ETC 236-150AB-10

Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D 2PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
217-36CT6 G
.390 (9.9)
217-36CTT6
.390 (9.9)
217-36CTR6G
.390 (9.9)
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
Footprint
Dimensions
in. (mm)
Package
Format
Package
Quantity
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Bulk
Tube
Tape & Reel
1
20
250
217 HEAT SINK WITH
DDPAK DEVICE
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Power Dissipation. W
L Device only, NC
KEY:
R Device + HS, NC
G Device + HS, 100 lfm l Device + HS, 200 lfm
r Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
TAPE DETAILS
217-36CTR6
REEL DETAILS
All other products, please contact factory for price, delivery, and minimums.
Dimensions: in.
30
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D 2PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS
BOARD LAYOUT RECOMMENDATIONS
217 SERIES
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESDMaterial with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
217-36CT6
Dimensions: in.
230 AND 234 SERIES
Standard
P/N
PATENT PENDING
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuation
Solderable
Tab
Option
Mounting
Style
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
No Tab
01
05
10
No Tab
01
05
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
230-75AB G
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75AB-01
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75AB-05
.500 (12.7)
.750 (19.1) x .570 (14.5)
230-75AB-10
.875 (22.2)
.570 (14.5) x .500 (12.7)
234-75AB
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75AB-01
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75AB-05
.500 (12.7)
.790 (20.0) x .570 (14.5)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
230-75AB-01
230-75AB-10
TO-220
230 AND 234 SERIES
230-75AB-05
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
230 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
234 SERIES
234-75AB
234-75AB-01
234 SERIES
234-75AB-05
Dimensions: in. (mm)
G Normally stocked
31
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 AND 236 SERIES
Standard
P/N
PATENT PENDING
Self-Locking Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
TO-220
Mounting
Solderable
Configuration Tab Options
233-60AB G
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60AB-01
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60AB-05
.500 (12.7) .600 (15.2) x .570 (14.5)
233-60AB-10 G
.725 (18.4) .570 (14.5) x .500 (12.7)
236-150AB
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150AB-01
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150AB-05 G
.500 (12.7) 1.500 (38.1) x .570 (14.5)
236-150AB-10
1.625 (41.3) .570 (14.5) x .570 (12.7)
Material: Aluminum, Black Anodized
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
Vetrical
No Tab
01
05
10
No Tab
01
05
10
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
233 AND 236 SERIES
233-60AB-01
236-150AB-01
233-60AB-10
236-150AB-10
233-60AB-05
236-150AB-05
236-150AB
Dimensions: in. (mm)
233-60AB
275 AND 231 SERIES
Standard
P/N
PATENT 5381041
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above
PC Board
in. (mm)
275-75AB
275-75AB-01
275-75AB-10
231-69PAB
231-69PAB-13H
231-69PAB-XXX
231-75PAB
231-75PAB-13H
(14V G) 231-75PAB-XXX
231-137PAB
231-137PAB-13H
(15VG) 231-137PAB-XXX
Footprint
Dimensions
in. (mm)
.750 (19.1)
.750 (19.1)
.875 (12.7)
.690 (18.4)
.400 (38.1)
.690 (38.1)
.750 (12.7)
.400 (41.3)
.750 (34.9)
1.375 (10.2)
.400 (10.2)
1.375 (10.2)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.835 (21.2) x .400 (12.7)
.690 (17.5) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.750 (19.1) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2 x .400 (12.7)
1.375 (34.9) x .835 (12.7)
.835 (21.2) x .400 (12.7)
Mounting
Solderable
Configuration Tab Options
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
No Tab
01
10
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
Mounting
Style
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
44 C @ 2W
44°C @ 2W
44°C @ 2W
45°C @ 2W
45°C @ 2W
45°C @ 2W
43°C @ 2W
43°C @ 2W
43°C @ 2W
32°C @ 2W
32°C @ 2W
32°C @ 2W
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
275 AND 231 SERIES
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 13H
All versions No Tab
TAB
14V
TAB
13V
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 01
TAB 10
TAB 15V
TAB 13H
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
32
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES
Standard
P/N
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vert./Horiz.
