SOT-223 RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. Tin Whisker Report The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. July 2014 SOT-223 BOM 1 Component Material Name Material Mass (g) Chip Silicon 0.00280 Encapsulant Epoxy Resin 0.04600 Lead Frame Copper 0.06430 Die Attach Soft Solder 0.00175 Wire Bond Lead Finish Gold Matte Tin* 0.00020 0.00170 Element Name Composition Si SiO2 Epoxy Other Cu Other Pb Sn Ag Au Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-92-1 7440-31-5 7440-22-4 7440-57-5 7440-31-5 0.00280 0.03703 0.00552 0.00345 0.06261 0.00170 0.00167 0.00004 0.00004 0.00020 0.00170 Material Analysis Weight (%) 100% 80% 12% 8% 97% 3% 95.5% 2% 2.5% 100% 100% % of Total Weight 2.4% 31.7% 4.7% 3.0% 53.6% 1.5% 1.4% 0.0% 0.0% 0.2% 1.5% 0.11676 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 60 to 150 s e c > 217 C 300 250 DEGREE 200 150 10 to 30 se c > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 1 July 2014 SOT-223 BOM 2 Component Material Name Material Mass (g) Chip Silicon 0.00280 Encapsulant Epoxy Resin 0.04600 Lead Frame Copper 0.06430 Die Attach Soft Solder 0.00175 Wire Bond Lead Finish Copper Matte Tin* 0.00020 0.00170 Element Name Composition Si SiO2 Epoxy Other Cu Other Pb Sn Ag Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-31-5 0.00280 0.03703 0.00552 0.00345 0.06261 0.00170 0.00162 0.00009 0.00004 0.00020 0.00170 Material Analysis Weight (%) 100% 80% 12% 8% 97% 3% 92.5% 5% 2.5% 100% 100% % of Total Weight 2.4% 31.7% 4.7% 3.0% 53.6% 1.5% 1.3% 0.1% 0.0% 0.2% 1.5% 0.11676 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. 260 DEGREE REFLOW PROFILE 300 60 to 150 s e c > 217 C 250 DEGREE 200 150 10 to 30 se c > 255 C 60 to 180 s e c 150 C to 200 C 100 50 0 TIME This part is compliant with EU Directive 2002/95/EC (RoHS) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex (7). The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 2 July 2014 SOT-223 IR Test Definition Room Temperature Humidity Storage Temperature Humidity Unbiased Test Conditions Inspection Total Interval Class Duration 1 and 2 Class 1 and 2 Products Products Maximum Whisker Length (µm) 30± 2°C/60± 3% RH 1000 hours 4000 hours 20 55± 3°C/85± 3% RH 1000 hours 4000 hours 20 -40 to 55°C to 80 to 95°C, 500 cycles 1500 cycles air to air, 10 min soak, approx 3 cycles Tin Whisker testing per JESD201, /hours Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Temperature Cycling 45 Tin Whisker Results (number of failing whiskers) Test Room Temperature Humidity Storage Temperature Humidity Unbiase Test d Temperature Cycling 1000 Hours 2000 Hours 3000 Hours 4000 Hours 0/36 0/36 0/36 0/36 0/36 0/36 0/36 0/36 500 Cycles 0/36 1000 Cycles 0/36 1500 Cycles 0/36 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 3 July 2014