MAKO SEMICONDUCTOR CO.,LIMITED

MAKO SEMICONDUCTOR CO.,LIMITED
一
概述
电容器及介质种类
高频类
此类介质材料的电容器为 类电容器 包括通用型高频 COG 电容器和温度补偿型高频 HG LG
PH RH SH TH UJ SL 电容器 其中 COG 电容器电性能最稳定 几乎不随温度 电压和时间的变化而
变化
适用于低损耗
稳定性要求高的高频电路
如滤波器
谐振器和计时电路中
MA
X7R X5R 此类介质材料的电容器为 类电容器 具有较高的介电常数 容量比 类电容器高 具有较
KO
稳定的温度特性
适用于容量范围广
稳定性要求不高的电路中
如隔直
耦合
旁路
鉴频等电路中
Y5V 此类介质材料的电容器为 类电容器 是所有电容器中介电常数最大的电容器 但其容量稳定性较
SE
差 对温度
电压等条件较敏感
适用于要求大容量
温度变化不大的电路中
MI
Z5U 此类介质材料的电容器为 类电容器 其温度特性介于 X7R 和 Y5V 之间 容量稳定性较差 对温
中
UC
ND
SUMMARY
CO
度 电压等条件较敏感 适用于要求大容量 使用温度范围接近于室温的旁路 耦合等 低直流偏压的电路
Types of Dielectric Material and Capacitor
TO
HIGH FREQUENCY TYPE: The capacitor of this kind dielectric material is considered as Class capacitor,
including high frequency COG capacitor and temperature compensating capacitor such as HG, LG, PH, RH,SH,
TH, UJ, SL. The electrical properties of COG capacitor are the most stable one and have little change with temperature,
voltage and time. They are suited for applications where low-losses and high-stability are required, such as filters,
oscillators, and timing circuits.
R
.,
CO
M
LI
X7R X5R: X7R X5R material is a kind of material has high dielectric constant. The capacitor made of this kind
material is considered as Class
capacitor whose capacitance is higher than that of class . These capacitors are
classified as having a semi-stable temperature characteristic and used over a wide temperature range, such in these kinds
of circuits, DC-blocking, decoupling, bypassing, frequency discriminating etc.
E
IT
Y5V: The capacitor made of this kind of material is the highest dielectric constant of all ceramic capacitors. They are
used over a moderate temperature range in application where high capacitance is required because of its unstable
temperature coefficient, but where moderate losses and capacitance changes can be tolerated. Its capacitance and
dissipation factors are sensible to measuring conditions, such as temperature and voltage, etc.
D
Z5U: The capacitor made of this kind of material is considered as Class capacitor, whose temperature
characteristic is between that of X7R and Y5V. The capacitance of this kind of capacitor is unstable and sensible to
temperature and voltage. Ideally suited for bypassing and decoupling application circuits operating with low DC bias in
the environment approaches to room temperature.
MAKO SEMICONDUCTOR CO.,LIMITED
二
结构及尺寸 STRUCTURE AND DIMENSIONS
尺寸 DIMENSIONS
L
L
MA
W
T
KO
WB
WB
型号 Type
SE
尺寸
Dimensions
(mm)
公制表示
Metric
expression
1005
1.00
0.05
0.50
0.05
0.50
0.05
0.25
0.10
0603
1608
1.60
0.10
0.80
0.10
0.80
0.10
0.30
0.10
0.20
0.20
0.20
0.50
0.20
MI
英制表示
British
expression
0402
L
W
T
WB
1.25
0.20
3.20
0.30
1.60
0.2
0.70
1.00
1.25
0.20
0.20
0.20
0.50
0.25
3225
3.20
0.30
1.25
1.50
0.30
0.30
0.75
0.25
1808
4520
4.50
0.40
2.00
0.20
2.0
0.75
0.25
1812
4532
4.50
0.40
3.20
0.30
2.5
0.75
0.20
2225
5763
5.70
0.50
6.30
0.50
2.5
1.00
0.25
3035
7690
7.60
0.50
9.00
0.50
3.0
1.00
0.25
0805
2012
1206
3216
1210
UC
ND
0.20
TO
CO
2.00
0.70
1.00
1.25
2.50
0.30
R
.,
CO
备注 可根据客户的特殊要求设计符合客户需求的产品
Note: We can design according to customer special requirements.