Vertical
Horizontal
Vertical
No Tab
01
05
10
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
235-85AB G
.850 (21.6) 1.000 (25.4) x .500 (12.7)
235-85AB-01
.850 (21.6) 1.000 (25.4) x .500 (12.7)
235-85AB-05
.500 (12.7)
.850 (21.6) x1.000 (25.4)
235-85AB-10
.975 (24.8) 1.000 (25.4) x .500 (12.7)
Material: Aluminum, Black Anodized
PATENT 5381041
235-85AB
TO-220
MECHANICAL DIMENSIONS
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
6.8°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
235 SERIES
235-85AB-05
235-85AB-01
235-85AB-10
Dimensions: in. (mm)
243 SERIES
Standard
P/N
Labor-Saving Clip-On Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
TO-220
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vert./Horiz.
Verl./Horiz.
No Tab
No Tab
Clip
Clip
243-1PAB
1.000 (25.4)
.800 (20.3) x .270 (6.9)
243-3PAB G
.800 (20.3)
.800 (20.3) x .270 (6.9)
Material: Aluminum, Pre-anodized Black
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
50°C@ 2W
78°C@ 2W
4.5°C/W @ 400 LFM
8.2°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
243 SERIES
SECTION A-A
VIEW B-B
Dimensions: in. (mm)
239 SERIES
Standard
P/N
Snap-Down Self-Locking Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
239-75AB
.750 (19.1)
1.120 (28.4) x .435 (11.0)
239-75AB-03
.750 (19.1)
1.120 (28.4) x .435 (11.0)
239-75AB-04
.750 (19.1)
1.120 (28.4) x .435 (11.0)
Material: Aluminum, Black Anodized
PATENT PENDING
MECHANICAL DIMENSIONS
239-75AB
TO-220
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vert./Horiz
Vertical
Vertical
No Tab
03
04
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
239 SERIES
SECTION A-A
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
38°C @ 2W
38°C @ 2W
38°C @ 2W
6°C/W @ 400 LFM
6°C/W @ 400 LFM
6°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
239-75AB-03
239-75AB-04
Dimensions: in. (mm)
G Normally stocked
33
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
PC Board
in. (mm)
Standard
P/N
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Vert./Horiz.
Vertical
Vertical
No Tab
01
02
Mtg Hole
Mtg Hole
Mtg Hole
49°C @ 2W
49°C @ 2W
49°C @ 2W
273-AB G
.375 (9.5)
.750 (19.1) x .750 (19.1)
273-AB-01
.375 (9.5)
.750 (19.1) x .750 (19.1)
273-AB-02
.375 (9.5)
.750 (19.1) x .750 (19.1)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
TO-218, TO-220
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
273 SERIES
273-AB
273-AB-01
273-AB-02
Dimensions: in. (mm)
274 SERIES
Material: Aluminum,
Black Anodized
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above
Standard
PC Board
P/N
in. (mm)
274-1AB G
.375 (9.5)
274-1AB-01 G .375 (9.5)
274-1AB-02
.375 (9.5)
274-2AB G
.500 (12.7)
274-2AB-01
.500 (12.7)
274-2AB-02
.500 (12.7)
274-3AB G
.250 (6.4)
274-3AB-01
.250 (6.4)
274-3AB-02
.250 (6.4)
281-1AB
.375 (9.5)
281-2AB
.500 (12.7)
Footprint
Dimensions
in. (mm)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
MECHANICAL DIMENSIONS
Mounting
Configuration
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Vertical
Vertical
Vertical
Vertical
TO-220
Solderable
Tab Options
No Tab
01
02
No Tab
01
02
No Tab
01
02
No Tab
No Tab
Mounting
Style
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
274 SERIES
274-XAB-02
274-XAB-01
274 SERIES
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
62°C @ 2W
9.0°C/W @ 400 LFM
56°C @ 2W
8.0°C/W @ 400 LFM
50°C @ 2W
7.0°C/W @ 400 LFM
281 SERIES
Dimensions: in. (mm)
240 SERIES
Standard
P/N
Labor-Saving Twisted Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
TO-220
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vertical
Vertical
22
22
Clip/Mtg Hole
Clip/Mtg Slot
240-118ABH-22 G 1.180 (30.0)
1.000 (25.4) x .500 (12.7)
240-118ABS-22
1.180 (30.0)
1.000 (25.4) x .500 (12.7)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
240 SERIES
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
55°C @ 4W
55°C @ 4W
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
240-118ABS-22
240-118ABH-22
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
34
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES
Standard
P/N
Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Vertical
22
Mtg Hole
48°C @ 2W
242-125AB-22 1.285 (32.6)
.875 (22.2) x .250 (6.4)
Material: Aluminum, Black Anodized
242-125AB-22
TO-220
MECHANICAL DIMENSIONS
242 SERIES
6.2°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
232 AND 238 SERIES
Material: Aluminum,
Black Anodized
Staggered Fin Heat Sinks for Vertical Mounting
TO-202, TO-220
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
232-200AB
232-200AB-23
238-200AB
238-200AB-23
2.000 (50.8)
2.000 (50.8)
2.000 (50.8)
2.000 (50.8)
1.380 (35.1) x .500 (12.7)
1.380 (35.1) x .500 (12.7)
1.380 (35.1) x .500 (12.7)
1.380 (35.1) x .500 (12.7)
Vertical
Vertical
Verlical
Verlical
2, Twisted
2, Solderable
2, Twisted
2, Solderable
Clip/Mtg Hole
Clip/Mtg Hole
Mtg Slot
Mtg Slot
MECHANICAL DIMENSIONS
232-200AB
238-200AB
232-200AB-23
238-200AB-23
238 SERIES
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
48°C @ 4W
48°C @ 4W
48°C @ 4W
48°C @ 4W
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
3.3°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
232 AND 238 SERIES
Dimensions: in. (mm)
251 SERIES
Standard
P/N
Slim-Profile Heat Sinks With Integral Clips
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
251-62AB
.620 (15.7)
.910 (23.1) x .380 (9.7)
251-80AB
.845 (21.5)
.910 (23.1) x .380 (9.7)
251-80AB-19
.875 (22.2)
.910 (23.1) x .380 (9.7)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
251-62AB
15 Lead Multiwatt
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vert./Horiz.
Vert./Horiz.
Vertical
No Tab
No Tab
19
Clip
Clip
Clip
66°C @ 3W
64°C @ 3W
64°C @ 3W
66°C/W @ 400 LFM
66°C/W @ 400 LFM
66°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
251 SERIES
251-80AB
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
251-80AB-19
Dimensions: in. (mm)
G Normally stocked
35
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
244 SERIES
Standard
P/N
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Vert/Horiz,
Vertical
No Tab
50
244-145AB
1.450 (36.8) 1.300 (33.0) x 480 (12.1)
244-145AB-50
1.650 (41.9) 1.300 (33.0) x 480 (12.1)
Material: Aluminum, Black Anodized
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
44°C @ 4W
44°C @ 4W
4.4°C/W @ 400 LFM
4.4°C/W @ 400 LFM
Weight
lbs. (grams)
.0160 (7.25)
.0170 (7.20)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
245 SERIES
Standard
P/N
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Ver.t/Horiz.
Vertical
No Tab
50
245-145AB
1.450 (36.8)
1.750 (44.5) x .380 (9.7)
245-145AB-50
1.650 (41.9)
1.750 (44.5) x .380 (9.7)
Material: Aluminum, Black Anodized
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
38°C @ 4W
38°C @ 4W
3.2°C/W @ 400 LFM
3.2°C/W @ 400 LFM
Weight
lbs. (grams)
.0160 (7.25)
.0170 (7.20)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
246 SERIES
Standard
P/N
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
246-197AB
1.968 (50.0)
1.986 (50.4) x 3.75 (9.5)
Vert./Horiz.
246-197AB-50
2.168 (55.1)
1.986 (50.4) x 3.75 (9.5)
Vertical
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Solderable
Tab Options
No Tab
50
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
35°C @ 4W
35°C @ 4W
2.8°C/W @ 400 LFM
2.8°C/W @ 400 LFM
Weight
lbs. (grams)
.0240 (10.90)
.0250 (11.40)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
36
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS
247 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
247-195AB
1.950 (49.5) 1.900 (48.3) x .950 (24.1)
Vert./Horiz.
247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1)
Vertical
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Solderable
Tab Options
No Tab
50
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
25°C@ 4W
25°C@ 4W
Weight
lbs. (grams)
2.4°C/W @ 400 LFM
2.4°C/W @ 400 LFM
.0330 (15.10)
.0340 (15.60)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
248 SERIES
Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Vert/Horiz.
Vertical
No Tab
50
248-162AB
1.620 (41.1) 2.000 (50.8) x .750 (19.1)
248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1)
Order SpeedClip™ 285SC or 330SC separately.
