3.0x2.0mm INFRARED EMITTING DIODE Description

3.0x2.0mm INFRARED EMITTING DIODE
Part Number: AA3021F3S-100MAV
Features
Description
z 3.0mm x 2.0mm, 1.4mm high, only minimum space required.
F3 Made with Gallium Arsenide Infrared Emitting diodes.
z Mechanically and spectrally matched to the phototransistor.
z Moisture sensitivity level : level 3.
z Package : 2000pcs / reel.
z RoHS compliant.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 1 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 2 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845
Selection Guide
Part No.
AA3021F3S-100MAV
Dice
Po (mW/sr) [2]
@ 100mA
Lens Type
F3 (GaAs)
Viewing
Angle [1]
Min.
Typ.
2θ1/2
12
25
125°
Water Clear
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Radiant Intensity/ luminous flux: +/-15%.
Electrical / Optical Characteristics at TA=25°C
Parameter
P/N
Symbol
Typ.
Max.
Units
Test Conditions
Forward Voltage [1]
F3
VF
1.4
2
V
IF=100mA
Reverse Current
F3
IR
10
uA
VR = 5V
Capacitance
F3
C
90
pF
VF=0V;f=1MHz
Peak Spectral Wavelength
F3
λP
940
nm
IF=100mA
Spectral Bandwidth
F3
Δλ1/2
50
nm
IF=100mA
Note:
1. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
F3
Units
Power dissipation
PD
200
mW
DC Forward Current
IF
100
mA
Peak Forward Current [1]
iFS
1.2
A
Reverse Voltage
VR
5
V
Operating Temperature
TA
-40 To +85
°C
TSTG
-40 To +85
°C
Storage Temperature
Note:
1. 1/100 Duty Cycle, 10μs Pulse Width.
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 3 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845
AA3021F3S-100MAV
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 4 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845
AA3021F3S-100MAV
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Reel Dimension
Tape Specifications
(Units : mm)
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 5 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845
PACKING & LABEL SPECIFICATIONS
AA3021F3S-100MAV
SPEC NO: DSAL0850
REV NO: V.2
DATE: SEP/03/2010
PAGE: 6 OF 6
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: Y.F.Lv
ERP: 1201006845