陶瓷介质
Ceramic dielectric
内电极
Inner electrode
外电极
Substrate electrode
镍层
Nickel Layer
锡层
Tin Layer
2
D
T
L
名称
Name
E
IT
W
序号
NO
M
LI
结构 STRUCTURE
MAKO SEMICONDUCTOR CO.,LIMITED
三
型号规格表示方法
0805
HOW TO ORDER
CG
101
J
500
N
T
MA
说明 NOTES
KO
尺寸 DIMENSIONS
尺寸规格
宽
(L
W)
0.04
0.02
inch
宽
(L
W)
0.06
1.00
0.03
1.60
0.50
1206
0.08
0.80
1210
0.12
0.05
0.06
2.00
2.00
0.30
0.25
0.35
5.70
4.50
3.20
inch/ mm
3035
0.22
0.12
4.50
2.50
2225
0.18
0.08
3.20
1.60
1812
0.18
0.10
3.20
1.25
1808
0.12
UC
ND
mm
0805
CO
长
0603
MI
长
0402
SE
Size Code
单位 unit
7.60
6.30
9.00
介质种类 DIELECTRIC STYLE
CG
HG
LG
PH
RH
SH
TH
UJ
SL
X
B
E
F
介质材料 (Dielectric)
COG
HG
LG
PH
RH
SH
TH
UJ
SL
X5R
X7R
Z5U
Y5V
TO
介质种类(Dielectric Code)
单位(unit): pF
R
标称容量 NOMINAL CAPACITANCE
实际值
(Express Method)
(Actual Value)
0R5
0.5
1R0
1.0
10
10
2
224
22
10
4
注 头两位数字为有效数字 第三位数字为 0 的个数 R 为
小数点
Note: the first two digits are significant; third digit denotes
number of zeros; R=decimal point.
…
…
容量误差 CAPACITANCE TOLERANCE
代码
B
(Code)
D
差
(Tolerance)
0.10pF
0.25pF
0.5pF
备注
B
C
F
G
1.0%
2.0%
J
5.0%
K
M
10%
20%
S
Z
+50%
+80%
-20%
D
误
C
E
IT
M
LI
102
.,
CO
表示方式
-20%
D 级误差相对容量 10pF 而选订.
Note: These capacitance tolerance B, C, D are just applicable the capacitance that equals to or less
than 10pF.
3
MAKO SEMICONDUCTOR CO.,LIMITED
额定电压 RATED VOLTAGE
单位(unit): V
表示方式
实际值
(Express Method)
(Actual Value)
6R3
6.3
50
10
201
20
10
1
102
10
10
2
MA
500
0
注 头两位数字为有效数字 第三位数字为 0 的个数 R 为小数点
Note: the first two digits are significant; third digit denotes number of zeros;
R=decimal point.
KO
端头材料 TERMINAL MATERIAL STYLES
纯银端头
(Express Method)
Silver Solderable Termination
S
Copper Solderable Termination
C
MI
纯铜端头
表示方式
Termination Styles
SE
端头类别
Nickel Barrier Termination
三层电镀端头
N
CO
包装方式 PACKAGE STYLES
UC
ND
B
袋装散包装
Bulk Bag
编带包装
Taping Package
温度系数/特性 Temperature Coefficient /Characteristics
TO
四
T
标称温度系数
Dielectric
Temperature Coefficient
COG
0±30 ppm/°C
HG
-33±30 ppm/°C
LG
-75±30 ppm/°C
CH
0±60 ppm/°C
PH
-150± 60 ppm/°C
RH
-220± 60 ppm/°C
SH
-330± 60 ppm/°C
+20°C Æ -55°C Æ +20°C Æ +85°C
TH
-470± 60 ppm/°C
+20°C Æ -55°C Æ +20°C Æ +85°C
UJ
-750± 120 ppm/°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+20°C Æ -55°C Æ +20°C Æ +125°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+20°C Æ -55°C Æ +20°C Æ +85°C
+140 ppm/°C
+20°C Æ -55°C Æ +20°C Æ +85°C
X7R
±15%
+20°C Æ -55°C Æ +20°C Æ +125°C
X5R
±15%
+20°C Æ -55°C Æ +20°C Æ +85°C
Z5U
-56%
+22%
+20°C Æ +10°C Æ +20°C Æ +85°C
Y5V
-80%
+30%
+20°C Æ -25°C Æ +20°C Æ +85°C
备注
D
E
IT
M
LI
-1000
Temperature Point
.,
CO
SL
温度点(包括上下温限)
R
介质种类
类电容器标称温度系数和允许偏差是采用温度在 20°C 和 85°C 之间的电容量变化来确定的
Note: Nominal temperature coefficient and allowed tolerance of class
are decided by the changing of the
capacitance between 20°C and 85°C.