Material: Aluminum, Black Anodized
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
35°C @ 4w
35°C @ 4w
Weight
lbs. (grams)
2.5°C/W @ 400 LFM
2.5°C/W @ 400 LFM
.026 (11.60)
.027 (12.20)
Order SpeedClips™ separatley for use
with Series 246, 247, 248 or 249
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
249 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
Mounting
Configuration
249-113AB
1.130 (28.7) 1.900 (48.3) x .950 (24.1)
Vert./Horiz,
249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1)
Vertical
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
Solderable
Tab Options
No Tab
50
MULTIWATT
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
35°C@ 4W
35°C@ 4W
3.29°C/W @ 400 LFM
3.29°C/W @ 400 LFM
Weight
lbs. (grams)
.020 (8.90)
.021 (9.40)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
G Normally stocked
37
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
288 SERIES
Compact Wave-Solderable Low-Cost Heat Sinks
Standard
P/N
Height Above
PC Board
in. (mm)
Maximum
Footprint
in. (mm)
288-1AB G
1.250 (31.8)
0.875 (22.2) x 0.215 (5.5)
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC
TO-220, TO-202
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
85°C @ 4W
12°C/W @ 200 LFM
Weight
lbs. (grams)
0.0057 (2.59)
board space is available. The 288-1AB is a stamped aluminum heat sink, black
anodized, designed for applications requiring good heat dissipation from a heat
sink occupying minimum space, available at minimum cost.
288 SERIES
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
271 SERIES
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
Standard
P/N
Height Above
Semiconductor Case
in. (mm)
Horizontal
Mounting Footprint
Dimensions
in. (mm)
271-AB G
0.500 (12.7)
1.750 (44.5) x 0.700 (17.8)
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
62°C @ 4W (NOTE A)
31 °C @ 4W (NOTE B)
5.1°C/W @ 400 LFM
1.8°C/W 400 LFM (NOTE B)
Weight
lbs. (grams)
0.0052 (2.36)
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for
improved performance.
MECHANICAL DIMENSIONS
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown
with (2) 271-AB types added to (1) 272-AB type.
271 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
38
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
270/272/280 SERIES
Standard
P/N
Small Footprint Low-Cost Heat Sinks
Height Above
PC Board
in. (mm)
Horizontal Mounting
Maximum Footing
in. (mm)
Solderable
Tab Options
270-AB G
0.375 (9.4)
1.750 (44.5) x 0.700 (17.8)
272-AB G
0.375 (9.4)
1.750 (44.5) x 1.450 (36.8)
280-AB
0.375 (9.4)
1.750 (44.5) x 0.700 (17.8)
Material: Aluminum, Black Anodized
—
01,02
—
These exceptionally low-cost heat sinks can be mounted horizontally under a
TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4).
For added performance, a 271 Series heat sink can also be used for double-sided heat dissi-
TO-220, TO-202
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Weight
lbs. (grams)
70°C @ 4W
42°C @ 4W
70°C @ 4W
0.0052 (2.36)
0.0105 (5.72)
0.0048 (2.18)
6.0°C/W @ 400 LFM
3.6°C/W @ 400 LFM
6.0°C/W @ 400 LFM
pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for
two power semiconductors. Specify solderable tab options for the 272 Series by the addition
of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
270 SERIES
280 SERIES
272AB01
272 SERIES
272AB02
Dimensions: in. (mm)
289 AND 290 SERIES
Standard
P/N
Low-Cost Single or Dual Package Heat Sinks
Height Above
PC Board
in. (mm)
289-AB G
0.500 (12.7)
289-AP
0.500 (12.7)
290-1AB G
0.500 (12.7)
290-2AB G
0.500 (12.7)
Material: Aluminum, Black Anodized
Horizontal Mounting
Maximum Footing
in. (mm)
1.000 (25.4) x O.710 (18.1)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 1.180 (30.0)
1.000 (25.4) x 1.180 (30.0)
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate
one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with
289 SERIES
MECHANICAL DIMENSIONS
TO-218, TO-202, TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Weight
lbs. (grams)
50°C @ 2W
50°C @ 2W
44°C @ 2W
44°C @ 2W
0.0055 (2.49)
0.0055 (2.49)
0.0082 (3.72)
0.0081 (3.67)
44°C/W @ 400 LFM
44°C/W @ 400 LFM
35°C/W @ 400 LFM
35°C/W @ 400 LFM
no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
290 SERIES
Dimensions: in. (mm)
G Normally stocked
39
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES
High-Performance Slim Profile Heat Sinks With Integral Clips
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
250-122AB
1.220 (31.0)
1.000 (25.4) x .500 (12.7)
250-122AB-09 G 1.220 (31.0)
1.000 (25.4) x .500 (12.7)
250-122AB-25
1.380 (35.1)
1.000 (25.4) x .500 (12.7)
Material: Aluminum, Black Anodized
250 SERIES
MECHANICAL DIMENSIONS
Multiwatt
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
Vert./Horiz.
