PLA192

PLA192
Single Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Ratings
600
Units
VP
150
22
5
mArms / mADC

Description
IXYS Integrated Circuits Division's PLA192 is a
single-pole, normally open (1-Form-A) solid state
relay that provides 5000Vrms of input to output
isolation.
mA
Features
• PLA192E is 100% Tested for Partial Discharge:
DIN EN 60747-5-5
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
In addition to all the features and benefits of the
PLA192, the PLA192E meets the partial discharge
demands of DIN EN 60747-5-5 (previously VDE
0884).
All versions of the PLA192 can be used to replace
mechanical relays, while offering the superior
reliability associated with semiconductor devices.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient GaAIAs infrared LED. Because they have
no moving parts, they offer bounce-free switching in
more compact surface mount or thru-hole packages.
Approvals
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment: Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Pin Configuration
AC/DC Configuration
1
+ Control
- Control
Do Not Use
6
2
5
3
4
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 12 11 82667 002
• DIN EN 60747-5-5 Certified ("E" Suffix Only)
VDE Certificate 40036603
Ordering Information
Part #
PLA192E
PLA192ES
PLA192ESTR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
PLA192
6-Pin DIP (50/Tube)
PLA192S
6-Pin Surface Mount (50/Tube)
PLA192STR
6-Pin Surface Mount (1000/Reel)
Load
Switching Characteristics of
Normally Open Devices
Do Not Use
Load
Form-A
DC Only Configuration
+ Control
- Control
Do Not Use
1
6
2
5
3
4
+ Load
IF
- Load
90%
10%
ILOAD
ton
Pb
DS-PLA192-R07
toff
e3
www.ixysic.com
1
INTEGRATED CIRCUITS DIVISION
PLA192
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
(60 Seconds)
ESD Rating, Human Body Model
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Rating
600
5
50
1
150
800
Units
VP
V
mA
A
mW
mW
5000
Vrms
4
-40 to +85
-40 to +125
kV
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameters
Output Characteristics
Load Current
Continuous, AC/DC Configuration
Continuous, DC-Only Configuration
Peak
On-Resistance
AC/DC Configuration
DC-Only Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Min
Typ
Max
Units
-
-
150
220
±400
mArms / mADC
mADC
mAP
13.3
4.15
-
22
8
1