4
MAKO SEMICONDUCTOR CO.,LIMITED
五
容量范围及其电压 Capacitance Range and Operating Voltage
单位/unit: pF
尺寸
Size
0402
MA
KO
0603
TO
UC
ND
CO
1210
MI
1206
SE
0805
容量
Capacitance Range
X7R X5R
Y5V (Z5U)
COG NPO
6.3V
0.1 470
100 1,000,000
1,000 1,000,000
10V
0.1 470
100 1,000,000
1,000 1,000,000
16V
0.1 470
100 47,000
1,000 220,000
25V
0.1 470
100 22,000
1,000 100,000
470
100
10,000
1,000 100,000
50V
0.1
6.3V
0.1 3,300
100 4,700,000
1,000 4,700,000
10V
0.1 3,300
100 1,000,000
1,000 2,200,000
16.V
0.1 3,300
100 1,000,000
1,000 1,000,000
25V
0.1 3,300
100 150,000
1,000 1,000,000
100 100,000
1,000 220,000
50V
0.1 3,300
6.3V
0.3 10,000
100 10,000,000
1,000 10,000,000
10V
0.3 10,000
100 4,700,000
1,000 10,000,000
16V
0.3 10,000
100 1,000,000
1,000 2,200,000
25V
0.3 10,000
100 1,000,000
1,000 2,200,000
50V/63V
100,000
1,000 1,000,000
100
0.3 10,000
6.3V
0.5 33,000
100 47,000,000
1,000 22,000,000
10V
0.5 33,000
100 10,000,000
1,000 22,000,000
16V
0.5 33,000
100 10,000,000
1,000 10,000,000
25V
0.5 33,000
100 4,700,000
1,000 2,200,000
100 470,000
1,000 1,000,000
50V
0.5 12,000
6.3V
10 10,000
220 47,000,000
4,700 47,000,000
10V
10 10,000
220 22,000,000
4,700 47,000,000
16V
10 10,000
220 10,000,000
4,700 10,000,000
25V
10 10,000
220 2,200,000
4,700 10,000,000
50V
10 8,200
220 1,000,000
4,700 1,500,000
6.3V
10 10,000
220 10,000,000
4,700 33,000,000
10V
10 10,000
220 4,700,000
4,700 22,000,000
16V
10 10,000
220 2,200,000
4,700 22,000,000
25V
10 10,000
220 2,200,000
4,700 10,000,000
50V
10 6,800
220 1,000,000
4,700 2,200,000
6.3V
10 15,000
470 100,000,000
10,000 33,000,000
10V
10 15,000
470 100,000,000
10,000 22,000,000
16V
10 15,000
470 22,000,000
10,000 22,000,000
25V
10 15,000
470 10,000,000
10,000 10,000,000
470 2,200,000
10,000 10,00,000
50V
10 12,000
6.3V
10 47,000
470 33,000,000
10,000 47,000,000
10V
10 47,000
470 22,000,000
10,000 33,000,000
16V
10 47,000
470 10,000,000
10,000 22,000,000
25V
10 47,000
470 4,700,000
10,000 10,000,000
470 3,300,000
10,000 10,000,000
50V
10 33,000
6.3V
10 100,000
470 100,000,000
10,000 47,000,000
10V
10 100,000
470 47,000,000
10,000 33,000,000
16V
10 100,000
470 33,000,000
10,000 22,000,000
25V
10 100,000
470 22,000,000
10,000 10,000,000
470 10,000,000
10,000 10,000,000
50V
10 47,000
备注 可根据客户的特殊要求设计符合客户需求的产品
Note: We can design according to customer special requirements
额定电压
Rated Voltage
R
D
E
IT
2225
M
LI
1812
.,
CO
1808
3035
5
MAKO SEMICONDUCTOR CO.,LIMITED
六
高 Q 值 COG 电容器
Hi-Q COG MLCC
应用:
Application:
Hi-Q COG capacitors are ideally suited for
RF and microwave application requiring high
Q, low ESR, and high resonant frequency.
适合于射频 RF 电路及要求 Hi-Q 低
MA
ESR
CQ
高频率响应的微波电路中.
CF 电容器说明
Note for CQ and CF:
下述 Q 值标准是相对通用客户而制定的 对要
KO
The following Q value is just confirmed by
general customer. If there is a higher requirement for
Q value requirements, we can design and produce
according to the special requirements.
For the customer whose requirements for
frequency is between 1MHz and 2.4GHz or higher
frequency, we can design it according to their
requirements.
The frequency of CQ is a little higher than that of
CF. Please choose them according to your
requirements.
求更高 Q 值产品的客户 可专门设计和生产
使用频率在 1MHz~2.4GHz 之间 对要求更高频
SE
率产品的客户 可根据客户的要求另外专门设计
定
MI
CQ 比 CF 相对可应用频率略高,请客户依需选
UC
ND
CO
CQ 电容器的容量值及其 Q 值 CQ Capacitance value and Q value
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
450
360
400
320
375
300
350
280
325
260
300
240
250
200
225
180
215
172
容量
Capacitance
pF
24
27
30
33
36
39
43
47
----
.,
CO
容量
Capacitance
pF
11
12
13
14
15
16
18
20
22
R
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
1000
800
900
720
850
680
800
640
700
560
650
520
575
460
525
420
500
400
TO
容量
Capacitance
pF
4.7
5.2
5.6
6.2
6.8
7.5
8.2
9.1
10
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
200
160
175
140
150
120
140
112
130
104
120
96
110
88
100
80
-------
CF 电容器的容量值及其 Q 值 CF Capacitance value and Q value
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
130
104
120
96
100
80
90
72
86
69
80
64
70
56
60
48
56
45
52
42
48
39
44
36
---------
容量
Capacitance
pF
47
51
56
62
68
75
82
91
100
110
120
130
-----
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
40
32
36
29
34
28
32
26
30
24
28
23
26
21
24
20
22
18
20
16
28
15
16
13
---------
D
容量
Capacitance
pF
15
16
18
20
22
24
27
30
33
36
39
43
-----
E
IT
300MHz 时的 Q 值
Q value at 300MHz
0805
0603
400
320
360
288
340
272
320
256
280
224
260
208
230
184
210
168
200
160
180
144
160
128
150
120
140
112
M
LI
容量
Capacitance
pF
4.7
5.2
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
14
6
MAKO SEMICONDUCTOR CO.,LIMITED
七
中高压电容器
HIGH VOLTAGE MLCC
Middle & high voltage MLCC is a kind
of special design MLCC that bases on the
technology of general MLCC. This kind of
MLCC has stable high voltage reliability
and suitable to SMT. Middle & high
MLCC is widely applicable for many
direct high voltage circuits in which it can
improve the performance of the circuit.
