Datasheet

Transient Voltage Suppression Diodes
Surface Mount – 4000W > 4.0SMDJ24A
4.0SMDJ24A
RoHS
Pb e3
Description
Uni-directional
The 4.0SMDJ24A is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 4000W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Built-in strain relief
• VBR @ TJ= [email protected]°C
x (1+αT x (TJ - 25))
(αT:Temperature
Coefficient, typical value
is 0.1%)
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
TA=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2)
PPPM
4000
W
Power Dissipation on Infinite Heat
Sink at TL=50OC
PD
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
IFSM
300
A
VF
3.5
V
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
Operating Temperature Range
TJ
-65 to 150
°C
Storage Temperature Range
TSTG
-65 to 175
°C
Typical Thermal Resistance Junction
to Lead
RθJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
RθJA
75
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Functional Diagram
Applications
Bi-directional
Cathode
• Glass passivated chip
junction
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
at terminals
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD609A.01)
TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Anode
Uni-directional
Electrical Characteristics (T =25°C unless otherwise noted)
A
Part
Number
4.0SMDJ24A
Reverse
Stand off
Marking Voltage
VR
(Volts)
4PEZ
24.0
Breakdown
Voltage VBR
(Volts) @ IT
MIN
MAX
Test
Current
IT
(mA)
26.70
29.50
1
Maximum
Clamping
Voltage VC
@ Ipp
(10/1000µS)
(V)
Maximum
Clamping
Voltage VC
@ Ipp
(8/20µS)
(V)
Maximum
Peak Pulse
CurrentIpp
(10/1000µS)
(A)
Maximum
Peak Pulse
Current Ipp
(8/20µS)
(A)
Maximum
Reverse
Leakage IR
@ VR
(µA)
38.9
51.0
103.0
650.0
2
1
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount – 4000W > 4.0SMDJ24A
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating
1000
PPPM-Peak Pulse Power (KW)
Voltage Transients
Voltage or Current
Voltage Across TVS
Current Through TVS
TJ initial = Tamb
100
10
0.31x0.31" (8.0x8.0mm)
1
Copper Pad Area
0.001
0.01
0.1
1
td-Pulse Width (ms)
10
Time
continues on next page.
Additional Infomarion
Datasheet
Resources
Samples
2
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
Figure 3 - Peak Pulse Power Derating Curve
Figure 4 - Pulse Waveform
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
0
25
50
75
100 125 150
TJ - Initial Junction Temperature (ºC)
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
Peak Value
IPPM
100
Half Value
IPPM IPPM
( )
2
50
0
175
10/1000µsec. Waveform
as defined by R.E.A
td
0
1.0
2.0
3.0
4.0
t-Time (ms)
Figure 6 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional Only
Figure 5 - Typical Transient Thermal Impedance
100
450
400
10
IFSM - Peak Forward Surve Current(A)
Transient Thermal Impedance (°C/W)
tr=10µsec
1
0.1
0.01
0.001
350
300
250
200
150
100
50
0.01
0.1
1
10
100
1000
0
1
TP - Pulse Duration (s)
10
100
Number of Cycles at 60 Hz
IF- Peak Forward Current(A)
Figure 7 - Peak Forward Voltage Drop vs Peak Forward
Current (Typical Values)
100
10
1
0.1
0.01
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
VF-Peak Forward Voltage(V)
3
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Soldering Parameters
Lead–free
assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TA)
to peak
3°C/second max
TS(max) to TA - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TA) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tp
TP
Ramp-up
TL
Temperature (T)
Reflow Condition
tL
Critical Zone
TL to TP
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
Environmental Specifications
Physical Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Weight
0.007 ounce, 0.21 grams
Temperature Cycling
JESD22-A104
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
H3TRB
JESD22-A101
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
RSH
JESD22-A111
Dimensions
DO-214AB (SMC J-Bend)
Dimensions
Cathode Band
(for Uni-directional products only)
A
C
A
B
H
D
F
E
G
J
K
L
I
Solder Pads
(all dimensions in mm)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
4
Inches
Millimeters
Min
Max
Min
Max
0.114
0.126
2.900
3.200
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.079
0.103
2.060
2.620
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.305
0.320
7.750
8.130
H
0.006
0.012
0.152
0.305
I
0.129
-
3.300
-
2.400
J
0.094
-
K
-
0.165
L
0.094
-
4.200
2.400
-
Transient Voltage Suppression Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Part Numbering System
Part Marking System
4.0SMDJ 24 A
Cathode Band
F
(for Uni-directional products only)
4PEZ
5% VBR VOLTAGE TOLERANCE
YMXXX
Littelfuse Logo
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
VR VOLTAGE
SERIES
Packaging Options
Part number
Component
Package
4.0SMDJ24A
DO-214AB
Packaging
Option
Quantity
3000
Tape & Reel - 16mm tape/13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
0.63
(16.0)
Cathode
0.315
(8.0)
Optional
7” 7.0 (187)
13” 13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.65
(16.4)
0.059 DIA
(1.5)
Cover tape
Dimensions are in inches
(and millimeters).
Direction of Feed
5
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15