Vertical
Vertical
No Tab
09
25
Clip
Clip
Clip
250-122AB-09
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
50°C @ 4W
50°C @ 4W
50°C @ 4W
3.7°C/W @ 400 LFM
3.7°C/W @ 400 LFM
3.7°C/W @ 400 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
250-122AB-25
250-122AB
Dimensions: in. (mm)
237 AND 252 SERIES
High-Performance, High-Power Vertical Mount Heat Sinks
Height Above
PC Board
in. (mm)
Standard
P/N
Footprint
Dimensions
in. (mm)
Mounting
Configuration
Solderable
Tab Options
Mounting
Style
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
237-167AB2
1.675 (42.5)
1.000 (25-4) x 1.000 (25.4)
Vertical
2, Twisted
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
237-167AB3
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
3, Twisted
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
237-167AB2-24 1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Solderable
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
252-167AB2
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Twisted
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
252-167AB3
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
3, Twisted
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
252-167AB2-24 1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Solderable
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
227-167
252-167
237-167AB2
252-167AB2
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
237-167AB2-24
252-167AB2-24
237 AND 252 SERIES
237-167AB3
252-167AB3
237 AND 252 SERIES
237-167AB3
252-167AB3
291 SERIES
Standard
P/N
Dimensions: in. (mm)
Labor-Saving Clip-on Heat Sinks
Height Above
PC Board
in. (mm)
TO-220
Vertical
Mounting Footprint
Dimensions
in. (mm)
Mounting
Style
291-C236AB
0.860 (21.)9
1.100 (27.0) x 0.360 (9.1)
291-H36AB G
0.860 (21.9)
1.100 (27.0) x 0.360 (9.1)
Material: Aluminum, Black Anodized
Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks
employ a unique clip for attachment of TO-220 case styles.
TO-220 (Clip)
TO-220 (Mtg. Hole)
80° C @ 2W
68° C @ 2W
24°C/W @ 600 LFM
16°C/W @ 600 LFM
Weight
lbs. (grams)
0.0026 (1.18)
0.0026 (1.18))
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting
hole only.
291 SERIES
MECHANICAL DIMENSIONS
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
291-C2
All other products, please contact factory for price, delivery, and minimums.
291-H
40
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
286 SERIES
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Standard
P/N
Height Above
PC Board
in. (mm)
Maximum Footprint
in. (mm)
Material
286-AB G
286-CBT G
286-CT
1.190 (30.2)
1.190 (30.2)
1.190 (30.2)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
Aluminum, Anodized
Copper, Black
Copper, Tinned
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
MECHANICAL DIMENSIONS
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
58°C @ 4W
58°C @ 4W
58°C @ 4W
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
Weight
lbs. (grams)
0.0085 (3.86)
0.0250 (11.34)
0.0250 (11.34)
ty. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
286 SERIES
Dimensions: in. (mm)
287 SERIES
Wave-Solderable Low-Cost Heat Sinks
Standard P/N
Mounting Slot Mounting Hole
Height Above
PC Board
in. (mm)
287-1AB G
287-1ABH G
1.180 (30.0)
287-2AB G
287-2ABH G
1.180 (30.0)
Material: Aluminum, Black Anodized
TO-220
Maximum
Footprint “A”
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
65°C @ 4W
55°10 @ 4W
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
Weight
lbs. (grams)
0.0090 (4.08)
0.0140 (6.35)
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
MECHANICAL DIMENSIONS
287 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Standard P/N