中高压多层片状陶瓷电容器是在多
MA
层片状陶瓷电容器的工艺技术
设备基
础上 通过采用特殊设计制作出来的一
KO
种具有良好高压可靠性的产品
适合于表面贴装
该产品
适合于多种直流高压
SE
线路 可以有效的改善电子线路的性能
MI
应用范围
APPLICATIONS
Analog & Digital Modems
局域网/广域网接口界面
LAN/WAN Interface
日光灯启动辉器照明电路
Lighting Ballast Circuits
倍压电器
直流变送器
背光源驱动电路
容量范围及其电压
工作电压
Size Code
Rated Voltage
X7R
Y5V
100V
0.5~820
100~10000
2200~68000
200V
0.5~330
100~6800
------
100V
0.5~1000
150~33000
10000~100000
200V
0.5~820
150~22000
10000~56000
250V
0.5~820
150~22000
10000~56000
500V
0.5~560
150~10000
------
100V
0.5~3000
150~100000
10000~330000
200V
0.5~2000
150~47000
10000~150000
250V
0.5~2000
150~47000
10000~150000
500V
0.5~1000
150~22000
------
1000V
0.5~680
150~5600
------
2000V
0.5~100
150~1500
------
100V
10~4700
150~220000
10000~820000
200V
10~3300
150~100000
10000~390000
250V
10~3300
150~100000
10000~390000
500V
10~2000
150~33000
------
1000V
10~820
150~10000
------
2000V
10~470
150~6800
------
D
1210
NPO
E
IT
1206
容量范围 Capacitance (pF)
M
LI
0805
Back-lighting Inverters
.,
CO
0603
DC-DC Converters
R
尺寸规格
Voltage Multipliers
TO
UC
ND
CO
模拟或数字调制解调器
7
MAKO SEMICONDUCTOR CO.,LIMITED
工作电压
Size Code
Rated Voltage
容量范围 Capacitance (pF)
X7R
Y5V
100V
10~4700
150~220000
10000~820000
200V
10~2700
150~100000
10000~390000
250V
10~2700
150~100000
10000~390000
500V
10~1800
150~39000
------
1000V
10~820
150~10000
------
2000V
10~220
150~6800
------
3000V
10~220
150~1500
------
4000V
10~150
150~1000
------
5000V
10~150
150~1000
------
100V
10~10000
150~330000
10000~1000000
200V
10~5600
150~150000
10000~470000
250V
10~5600
150~150000
10000~470000
500V
10~3900
150~100000
------
1000V
10~1200
150~27000
------
2000V
10~390
150~10000
------
10~270
150~2200
------
10~220
150~1500
------
10~220
150~1500
10~27000
150~1000000
MA
NPO
SE
尺寸规格
1808
KO
MI
3000V
4000V
5000V
100V
10000~2000000
10~12000
150~470000
10000~680000
250V
10~12000
150~470000
10000~680000
500V
10~6800
150~330000
------
1000V
10~2200
150~56000
------
2000V
10~1000
150~27000
------
3000V
10~680
150~3900
------
4000V
10~560
150~3300
------
5000V
.,
CO
200V
R
TO
2225
UC
ND
CO
1812
耐电性能的测试方法
Measuring Method
施加额定电压的 150%, 5 秒, 最大电流不超过 50mA
1000V<Vr 2000V
Force 150%Rated voltage for 5 second. Max..current should not
exceed 50 mA.
施加额定电压的 120%, 5 秒, 最大电流不超过 50mA
2000V<Vr 5000V
Force 120%Rated voltage for 5 seconds. Max..current should not
exceed 50 mA.
施加额定电压的 120%, 5 秒, 最大电流不超过 10mA
Force 120%Rated voltage for 5 seconds. Max..current should not
exceed 10 mA.
8
D
额定电压范围
Rated voltage range
500V Vr 1000V
E
IT
中高压电容器测试方法:
measurement method for high voltage MLCC
M
LI
10~560
150~3300
备注 可根据客户的特殊要求设计符合客户需求的产品
Note: We can design according to the customer requirements.
MAKO SEMICONDUCTOR CO.,LIMITED
八
可靠性测试 Reliability Test
项目
技术规格
Item
Technical Specification
类
MA
Class
KO
容量
Test Method and Remarks
标称容量
测试频率
测试电压
Capacitance Measuring
Measuring
应符合指定的误差级别
Frequency
Voltage
0.2Vrms
1000pF
1MHZ
10%
1.0
Should be within the specified tolerance.
