pd/Au plating )
Max
7.62
1
A
bp
e
Dimension in Millimeters
Min
9
c
HE
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
1
Z
*3
bp
Nom
D
10.06
E
5.50
Max
10.5
A2
8
e
Dimension in Millimeters
Min
x
A1
M
0.00
0.10
0.20
0.34
0.40
0.46
0.15
0.20
0.25
7.80
8.00
A
L1
2.20
bp
b1
c
A
c
A1
θ
y
L
Detail F
1
θ
0°
HE
7.50
e
1.27
x
0.12
y
0.15
0.80
Z
L
L
Rev.2.00 Jan 31, 2006 page 5 of 6
8°
0.50
1
0.70
1.15
0.90
HD74HC238
JEITA Package Code
P-SOP16-3.95x9.9-1.27
RENESAS Code
PRSP0016DG-A
*1
Previous Code
FP-16DNV
MASS[Typ.]
0.15g
D
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
16
9
c
*2
Index mark
HE
E
bp
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Min
Nom
Max
D
9.90
10.30
E
3.95
A2
8
1
Z
e
*3
bp
x
A1
0.10
0.14
0.25
0.34
0.40
0.46
0.15
0.20
0.25
6.10
6.20
1.75
A
M
L1
bp
b1
c
A
c
A1
θ
L
y
Detail F
1
θ
0°
HE
5.80
e
1.27
x
0.25
y
0.15
0.635
Z
0.40
L
L
Rev.2.00 Jan 31, 2006 page 6 of 6
8°
1
0.60
1.08
1.27
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .5.0