ILEAK
-
VL=50V, f=1MHz
ton
toff
COUT
-
10
5
5
-
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.22
0.21
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
Min
7071
1000
7.6
7.6
Max
1875
5000
-
Units
VP
VP
VP
Vrms
mm
mm
t=10ms
Symbol
IL
ILPK
IL=150mA
IL=220mA
VL=600VP
IF=5mA, VL=10V
RON
A
ms
pF
PLA192E Safety and Insulation Ratings
Parameters
Pollution Degree 2 according to DIN VDE 0109
Highest Allowable Over-Voltage
Maximum Working Insulation Voltage
Partial Discharge Test Voltage
Isolation Test Voltage
Creepage Distance
Clearance Distance
2
Conditions
Transient Voltage
Recurring Voltage
DIN EN 60747-5-5 Method B
-
www.ixysic.com
Symbol
VIOTM
VIORM
VPR
VISO
-
R07
INTEGRATED CIRCUITS DIVISION
PLA192
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
25
20
15
10
35
30
30
25
20
15
10
25
20
15
10
5
5
5
0
0
0
1.25
1.6
1.26
1.27
1.28
1.29
LED Forward Voltage Drop (V)
Typical IF for Switch Operation
(N=50, IL=100mA)
30
1.7
1.8
1.9
2.0
Turn-On Time (ms)
2.1
0.23
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mA)
40
30
35
Device Count (N)
25
Device Count (N)
35
Device Count (N)
Device Count (N)
Device Count (N)
30
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC )
20
15
10
5
25
20
15
10
0
0.20
0.21
0.22 0.23 0.24
LED Current (mA)
0.25
0.38
DC-Only On-Resistance Distribution
(N=50, IF=5mA, IL=220mA)
20
15
10
5
5
0
0.26
0.29
0.32
0.35
Turn-Off Time (ms)
25
30
Device Count (N)
35
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC )
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0
13.1
0.26
13.2
13.3
13.4
13.5
On-Resistance (:)
13.6
4.05
4.10
4.15
4.20
4.25
On-Resistance (:)
4.30
Typical Blocking Voltage Distribution
(N=50)
30
Device Count (N)
25
20
15
10
5
0
700
1.3
1.2
1.1
360
3500
Turn-Off Time (Ps)
1.4
3000
2500
2000
1500
1000
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
359
358
357
356
500
1.0
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
361
4000
Turn-On Time (Ps)
LED Forward Voltage Drop (V)
4500
IF=50mA
IF=20mA
IF=10mA
IF=5mA
1.5
750
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
710
720
730
740
Blocking Voltage (VP)
355
0
10
20
30
LED Current (mA)
40
50
0
10
20
30
40
Forward Current (mA)
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
www.ixysic.com
3
INTEGRATED CIRCUITS DIVISION
PLA192
0.30
4500
4000
0.28
0.26
0.24
0.22
0.20
3000
2500
1500
1000
0.16
500
0
20
40
60
Temperature (ºC)
80
IF=10mA
IF=5mA
IF=2mA
450
400
350
300
250
200
-20
0
20
40
60
Temperature (ºC)
80
100
-40
Typical DC-Only On-Resistance
vs. Temperature
(IF=5mA, IL=220mA)
7
-20
0
20
40
60
Temperature (ºC)
80
100
80
100
Maximum Load Current
vs. Temperature
(IF=5mA)
250
DC-Only Configuration
On-Resistance (:)
12
10
-40
0.15
-20
0
20
40
60
Temperature (ºC)
80
5
4
3
2
1
-40
100
Typical Load Current vs. Load Voltage
AC/DC Configuration
(IF=5mA)
0.25
0.10
0
20
40
60
Temperature (ºC)
80
Current (A)
0.00
-0.05
0.10
0.05
-0.15
0.00
-3
-2
-1
0
1
Voltage (V)
2
3
0.03
0.02
0.01
0
0.6
0.8
Voltage (V)
1.0
-20
0
20
40
60
Temperature º(C)
80
100
750
740
730
720
710
-40
-20
0
20
40
60
80
100
10s
100s
Temperature (ºC)
1.2
160
Energy Rating Curve
(IF=5mA)
1.0
140
120
100
80
60
40
0.8
0.6
0.4
0.2
20
0
-40
20
40
60
Temperature (ºC)
760
1.2
Load Current (A)
Output Capacitance (pF)
0.04
0.4
0
770
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
180
0.05
0.2
-20
Typical Blocking Voltage
vs. Temperature
700
0.0
Typical Leakage vs. Temperature
Measured across Pins 4&6
(VL=600V)
0.06
100
-40
Typical Load Current vs. Load Voltage
DC-Only Configuration
(IF=5mA)
0.15
-0.10
AC/DC Configuration
150
100
0.20
0.05
200
50
-20
Blocking Voltage (VP)
14
Load Current (mA)
6
16
8
Current (A)
IF=10mA
-40
100
Typical AC/DC On-Resistance
vs. Temperature
(IF=5mA, IL=150mA)
18
On-Resistance (:)
-20
IF=5mA
2000
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
500
IF=2mA
3500
0.18
-40
Leakage (PA)
Typical Turn-On Time
vs. Temperature
(IL=100mA)
Turn-Off Time (Ps)
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Turn-On Time (Ps)
LED Current to Operate (mA)
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
0.1
1
10
100
Load Voltage (V)
1000
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R07
INTEGRATED CIRCUITS DIVISION
PLA192
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
All Versions
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
All Versions
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA192 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
Pb
R07
e3
www.ixysic.com
5
INTEGRATED CIRCUITS DIVISION
PLA192
MECHANICAL DIMENSIONS
PLA192 & PLA192E
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA192S & PLA192ES
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
6
www.ixysic.com
R07
INTEGRATED CIRCUITS DIVISION
PLA192
PLA192STR & PLA192ESTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
7
Specification: DS-PLA192-R07
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/28/2013