1000 pF
1KHZ 10%
C 10µF: 测试频率: 1KHZ 10%
测试电压: 1.0 0.2Vrms
应符合指定的误差级别
Test Frequency: 1KHZ 10%
Test Voltage: 1.0 0.2Vrms
Should be within the specified tolerance.
C 10µF X7R Y5V
测试频率: 120 24 HZ
测试电压:0.5 0.1Vrms
Test Frequency: 120 24 HZ
Test Voltage: 0.5 0.1Vrms
Z5U:测试频率:1 0.1KHZ
测试电压:0.5 0.05Vrms
Test Frequency: 1 0.1KHZ
Test Voltage: 0.5 0.05Vrms
标称容量
测试频率
测试电压
Capacitance Measuring
Measuring
DF 0.15%
Frequency
Voltage
1000 pF
1MHZ 10%
1.0 0.2Vrms
1000 pF
1KHZ 10%
10V
6.3V
C 10µF
X7R
50V 25V
16V
测试频率: 1KHZ 10%
2.5%
3.5%
3.5%
5.0%
5.0%
测试电压:
1.0 0.2Vrms
C 3.3µF
Test Frequency: 1KHZ 10%
10.0%
Test Voltage: 1.0 0.2Vrms
C 3.3µF
MI
SE
Capacitance
Class
类
测 试 方 法
TO
UC
ND
CO
类
Class
R
类
Class
Y5V
Z5U
16V
12.5%
10V
6.3V
12.5%
12.5%
C 10µF X7R Y5V
测试频率: 120 24 HZ
测试电压:0.5 0.1Vrms
Test Frequency: 120 24 HZ
Test Voltage: 0.5 0.1Vrms
Z5U:测试频率:1 0.1KHZ
测 试 电 压 :0.5
0.05Vrms
Test Frequency: 1 0.1KHZ
Test Voltage: 0.5 0.05Vrms
绝缘电阻(IR)
Insulation
Resistance
类
C
10 nF, Ri
Class
C
10 nF, Ri• CR 500S
测试时间: 60
25 nF, Ri
C
25 nF, Ri• CR
Y5V
C
25 nF, Ri
Z5U
C
25 nF, Ri• CR
类
Class
测试电压:额定电压
50000M
C
X7R
D
E
IT
M
LI
25V
7.0%
C 1.0µF
9.0%
C 1.0µF
.,
CO
损耗角正切
(DF, tan )
Dissipation
Factor
10000M
100S
5秒
Measuring Voltage: Rated Voltage
Duration: 60
5s
4000M
100S
9
MAKO SEMICONDUCTOR CO.,LIMITED
项目
Item
技术规格
Technical Specification
测 试 方 法
Test Method and Remarks
不应有介质被击穿或损伤
No breakdown or damage.
可焊性
Solderability
上锡率应大于 95%
外观 无可见损伤.
At least 95% of the terminal electrode is
covered by new solder.
Visual Appearance: No visible damage.
MA
介质耐电强
度(DWV)
Dielectric
Withstanding
Voltage
KO
测量电压
类:300%额定电压
类:250%额定电压
时间
5 1 秒
充/放电电流 不应超过
50mA
(这部分说明不包括中高压 MLCC)
Measuring Voltage:
Class :300% Rated voltage
Class :250% Rated voltage
Duration: 5 1s
Charge/ Discharge Current: 50mA max.
(This method excludes high-voltage MLCC)
浸锡温度: 235 5
浸锡时间: 2 0.5s
Solder Temperature: 235 5
Duration: 2 0.5s
MI
SE
0.5%
DF
X7R
Y5V
Z5U
-5~+10%
-10~+20%
同初始标准
Same to initial value.
IR
同初始标准
Same to initial value.
外观: 无可见损伤 上锡率: 95%
Appearance: No visible damage.At least 95% of the
terminal electrode is covered by new solder.
TO
耐焊接热
Resistance to
Soldering
Heat
NPO 至 SL
NPO to SL
UC
ND
C/C
CO
项目
Item
R
将电容在 100~200 的温度下预热 10 2 分钟.
浸锡温度: 265 5
浸锡时间: 5 1s
然后取出溶剂清洗干净,在 10 倍以上的显微镜底下
观察.
放置时间 24 2 小时
放置条件 室温
Preheating conditions: 100 to 200 ; 10 2min.
Solder Temperature: 265 5
Duration: 5 1s
Clean the capacitor with solvent and examine it
with a 10X(min.) microscope.
Recovery Time: 24 2h
Recovery condition: Room temperature
试验基板 Al2O3 或 PCB
弯曲深度 1mm
施压速度 0.5mm/sec.
单位 mm
应在弯曲状态下进行测量
20
T=10
E
IT
M
LI
C/C
10%
45 2
45 2
Test Board: Al2O3 or PCB
Warp: 1mm
Speed: 0.5mm/sec.
Unit: mm
The measurement should be made with the board in
the bending position.
D
抗弯曲强度
Resistance to
Flexure of
Substrate
(Bending
Strength)
.,
CO
外观: 无可见损伤.
Appearance: No visible damage.