287-1AB
287-2AB
287-1ABH
287-2ABH
Dim. “A”
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
Dimensions: in. (mm)
695 SERIES
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
Standard
P/N
Maximum
Width
in. (mm)
Height
in. (mm)
695-1B G
1.330 (33.8)
0.530 (13.7)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
72°C @ 4.0W
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
MECHANICAL
DIMENSIONS
STUD-MOUNT
5.2°C/W @ 400 LFM
Weight
lbs. (grams)
0.0030 (1.36)
provides good heat dissipation for use where height is limited above the printed circuit board or base plate.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
695 SERIES
Dimensions: in. (mm)
G Normally stocked
41
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
256 SERIES
Thermal Retainers
Height (Less
Mounting Tab)
in. (mm)
0.190 (4.0)
Standard
P/N
256-DM G
260 SERIES
256-DM
Material
Beryllium Copper
Weight
lbs. (grams)
0.0005 (0.23)
Cup Clips for TO-5 Case Style Semiconductors
Characteristics
TO-5
Thermal Resistance – Epoxy Insulated
Thermal Resistance – Beryllium Oxide Insulated
Breakdown Voltage – Epoxy Type (VAC), 60 Hz
Breakdown Voltage – Beryllium Type (VAC), 60 Hz
Recommended Operating Voltage, AC or DC
Clean Conditions: % Hipot Rating
Dusty Conditions: % Hipot Rating
Dirty Conditions: % Hipot Rating
Temperature Range — Continuous (C°)
14° C/W
16° C/W
500
1000
50
30
10 to 20
-73/+149
TO-5
Model
Depth of
Tapped Base
260-4T5E
260-4TH5E
260-4TH5B
0.093 (2.36)
0.125 (3.18)
0.125 (3.18)
Thread
Size:
Mounting
Style:
TO-92
4
6
10
T
S
P
=
=
=
=
=
=
#4-40 UNC
#6-32 UNC
#10-32 UNF
tapped
stud
plain
Base Style:
Semiconductor
Case Style:
Insulation
Type:
H = hex
5 = TO-5
E = epoxy
B = beryllium
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE
Standard
P/N
260-4T5E G
260-4TH5E G
260-6SH5E G
260-1OSH5E
260-4TH5B G
260-6SH5B G
260-10SH5B
Insulation
Type
Outline Dimension
L x W x I.D.
in. (mm)
Weight
lbs. (grams)
Case
Style
Epoxy Insulated
Epoxy Insulatad
Epoxy Insulated
Epoxy Insulated
Beryllium Oxide Insulated
Beryllium Oxide Insulated
Beryllium Oxide Insulated
0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)
0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.0024 (1.09)
0.0031 (1.41)
0.0037 (1.68)
0.0042 (1.91)
0.0042 (1.91)
0.0039 (1.77)
0.0043 (1.95)
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide
Base Mounting Configurations — TO-5
Plain Type — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care
should be taken not to use too long a screw, which could short against the
semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
To determine the correct mounting screw lengths, add dimensions as follows:
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not
supplied. Stud hole must be slightly countersunk to ensure flat mounting.
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Epoxy Insulated For TO-5
G 260-4T5E
Beryllium Oxide Insulated For TO-5
G 260-4TH5E
All other products, please contact factory for price, delivery, and minimums.
260-6SH5E
260-10SH5E
42
G 260-4TH5B
G 260-6SH5B
260-10SH5B
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
200 SERIES
High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors
Single-Level Star
201, 202,204,205, 211 Series
Available
Standard P/N
& Finish
Types
G 201CB, 201AB
202CB
203CB
204CB G, 204SB
205CB G, 205SB
205AB, 205AP
207CB G, 207SB G
207AB G, 207AP
209CB, 209SB
211CB
213CB, 213SB
213AB, 213AP
215CB, 215AB
215AP
Dual-Level Star
203,207,213 Series
Dual-Level Sunburst
209, 215 Series
Semiconductor
Case Diameter
Min/Max
in. (mm)
Heat Sink
Inside Dia.
“A”
in. (mm)
Heat Sink
Outside Dia.
