BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
274 & 281 SERIES
Material: Aluminum,
Black Anodized
Standard
P/N
274-1AB
274-1ABE-01
274-1ABE-02
274-2AB
274-2ABE-01
274-2ABE-02
274-3AB
274-3ABE-01
274-3ABE-02
281-1AB
281-2AB
Height Above
PC Board
in. (mm)
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
Low-Cost, Low-Height Wavesolderable Heat Sinks
Footprint
Dimensions
in. (mm)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
MECHANICAL DIMENSIONS
Mounting
Configuration
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vertical
Vertical
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
274-XAB-02
281 SERIES
Dimensions: in. (mm)
2
Mounting
Style
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
274 SERIES
274-XAB-01
274 SERIES
Solderable
Tab Options
No Tab
01
02
No Tab
01
02
No Tab
01
02
No Tab
No Tab
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
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