10
MAKO SEMICONDUCTOR CO.,LIMITED
项目
技术规格
测 试 方 法
Item
Technical Specification
Test Method and Remarks
5N
时间 10
端头结合强
外观无可见损伤
施加的力
度
No visible damage.
Applied Force: 5N
1S
Duration: 10
1S
Termination
MA
Adhesion
KO
1%或
初始测量
循环次数 5 次,一个循环分以下 4 步
时间 分钟
阶段
温度
NPO/X7R:
-55
第 1 步 下限温度(Y5V:-25 Z5U:+10) 30
1pF ,
取两者中最大者
SE
类
20%
第2步
常温
第3步
上限温度(
第4步
常温
Class :
1% or
1pF,
CO
Cycle
10%
MI
B:
E,F:
Temperature
上限类别温度 1 小时
恢复 24 1h
C/C
类
温度循环
2类
预处理
whichever is larger.
Class
: B:
20%
TO
UC
ND
E,F:
10%
(+20)
2
NPO/X7R:+125
Y5V/Z5U: +85
30
(+20)
2
)
3
3
R
试验后放置 恢复 时间 24 2h
Preheating conditions: up-category temperature, 1h
Recovery time: 24 1h
Initial Measurement
Cycling Times: 5 times, 1 cycle, 4 steps:
Time (min.)
Step Temperature
NPO/X7R: -55
1
Low- category temp. (Y5V:-25 Z5U:+10) 30
2
Normal temp. (+20)
2 3
+125
3
Up- category temp. (NPO/X7R:
30
)
Y5V/Z5U:
+85
4
Normal temp. (+20)
2 3
Recovery time after test: 24 2h
Resistance
40
湿度
90~95%RH
2
施加电压
时间
额定工作电压
500 小时
充电电流
不应超过 50mA
放置条件
室温
放置时间
24 小时( 类)
Temperature: 40
2
Humidity: 90~95%RH
Voltage: Rated Voltage
类)
Charge/Discharge Current: 50mA max.
D
Duration: 500h
48 小时(
E
IT
Moisture
温度
M
LI
潮湿试验
2%或 1pF,
取两者之中较大者
类: B:
10%
E,F:
30%
C/C
Class :
2% or 1pF,
whichever is larger.
Class : B:
10%
E,F:
30%
2 倍初始标准
DF
Not more than twice of initial value.
类 Ri 2500M 或 Ri• CR 25S 取两者
之中较小者.
IR
Class : Ri 2500M 或 Ri • CR 25S
whichever is smaller.
类 Ri 1000M 或 Ri• CR 25S 取两者
之中较小者.
Class : Ri 1000M 或 Ri • CR 25S
whichever is smaller.
外观 无损伤
Appearance: No visible damage.
.,
CO
类:
Recovery conditions: Room temperature
Recovery Time: 24h (Class1) or 48h (Class2)
11
MAKO SEMICONDUCTOR CO.,LIMITED
项目
技术规格
Item
Technical Specification
MA
C/C
KO
1.5 倍额定工作电压
取两者之中较大者
时间
1000 小时
B:
充电电流
不应超过 50mA
放置条件
室温
放置时间
24 小时
Life Test
DF
2%或 1pF
20%
30%
E,F:
Class :
2% or
1pF,
Class
: B:
E,F:
2 倍初始标准
或 48 小时
类
20%
Duration: 1000h
30%
Charge/ Discharge Current: 50mA max.
Recovery Conditions: Room Temperature
Not more than twice of initial value.
类 Ri 4000M 或 Ri• CR 40S 取两
者之中较小者.
Class : Ri 4000M 或 Ri• CR 40S
whichever is smaller.
类 Ri 2000M 或 Ri• CR 50S 取两
者之中较小者.
Class : Ri 2000M 或 Ri• CR 50S
whichever is smaller.
Recovery Time: 24h (Class 1), or 48h (Class2)
MI
UC
ND
外观 无损伤
CO
IR
类
Applied Voltage: 1.5 × Rated Voltage
whichever is larger.
SE
寿命试验
Test Method and Remarks
电压
类
类
测 试 方 法
Visual Appearance: No visible damage.
TO
注解
专门预处理
仅对 2 类电容器
将电容器放在上限类别温度或按详细规范中可能规定的更高温度下经 1h 后 接着在试验的标准大气条件下恢
复 24 1h
Note: Pretreatment (only for class2 capacitor)
Pretreatment (only for class2 capacitor) is a method to treat the capacitor before measurement. First, place the
capacitor in the up-category temperature or other specified higher temperature environment for 1hour. Then recovery the
capacitor at standard pressure conditions for 24 1hours.
