MIL-PRF-38534 AND 38535 CERTIFIED FACILITY
M.S.KENNEDY CORP.
600V/200A
THREE PHASE BRIDGE
PEM WITH BRAKE
4854
FEATURES:
Replaces MSK4851 with Lower Conduction Loss
Full Three Phase Bridge Configuration with SCR/IGBT Brake
600V Rated Voltage
200A Continuous Output Current
Internal Zener Clamps on Gates
Encapsulation Provides Near Hermetic Performance
HI-REL Screening Available (Modified 38534)
Light Weight Domed AlSiC Baseplate
Robust Mechanical Design for Hi-Rel Applications
Ultra-Low Inductance Internal Layout
Withstands 96 Hours HAST and Thermal Cycling (-55°C to +125°C)
DESCRIPTION:
The MSK4854 is one of a family of plastic encapsulated modules (PEM) developed specifically for use in military,
aerospace and other severe environment applications. The Three Phase Bridge configuration along with the SCR/IGBT brake
circuit and 600 volt/200 amp rating make it ideal for use in high current motor drive and inverter applications. The Aluminum
Silicon Carbide (AlSiC) baseplate offers superior flatness and light weight; far better than the copper or copper alloys found
in most high power plastic modules. The high thermal conductivity materials used to construct the MSK4854 allow high
power outputs at elevated baseplate temperatures.
EQUIVALENT SCHEMATIC
TYPICAL APPLICATIONS
Motor Drives
Inverters
8548-123 Rev. E 5/14
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ABSOLUTE MAXIMUM RATING
VCE
VGE
IOUT
I OUTP
VCASE
Collector to Emitter Voltage
Gate to Emitter Voltage
Current (Continuous)
Current Pulsed (1mS)
Case Isolation Voltage
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TST
TJ
TC
600V
±20V
200A
400A
2500 V
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Storage Temperature Range 9 -55°C to +125°C
150°C
Junction Temperature
Case Operating Temperature Range
-55°C to +125°C
MSK4854H
-40°C to +85°C
MSK4854
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ELECTRICAL SPECIFICATIONS
NOTES:
1
2
3
4
5
6
7
8
9
Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only.
Industrial grade devices shall be tested to subgroup 1 unless otherwise specified.
HI-REL grade devices ("H" suffix) shall be 100% tested to subgroups 1, 2 and sample tested to subgroup 3.
Subgroup 4 testing available upon request.
Subgroup 1, 4 TA = +25°C
2
TA = +125°C
3
TA = -55°C
All specifications apply to both the upper and lower sections of the half bridge.
VGE=15V unless otherwise specified.
Continuous operation at or above absolute maximum ratings may adversly effect the device performance and/or life cycle.
Internal solder reflow temperature is 180°C, do not exceed.
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8548-123 Rev. E 5/14
APPLICATION NOTES
THERMAL CALCULATIONS
Power dissipation and maximum allowable temperature rise involve many variables working together. Collector current,
PWM duty cycle and switching frequency all factor into power dissipation. DC losses or "ON-TIME" losses are simply
VCE(SAT) x Collector Current x PWM duty cycle. For the MSK4854, VCE(SAT)=2.2V max., and at 200 amps and a PWM
duty cycle of 30%, DC losses equal 132 watts. Switching losses, in milli-joules, vary proportionally with switching frequency. The MSK4854 typical switching losses at VCE=300V and ICE=200A are about 15mJ, which is simply the sum of
the turn-on switching loss and the turn-off switching loss. Multiplying the switching frequency times the switching losses
will result in a power dissipation number for switching. The MSK4854, at 15KHz, will exhibit switching power dissipation of
225 watts. The total losses are the sum of DC losses plus switching losses, or in this case, 357 watts total.
357 watts x 0.26°C/W thermal resistance equals 92.8 degrees of temperature rise between the case and the junction.
Subtracting 93°C from the maximum junction temperature of 150°C equals 57°C maximum case temperature for this
example.
VCE(SAT) x IC x PWM duty cycle = 2.2V x 200 amps x 30% = 132 watts DC losses
Turn-on switching loss + Turn-off switching loss = Total switching losses = 6 + 9 = 15mJ
Total switching loss x PWM frequency = Total switching power dissipation = 15mJ x 15KHz = 225 watts
Total power dissipation = DC losses + switching losses =132 + 225 = 357 watts
Junction temperature rise above case = Total power dissipation x thermal resistance
357 watts x 0.26°C/W = 92.8°C temperature rise above case
Maximum junction temperature - junction temperature rise = maximum baseplate temperature
150°C - 93°C = 57°C
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8548-123 Rev. E 5/14
TYPICAL PERFORMANCE CURVES
4
8548-123 Rev. E 5/14
SCREENING CHART
5
8548-123 Rev. E 5/14
MECHANICAL SPECIFICATIONS
ALL DIMENSIONS ARE SPECIFIED IN INCHES
WEIGHT=442 GRAMS TYPICAL
FOR CONVEX BASEPLATE PROFILE SEE SHEET 7
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8548-123 Rev. E 5/14
MECHANICAL SPECIFICATIONS CONT'D
ALL DIMENSIONS ARE SPECIFIED IN INCHES
MSK4854 H
ORDERING INFORMATION
SCREENING
BLANK=INDUSTRIAL; H=HI-REL (MODIFIED 38534)
GENERAL PART NUMBER
THE ABOVE EXAMPLE IS A HI-REL SCREENED MODULE.
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8548-123 Rev. E 5/14
REVISION HISTORY
M.S. Kennedy Corp.
Phone (315) 701-6751
FAX (315) 701-6752
www.mskennedy.com
The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make
changes to its products or specifications without notice, however, and assumes no liability for the use of its products.
Please visit our website for the most recent revision of this datasheet.
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8548-123 Rev. E 5/14