4.0SMDJ24A - Littelfuse

TVS Diodes
Surface Mount – 4000W > 4.0SMDJ24A
4.0SMDJ24A
RoHS
Pb e3
Description
Uni-directional
The 4.0SMDJ24A is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
Maximum Ratings and Thermal Characteristics
(TA=25OC unless otherwise noted)
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
TA=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2)
PPPM
4000
W
Power Dissipation on Infinite Heat
Sink at TA=50OC
PM(AV)
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
IFSM
300
A
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
VF
3.5
V
TJ , TSTG
-55 to 150
°C
Typical Thermal Resistance Junction
to Lead
RuJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
RuJA
75
°C/W
Operating Junction and Storage
Temperature Range
• 4000W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• 2nd level interconnect is
Pb-free per IPC/JEDEC
J-STD-609A.01
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2)
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4)
• Built-in strain relief
• VBR @TJ= [email protected]°C x (1+αT
x (TJ - 25))
(αT:Temperature Coefficient)
• Glass passivated chip
junction
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TA = 25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Functional Diagram
Applications
TVS devices are ideal for the protection of I/O Interfaces,
VCC bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
Bi-directional
Cathode
Anode
Uni-directional
Electrical Characteristics (T =25°C unless otherwise noted)
A
Part
Number
4.0SMDJ24A
4.0SMDJ24A
Reverse
Stand off
Marking Voltage
VR
(Volts)
4PEZ
24.0
Breakdown
Voltage VBR
(Volts) @ IT
MIN
MAX
Test
Current
IT
(mA)
26.70
29.50
1
Maximum
Clamping
Voltage VC
@ Ipp
(10/1000µS)
(V)
Maximum
Clamping
Voltage VC
@ Ipp
(8/20µS)
(V)
Maximum
Peak Pulse
CurrentIpp
(10/1000µS)
(A)
Maximum
Peak Pulse
Current Ipp
(8/20µS)
(A)
Maximum
Reverse
Leakage IR
@ VR
(µA)
38.9
51.0
103.0
650.0
2
1
186
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount – 4000W > 4.0SMDJ24A
I-V Curve Characteristics
Uni-directional
Vc VBR VR
V
IR VF
IT
Ipp
PPPM
VR
VBR
VC
IR
VF
Peak Pulse Power Dissipation -- Max power dissipation
Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current)
Reverse Leakage Current -- Current measured at VR
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Figure 2 - Peak Pulse Power Rating
1000
PPPM-Peak Pulse Power (KW)
Voltage Transients
Voltage or Current
Voltage Across TVS
Current Through TVS
100
10
0.31x0.31" (8.0x8.0mm)
1
Copper Pad Area
0.001
0.01
0.1
1
td-Pulse Width (ms)
10
Time
continues on next page.
4.0SMDJ24A
2
187
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued)
A
Figure 3 - Peak Pulse Power or Current Derating Curve
vs Initial Junction Temperature
Figure 4 - Pulse Waveform
150
IPPM- Peak Pulse Current, % IRSM
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage %
100
80
60
40
20
0
tr=10µsec
Peak Value
IPPM
100
Half Value
IPPM IPPM
( )
2
50
10/1000µsec. Waveform
as defined by R.E.A
td
0
0
25
50
75
100
125
150
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
0
175
1.0
2.0
3.0
4.0
t-Time (ms)
TA-Ambient temperature (ºC)
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional only
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
350
IFSM - Peak Forward Surge Current
(A)
PM(AV), Steady Sate Power
Dissipation (W)
Figure 5 - Steady State Power Derating Curve
0
25
50
75
100
125
150
250
200
150
100
50
0
175
1
TA - Ambient Temperature(ºC)
4.0SMDJ24A
300
10
100
Number of Cycles at 60 Hz
3
188
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Soldering Parameters
Pre Heat
Lead–free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
280°C
tp
TP
Ramp-up
TL
Temperature (T)
Reflow Condition
tL
Critical Zone
TL to TP
Ts(max)
Ramp-down
Ts(min)
ts
Preheat
25˚C
t 25˚C to Peak
Time (t)
Environmental Specifications
Physical Specifications
High Temp. Storage
JESD22-A103
HTRB
JESD22-A108
Weight
0.007 ounce, 0.21 grams
Temperature Cycling
JESD22-A104
Case
JEDEC DO214AB. Molded plastic body
over glass passivated junction
MSL
JEDEC-J-STD-020, Level 1
Polarity
Color band denotes positive end
(cathode) except Bidirectional.
H3TRB
JESD22-A101
Terminal
Matte Tin-plated leads, Solderable per
JESD22-B102
RSH
JESD22-B106
Dimensions
DO-214AB (SMC J-Bend)
Dimensions
Cathode Band
(for Uni-directional products only)
C
A
B
H
D
F
E
G
J
K
L
I
Inches
Min
Millimeters
Max
Min
Max
A
0.114
0.126
2.900
3.200
B
0.260
0.280
6.600
7.110
C
0.220
0.245
5.590
6.220
D
0.079
0.103
2.060
2.620
E
0.030
0.060
0.760
1.520
F
-
0.008
-
0.203
G
0.305
0.320
7.750
8.130
H
0.006
0.012
0.152
0.305
I
0.129
-
3.300
-
J
0.094
-
2.400
-
K
-
0.165
L
0.094
-
4.200
2.400
-
Solder Pads
4.0SMDJ24A
(all dimensions in mm)
4
189
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14
TVS Diodes
Surface Mount – 4000W > 4.0SMDJ24A
Part Numbering System
Part Marking System
4.0SMDJ 24 A
Cathode Band
F
(for Uni-directional products only)
5% VBR VOLTAGE TOLERANCE
Littelfuse Logo
XXX
4PEZ
YMXXX
VR VOLTAGE
SERIES
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging Options
Part number
Component
Package
4.0SMDJ24A
DO-214AB
Packaging
Option
Quantity
3000
Tape & Reel - 16mm tape/13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
0.63
(16.0)
Cathode
0.315
(8.0)
Optional
7” 7.0 (187)
13” 13.0 (330)
0.80 (20.2)
Arbor Hole Dia.
0.65
(16.4)
4.0SMDJ24A
0.059 DIA
(1.5)
Cover tape
Dimensions are in inches
(and millimeters).
Direction of Feed
5
190
©2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/09/14