R
D
E
IT
M
LI
.,
CO
12
MAKO SEMICONDUCTOR CO.,LIMITED
九
包装 PACKAGE
纸带卷盘结构 PAPER TAPING
Top cover tape 面胶
MA
KO
Carrier tape(paper)传送带
Chip hole(Pocket) 芯片孔
MI
SE
Polystyrene reel 胶盘
Bottom tape 底胶
CO
TO
UC
ND
0402 纸带编带尺寸大小
Dimensions of paper taping for 0402 type
R
W1
L1
D
C
B
P1
P2
P0
d
t
0.65
± 0.20
1.15
± 0.20
8.00
± 0.20
3.50
± 0.05
1.75
± 0.10
2.00
± 0.05
2.00
± 0.05
4.00
± 0.10
1.50
-0/+0.10
0.80
Below
D
E
IT
0402
M
LI
.,
CO
代 号
Code
13
MAKO SEMICONDUCTOR CO.,LIMITED
适合 0603 0805 1206 常规尺寸产品的纸带尺寸
Dimensions of paper taping for 0603 0805 1206 types.
送带孔 Feeding hole
MA
E
A
KO
D
H
Chip cap
G
纸带运行方向
CO
1.90
± 0.20
2.30
± 0.20
1206
1.80
± 0.20
3.40
± 0.20
D*
E
F
G*
H
J
T
8.00
± 0.20
8.0
± 0.20
3.50
± 0.05
3.50
± 0.05
1.75
± 0.10
1.75
± 0.10
4.00
± 0.10
4.00
± 0.10
2.00
± 0.10
2.00
± 0.10
4.00
± 0.10
4.00
± 0.10
1.50
-0/+0.10
1.50
-0/+0.10
1.10
Below
1.10
Below
8.00
± 0.20
3.50
± 0.05
1.75
± 0.10
4.00
± 0.10
2.00
± 0.10
4.00
± 0.10
1.50
-0/+0.10
1.10
Below
R
0805
1.10
± 0.20
1.45
± 0.20
C
TO
B
Unit: mm
UC
ND
A
0603
Tape running direction
F
MI
代号 Code
纸带规格
paper size
C
B
SE
T
芯片方穴 Chip pocket
J
.,
CO
注意 *表示此处对尺寸的要求非常精确
Note: The place with “*” means where needs exactly dimensions.
EMBOSSED TAPING
M
LI
塑胶卷盘结构
E
IT
Top cover tape 面胶
D
Carrier tape(paper)传送带
Chip hole(Pocket)芯片孔
Polystyrene reel 胶盘
14
MAKO SEMICONDUCTOR CO.,LIMITED
塑胶带尺寸结构(适合 0805~1812 型产品)
Dimensions of embossed taping for 0805~1812 type
送带孔 Feeding hole
MA
E
A
KO
D
H
G
Tape running direction
F
MI
Chip cap
塑胶带传送方向
CO
1812
C
D*
E
F
G*
H
J
T
1.55
± 0.20
1.95
± 0.20
2.70
± 0.10
2.20
± 0.10
3.66
± 0.10
2.35
± 0.20
3.60
± 0.20
3.42
± 0.10
4.95
± 0.10
4.95
± 0.10
8.00
± 0.20
8.00
± 0.20
8.00
± 0.10
12.00
± 0.10
12.00
± 0.10
3.50
± 0.05
3.50
± 0.05
3.50
± 0.05
5.50
± 0.05
5.50
± 0.05
1.75
± 0.10
1.75
± 0.10
1.75
± 0.10
1.75
± 0.10
1.75
± 0.10
4.00
± 0.10
4.00
± 0.10
4.00
± 0.10
4.00
± 0.10
8.00
± 0.10
2.00
± 0.10
2.00
± 0.10
2.00
± 0.05
2.00
± 0.05
2.00
± 0.05
4.00
± 0.10
4.00
± 0.1
4.00
± 0.10
4.00
± 0.10
4.00
± 0.10
1.50
-0/+0.10
1.50
-0/+0.10
1.55
-0/+0.10
1.50
-0/+0.10
1.55
-0/+0.10
1.50
Below
1.50
Below
1.55
± 0.10
1.80
± 0.10
1.85
± 0.10
备注 *表示此处对尺寸的要求非常精确
Note: The place with “*” means where needs exactly dimensions.