“B”
in. (mm)
Heat Sink
Height
“C”
in. (mm)
Natural
Convection
Forced
Case Rise
Convection
Above Ambient ([email protected] LFM)
0.161 (4.1)/0.240 (6.1)
0.161 (4.1)/0.240 (6.1)
0.161 (4.1)/0.240 (6.1)
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0,275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0.275 (7.0)/0.370 (9.4)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.440 (11.2)/0.544 (13.8)
0.150 (3.8)
0.150 (3.8)
0.150 (3.8)
0.255 (6.5)
0.255 (6.5)
0.255 (6.5)
0.255 (6,5)
0.255 (6.5)
0.255 (6.5)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.420 (10.7)
0.640 (16.2)
0.490 (12.5)
0.640 (16.2)
0.550 (4.8)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
0.720 (18.3)
1.280 (32.5)
0.830 (21.1)
0.830 (21.1)
0.830 (21.1)
1.400 (35.6)
1.400 (35.6)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
0.187 (4.8)
0.187 (4.8)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
0.437 (11.1)
0.187 (4.8)
0.375 (9.5)
0.375 (9.5)
0.437 (11.1)
0.437 (11.1)
65°C @ 1W
73°C @ 1W
53°C @ 1W
68°C @ 1W
59°C @ 1W
68°C @ 1W
46°C @ 1W
53°C @ 1W
30°C @ 1W
50°C @ 1W
44°C @ 1W
51°C @ 1W
28°C @ 1W
32°C @ 1W
31°C/W
43°C/W
23°C/W
35°C/W
28°C/W
28°C/W
20°C/W
20°C/W
13°C/W
24°C/W
19°C/W
19°C/W
15°C/W
15°C/W
Applicable
Power
Semiconductor
Case Types
Materials and
Finishes Available
for 200 Series:
TO-18, TO-24, TO-28,
TO-40, TO-44
CB
TO-5, TO-9, TO-11,
TO-12, TO-26, TO-29,
TO-33, TO-43, TO-45
SB
AB
AP
TO-8, TO-38
Beryllium copper; black ebonol
"C" Finish
Silver-bearing
copper; black
ebonol "C"
Aluminum, black
anodized
Aluminum, no
finish applied
NATURAL AND FORCED CONVECTION CHARACTERISTICS
258 SERIES
Thermal Links for Fused Glass Diodes
Standard
P/N
258 G
DIODES
Dimensions
in. (mm)
Weight
lbs. (grams)
Material
Finish
0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6)
Aluminum
DeltaCoate™ 151 on all surfaces
except solder pads and base
0.0018 (0.82)
MECHANICAL DIMENSIONS
The thermal resistance from diode leads to chassis
or heat sink is 12°C/watt, when unit is mounted
with TYPE 120 Joint Compound. If a 10°C/watt
chassis or sink to ambient impedance is available,
the thermal resistance from the diode leads to
ambient is reduced from about 150°C/watt to
22°C/watt.
292 SERIES
258 SERIES
Dimensions: in. (mm)
Heat Sink for Single TO-92
TO-92
Standard
P/N
Height Above
PC Board
in. (mm)
Overall
Fin Width
in. (mm)
Thermal Performance
Natural Convection
Finish
Weight
lbs. (grams)
292-AB G
0.750 (19.1)
0. 600 (15.3)
0.225° C/W @ 0.250 W
Black Anodized
0.00049 (0.22)
Power semiconductors packaged in a TO-92 style
plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat
sink. The 292-AB is effective over the typical power
range of such devices. Material: Aluminum, Black
Anodized.
MECHANICAL
DIMENSIONS
292 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
G Normally stocked
43
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Standard
P/N
Plain Pin
Without Pin
634-10ABP G
634-10AB
634-15ABP
634-15AB
634-20ABP G
634-20AB
Material: Aluminum, Black Anodized.
Height Above
PC Board
in. (mm)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave-
MECHANICAL DIMENSIONS
TO-220 and TO-218
Footprint
Dimensions
in. (mm)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
Weight
lbs. (grams)
0.016 (7.48)
0.025 (11.21)
0.033 (14.95)
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
634 SERIES
TYPICAL THERMAL PERFORMANCE
FOR 634-15ABP
Notes:
1. Thermal compound is
assumed between device
and heat sink.
2. Tab temp with longer heat
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
Dimensions: in. (mm)
637 SERIES
Standard
P/N
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
637-10ABP G
1.000 (25.4)
637-15ABP G
1.500 (38.1)
637-20ABP G
2.000 (50.8)
637-25ABP G
2.500 (63.5)
Material: Aluminum, Black Anodized
Maximum Footprint
in. (mm)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards.
Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight
MECHANICAL DIMENSIONS
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Weight
lbs. (grams)
76°C @ 6W
65°C @ 6w
55°C @ 6W
48°C @ 6W
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
and board space occupied must be minimized. Refer to the Accessory products section for
thermal interface materials, thermal compounds, and other accessories products.
