3.0SMC Series

TVS Diodes
Surface Mount > 3.0SMC series
3.0SMC Series
RoHS
Pb
e3
Description
Uni-directional
The 3.0SMC series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• IPP is specified @ 8/20µS
surge waveform
• Built-in strain relief
• VBR @TJ= [email protected]°C x (1+αT
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
PM(AV)
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 1)
IFSM
300
A
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
VF
3.5
V
TJ , TSTG
-55 to 150
°C
Typical Thermal Resistance Junction
to Lead
RuJL
15
Typical Thermal Resistance Junction
to Ambient
RuJA
Power Dissipation on Infinite Heat
Sink at TA=50OC
Operating Junction and Storage
Temperature Range
x (TJ - 25))
75
(αT:Temperature Coefficient)
°C/W
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical IR less than 1µA
above 30V
• High temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• 2nd level interconnect is
Pb-free per IPC/JEDEC
J-STD-609A.01
• Glass passivated chip
junction
• Fast response time:
typically less than 1.0ps
from 0V to BV min
°C/W
Notes:
1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Applications
Functional Diagram
Bi-directional
Cathode
TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
Anode
Uni-directional
3.0SMC Series
78
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount > 3.0SMC series
Electrical Characteristics (T =25°C unless otherwise noted)
A
™
TVS
DiodeBreakdown
Arrays (SPATest
FamilyMaximum
of Products)
Voltage V
Maximum Peak
Reverse
Part
Number
(Uni)
Marking
3.0SMC20A
3.0SMC24A
3.0SMC28A
3.0SMC30A
3.0SMC33A
YLA
YLC
YLE
YLF
YLG
Stand off
Voltage VR
(Volts)
20.0
24.0
28.0
30.0
33.0
BR
MIN
MAX
Current
IT
(mA)
22.20
26.70
31.10
33.30
36.70
24.50
29.50
34.40
36.80
40.60
1
1
1
1
1
(Volts) @ IT
Clamping
Voltage VC
@ 8/20µS
Ipp (V)
Pulse Current
Ipp @ 8/20µS
(A)
42
51
59
62
70
740
520
470
420
365
Maximum
Reverse
Leakage IR
@ VR
(µA)
1
1
1
1
1
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating
1000
PPPM-Peak Pulse Power (KW)
Voltage Transients
Voltage or Current
Voltage Across TVS
Current Through TVS
100
10
1
0.31x0.31" (8.0x8.0mm)
0.1
Copper Pad Area
0.001
Time
0.01
0.1
1
td-Pulse Width (ms)
10
continues on next page.
3.0SMC Series
79
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount > 3.0SMC series
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
Diode
Arrays
Figure 3 - Peak Pulse PowerTVS
or Current
Derating
Curve
vs Initial Junction Temperature
(SPA™Figure
Family4 of
Products)
- Pulse Waveform
IPP- Peak Pulse Current, % IPP
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
Waveform = tr x td
50
0
0
0
25
50
75
100
125
150
Peak
Value
100
175
Half Value
0 tr=8µS
td=20µS
t-Time (µS)
TA-Ambient temperature (ºC)
Figure 5 - Typical Junction Capacitance
Figure 6 - Steady State Power Derating Curve
100000
PM(AV), Steady Sate Power
Dissipation (W)
Cj (pF)
10000
Uni-directional V= OV
1000
Uni-directional @ VR
100
10
1
1.0
tr= rise time to peak value
td= decaytime to half value
10.0
100.0
1000.0
VBR - Reverse Breakdown Voltage (V)
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
25
50
75
100
125
150
175
TA - Ambient Temperature(ºC)
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional only
IFSM - Peak Forward Surge Current
(A)
350
300
250
200
150
100
50
0
1
10
100
Number of Cycles at 60 Hz
3.0SMC Series
80
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount > 3.0SMC series
Soldering Parameters
TVS Diode Arrays (SPA™ Family of Products)
Pre Heat
Lead–free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Ramp-up
TL
Average ramp up rate (Liquidus Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
tL
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
280°C
Critical Zone
TL to TP
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
Peak Temperature (TP)
+0/-5
tp
TP
Temperature (T)
Reflow Condition
t 25˚C to Peak
Time (t)
°C
Environmental Specifications
Physical Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Weight
0.007 ounce, 0.21 grams
Temperature Cycling
JESD22-A104
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
H3TRB
JESD22-A101
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
RSH
JESD22-B106
Dimensions
DO-214AB (SMC J-Bend)
Dimensions
Cathode Band
C
A
B
H
D
F
E
J
G
K
L
I
Inches
Min
Millimeters
Max
Min
Max
A
0.114
0.126
2.900
3.200
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.079
0.103
2.060
2.620
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.305
0.320
7.750
8.130
H
0.006
0.012
0.152
0.305
I
0.129
-
3.300
-
J
0.094
-
2.400
-
K
-
0.165
L
0.094
-
4.200
2.400
-
Solder Pads
(all dimensions in mm)
3.0SMC Series
81
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount > 3.0SMC series
Part Numbering System
Part Marking System
3.0SMC XX A
F
Cathode Band
5% VBR VOLTAGE TOLERANCE
XXX
VR VOLTAGE
YMXXX
SERIES
Littelfuse Logo
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging Options
Part number
Component
Package
3.0SMCxxX
DO-214AB
Packaging
Option
Quantity
3000
Tape & Reel - 16mm tape/13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
0.47
(12.0)
Cathode
0.157
(4.0)
0.059 DIA
(1.5)
Cover tape
13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.49
(12.5)
3.0SMC Series
Dimensions are in inches
(and millimeters).
Direction of Feed
82
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14