传送带的前后结构
Structure of leader part and end part of the carrier paper
空带
Vacant position
大于 200 mm
over 200mm
带头 面胶面
Leader part(cover) tape)
D
芯片传送
Chip carrier
E
IT
尾部 空带
End (Vacant position)
大于 200 mm
over 200mm
M
LI
.,
CO
1808
B
R
1210
A
TO
1206
unit: mm
UC
ND
代号 Code
规格
Tape size
0805
C
B
SE
T
芯片方穴 Chip pocket
J
大于 200 mm /Over 200 mm
传送方向/ Moving Direction
15
MAKO SEMICONDUCTOR CO.,LIMITED
卷盘尺寸 Reel Dimensions
(unit: mm)
MA
KO
MI
SE
A
7 REEL
178
REEL
330
B
2.0
2.0
3.0
3.0
C
13
13
D
0.5
0.5
21
E
0.8
21
F
50 或更大
G
10.0
1.5
12max
10.0
1.5
12max
50 or more
TO
13
UC
ND
卷盘型号
CO
尺寸代码 CODE
0.8
50 或更大
R
50 or more
关于卷带的说明
(a)纸带
.,
CO
面胶剥离强度
Taping specification
Top tape peeling strength
Paper Taping
Cover tape peeling direction 面胶剥离方向
胶
0~15
Carrier tape 传送带
(b)塑料胶盘 Embossed Taping
D
E
IT
M
LI
Cover tape 面
Cover tape peeling direction 面胶剥离方向
Cover tape 面胶
0
15
Carrier tape 传送带
16
MAKO SEMICONDUCTOR CO.,LIMITED
标准 0.1N<剥离强度<0.7N
Standard: 0.1N < peeling strength < 0.7N
在剥离时 纸带不能有纸碎, 也不能粘在底 面胶上
No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
MA
塑料盒散包装 Bulk Case Package
Symbol
A
B
Dimension
6.80 0.10
8.80 1.00
Symbol
F
W
Dimension
31.50+0.20/-0 36.00+0/-0.20
单位
KO
T
12.00 0.10
G
19.00 0.35
C
15.00+0.10/-0
H
7.00 0.35
D
2.00+0/-0.10
L
110.00 0.70
MI
SE
包装数量 Packing Quantity
尺寸(SIZE)
包装形式和数量 ( PACKAGE STYLE & QUANTITY)
纸带卷盘 PT
胶带卷盘 ET
塑料盒散装 BC
0402
10000
-----20000
0603
5000
-----15000
0805
5000
2500
10000
5000
-------------
2500
2000
2000
:mm
E
4.70 0.10
I
5.00 0.35
unit: pcs
一般散装 BP
5000
5000
5000
5000
-------------
UC
ND
CO
1206
1210
1808
unit
5000
2000
2000
TO
1812
-------2000
------2000
2225
-------------------500
3035
-------------------------注意 包装的形式和数量可根据客户的要求来定
Note: We can choose packing style and quantity can be according to the customer’s requirement.
R
外包装 Outer packing
大包装 The second package
Quantity: 5 reels (Max 25000pcs)
Quantity: 12 cases (Max 300000pcs)
数量
5卷
25000pcs 最多
数量
.,
CO
小包装 The first package
12 盒
最多 300000pcs
E
IT
M
LI
200mm
65mm
185mm
D
197mm
425mm
label 标签
PART No 型号规格
QUANTITY :数量
385mm
Label 标签
Production name 产品名称
Quantity 数量
Weight 重量
DATE 日期
17
MAKO SEMICONDUCTOR CO.,LIMITED
确保芯片可焊性良好的贮存期限为 6 个月(在包装好已交付的情况下)
The guaranteed period for solderability is 6 months (Under deliver package condition).
储存条件/Storage conditions:
储存相对湿度/Relative Humidity 20~70%
储存温度/Temperature 5~40
MA
十一
使用前的注意事项
Precautions For Use
多层片式瓷介电容器(MLCC)在短路或开路的电路中都有可能失效,在超出本承认书或相关说明书中所述
KO
使用频率的恶劣工作环境,或外界机械力超压作用下,电容芯片都有可能着火 燃烧甚至爆炸,所以在使用的时候,
首先应考虑按本承认书的有关说明来进行,如有不明之处,请联系我们技术部
品管部或生产部.
SE
The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when
subjected to severe conditions of electrical environment and / or mechanical stress beyond the specified “rating” and
MI
specified “conditions” in the specification, which will result in burn out, flaming or glowing in the worst case.
Following “precautions for “safety” and Application Notes shall be taken in your major consideration. If you have a
CO
question about the precautions for handling, please contact our engineering section or factory.
1. 焊接的条件与相关图表
Soldering Profile
行.(请参考附页中的图表)
UC
ND
为避免因温度的突然变化而引起的芯片开裂或局部爆炸的现象发生,请按有关温度曲线图表来进
To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent
graph (refer to the graph in the enclosure page).
TO
Manual Soldering
R
2. 手工焊接
手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象,在焊接时,如果操作者不
.,
CO
小心,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外.
因此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心.
Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip
M
LI
comes into direct contact with the end terminations, and operator’s careless may cause the tip of the soldering
iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be
handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of
3. 适量的焊料
焊料过多
焊料太少
Not enough solder
这样会因端头压力过大而
D
Too much solder
E
IT
the tip.
可能引起芯片受损
Cracks tend to occur due to large stress.
固定力量不足,可能会引起
电容芯片与线路接触不良
Weak holding force may cause bad
connection between the capacitor and PCB.
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MAKO SEMICONDUCTOR CO.,LIMITED
十二
焊接温度曲线图
回流焊接
Temperature
( )
300
250
200
150
100
50
波峰焊接
Re-flow soldering
预热
Preheating
MA
温度
The temperature profile for soldering
Temperature
预热
( )
温度 300 Preheating
230
SE
10S
超过一分钟
MI
Over 1 minute
230
~260
250
200
150
100
50
KO
超过一分钟
Wave soldering
Over 1 minute
自然冷却
Over 2 minute
Gradual cooling
3s max.
Gradual
cooling
CO
UC
ND
可 耐焊试验方法
Test methods for solderability and leachability
镊子
Tweezers
R
D
E
IT
M
LI
.,
CO
锡液
Solder bath
TO
电容芯片
Chip capacitor
19