D-Pak RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. Tin Whisker Report The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. August 2015 D-pak BOM 1 Component Chip Material Name Silicon Material Mass (g) Element Name Composition CAS # Substance Mass (g) 0.00713 Si 7440-21-3 0.00713 SiO2 Epoxy Other Cu Sn Pb In Ag Al Ni Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-74-6 7440-22-4 7429-90-5 7440-02-0 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00242 0.00014 0.00014 0.00080 0.00050 0.00270 Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Solder 0.0027 Wire Bond Aluminum 0.00080 Lead Finish Matte Tin Over Nickel* 0.00320 Material Analysis Weight (%) 100% 80% 10% 10% 99.8% 0.2% 90% 5% 5% 100% 16% 84% % of Total Weight 1.9% 24.8% 3.1% 3.1% 62.4% 0.1% 0.7% 0.0% 0.0% 0.2% 0.1% 0.7% 0.36842 *Tin whisker mitigation strategy is nickel under-plate. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 1 August 2015 D-pak BOM 2 Component Chip Material Name Silicon Material Mass (g) Element Name Composition CAS # Substance Mass (g) 0.00713 Si 7440-21-3 0.00713 SiO2 Epoxy Other Cu Sn Pb In Ag Al Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-74-6 7440-22-4 7429-90-5 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00242 0.00014 0.00014 0.00080 0.00320 Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Soldier 0.0027 Wire Bond Lead Finish Aluminum Matte Tin* 0.00080 0.00320 Material Analysis Weight (%) % of Total Weight 100% 80% 10% 10% 99.8% 0.2% 90% 5% 5% 100% 100% 1.9% 24.8% 3.1% 3.1% 65.2% 0.1% 0.7% 0.0% 0.0% 0.2% 0.9% 0.36842 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 2 August 2015 D-pak BOM 3 Component Material Name Material Mass (g) Element Name Composition CAS # Substance Mass (g) 0.00713 Si 7440-21-3 0.00713 SiO2 Epoxy Other Cu Sn Pb Sn Ag Al Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-31-5 7440-22-4 7429-90-5 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00258 0.00005 0.00007 0.00080 0.00320 Chip Silicon Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Solder 0.0027 Wire Bond Lead Finish Aluminum Matte Tin* 0.00080 0.00320 Material Analysis Weight (%) 100% 80% 10% 10% 99.8% 0.2% 95.5% 2% 2.5% 100% 100% % of Total Weight 1.9% 24.8% 3.1% 3.1% 65.1% 0.1% 0.7% 0.0% 0.0% 0.2% 0.7% 0.36842 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 3 August 2015 D-pak BOM 4 Component Chip Material Name Silicon Material Mass (g) Element Name Composition CAS # Substance Mass (g) Si 7440-21-3 0.00713 Material Analysis Weight (%) 100% SiO2 Epoxy Other Cu Sn Pb Ag Al Ni Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-22-4 7429-90-5 7440-02-0 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00262 0.00008 0.00080 0.00050 0.00270 80% 10% 10% 99.8% 0.2% 97% 3% 100% 16% 84% 0.00713 Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Solder 0.00270 Wire Bond Aluminum 0.00080 Lead Finish Matte Tin Over Nickel* 0.00320 % of Total Weight 1.9% 24.8% 3.1% 3.1% 65.1% 0.1% 0.7% 0.0% 0.2% 0.1% 0.7% 0.36842 *Tin whisker mitigation strategy is nickel under-plate. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 4 August 2015 D-pak BOM 5 Component Material Name Material Mass (g) Element Name Composition CAS # Substance Mass (g) 0.00713 Si 7440-21-3 0.00713 Material Analysis Weight (%) 100% SiO2 Epoxy Other Cu Sn Pb In Ag Al Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-74-6 7440-22-4 7429-90-5 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00250 0.00013 0.00007 0.00080 0.00320 80% 10% 10% 99.8% 0.2% 92.5% 5% 2.5% 100% 100% Chip Silicon Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Solder 0.0027 Wire Bond Lead Finish Aluminum Matte Tin* 0.00080 0.00320 % of Total Weight 1.9% 24.8% 3.1% 3.1% 65.1% 0.1% 0.7% 0.0% 0.0% 0.2% 0.7% 0.36842 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 5 August 2015 D-pak BOM 6 Component Chip Material Name Silicon Material Mass (g) Element Name Composition CAS # Substance Mass (g) Si 7440-21-3 0.00713 Material Analysis Weight (%) 100% SiO2 Epoxy Other Cu Sn Pb Sn Ag Al Ni Sn Total Weight (g) 7631-86-9 90598-46-2 7440-50-8 7440-31-5 7439-92-1 7440-31-5 7440-22-4 7429-90-5 7440-02-0 7440-31-5 0.09136 0.01142 0.01141 0.23992 0.00048 0.00258 0.00005 0.00007 0.00080 0.00050 0.00270 80% 10% 10% 99.8% 0.2% 95.5% 2% 2.5% 100% 16% 84% 0.00713 Encapsulant Epoxy Resin 0.11419 Lead Frame Copper 0.24040 Die Attach Soft Solder 0.0027 Wire Bond Aluminum 0.00080 Lead Finish Matte Tin Over Nickel* 0.00320 % of Total Weight 1.9% 24.8% 3.1% 3.1% 62.4% 0.1% 0.7% 0.0% 0.0% 0.2% 0.1% 0.7% 0.36842 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C DEGREE CELCIUS 250 200 150 10 to 30 sec > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 6 August 2015 D-pak Test Definition Room Temperature Humidity Storage Temperature Humidity Unbiased Test Conditions Inspection Total Interval Class Duration 1 and 2 Class 1 and 2 Products Products Maximum Whisker Length (µm) 30± 2°C/60± 3% RH 1000 hours 4000 hours 20 55± 3°C/85± 3% RH 1000 hours 4000 hours 20 -40 to 55°C to 80 to 95°C, 500 cycles 1500 cycles air to air, 10 min soak, approx 3 cycles /hours Tin Whisker testing per JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Temperature Cycling 45 Tin Whisker Results (number of failing whiskers) Test Room Temperature Humidity Temperature Storage Humidity Unbiase Test d Temperature Cycling 1000 Hours 2000 Hours 3000 Hours 4000 Hours 0/60 0/60 0/60 0/60 0/60 0/60 0/60 0/60 500 Cycles 0/60 1000 Cycles 0/60 1500 Cycles 0/60 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 7 August 2015