637 SERIES
(EXTRUSION PROFILE 5183)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
44
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
626 AND 627 SERIES
Standard
P/N
High-Efficiency Heat Sinks for Vertical Board Mounting
Standard
P/N
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
626-10ABP
627-10ABP
1.000 (25.4)
626-15ABP
627-15ABP
1.500 (38.1)
626-20ABP
627-20ABP
2.000 (50.8)
626-25ABP
627-25ABP
2.500 (63-5)
Wave-solderable pins. Material: Aluminum, Black Anodized
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
76°C @ 6W
65°C @ 6W
55°C @ 6W
48°C @ 6W
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/M @ 200 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
626 AND 627 SERIES
MECHANICAL DIMENSIONS
TO-218, TO-220
Dimensions: in. (mm)
657 SERIES
Standard
P/N
High-Performance Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
657-10ABP G
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABP G
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABP G 2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABP G
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
TO-220, TO-247, TO-218
657 SERIES
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
Weight
lbs (grams)
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
46
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES
Standard
P/N
High-Performance Notched Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
657-10ABPN
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABPN G
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABPN
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABPN
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
TO-220, TO-247, TO-218
657 SERIES
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
657 SERIES
Standard
P/N
High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
657-10ABPSC
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
657-15ABPSC
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
657-20ABPSC
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
657-25ABPSC G
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
TO-220, TO-247, TO-218
657 SERIES
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
657 SERIES
(EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
677 SERIES
Standard
P/N
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
in. (mm)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
677-10ABP
1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
677-15ABP
1.500 (38.1)
1.650 (41.9) x 1.000 (25.4)
677-20ABP
2.000 (50.8)
1.650 (41.9) x 1.000 (25.4)
677-25ABP
2.500 (63.5)
1.650 (41.9) x 1.000 (25.4)
Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
677 SERIES
TO-218, TO-220, TO-247
15-LEAD Multiwatt
52°C @ 6W
46°C @ 6W
40°C @ 6W
35°C @ 6W
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
2.5°C/W @ 200 LFM
2.2°C/W @ 200 LFM
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
677 SERIES
(EXTRUSION PROFILE 8719)
Dimensions: in. (mm)
G Normally stocked
47
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
690 SERIES
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above
PC Board
in. (mm)
Standard
P/N
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
Outline Dimensions
in. (mm)
690-3B G
1.310 (33.3)
690-66B
1.310 (33.3)
690-220B
1.310 (33.3)
Material: Aluminum, Black Anodized
1.860 (47.2)-sq
1.860 (47.2)-sq
1.860 (47.2)-sq
44°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power
TO-3, TO-66, TO-220
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
Semiconductor
Mounting
Hole Pattern
Weight
lbs. (grams)
(1) TO-3
(1) TO-66
(2) TO-220
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
690 SERIES
TO-66
TO-3
*TWO TO-220’S
Dimensions: in. (mm)
680 SERIES
Standard
P/N
Maximum Efficiency Omnidirectional Heat Sinks
Height Above
PC Board “A”
in. (mm)
Horizontal Mounting
Footprint Dimensions
in. (mm)
680-5A G
0.500 (12.7)
680-75A G
0.750 (19.1)
680-10A G
1.000 (25.4)
680-125A G
1.250 (31.8)
680-5220
0.500 (12.7)
680-75220
0.750 (19.1)
680-10220 G
1.000 (25.4)
680-125220 G
1.250 (31.8)
Material: Aluminum, Black Anodized
MECHANICAL
DIMENSIONS
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
70°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
7O°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
Achieve optimum natural convection cooling per unit volume occupied above the printed
circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style
cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation
TO-3, TO-220
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
Semiconductor
Mounting
Hole Pattern
Weight
lbs. (grams)
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
680 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
220
A
K
Dimensions: in. (mm)
TO-3
All other products, please contact factory for price, delivery, and minimums.
*TWO TO-220’S
48
G Normally stocked
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
601 AND 603 SERIES
Low-Height Heat Sinks
Footprint
Dimensions
in. (mm)
Standard
P/N
601E
2.000 (50.8) x 1.250 (31.8)
601F
2.000 (50.8) x 1.250 (31.8)
601K
2.000 (50.8) x 1.250 (31.8)
603K
2.000 (50.8) x 2.000 (50.8)
Material: Aluminum Alloy, Black Anodized
DO-4/DO-5 Diodes
Height
in. (mm)
Mounting
Hole Dia.
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.562 (14.3)
0.200 (5.1)
0.270 (6.9)
None
None
52°C @ 5.0W
52°C @ 5.0W
52°C @ 5.0W
41°C @ 5.0W
Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.5°C/W @ 175 LFM
4.0°C/W @ 175 LFM
Weight
lbs. (grams)
0.0500 (22.68)
0.0500 (22.68)
0.0500 (22.68)
0.0810 (36.74)
heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
603 SERIES
(EXTRUSION PROFILE 1284)
601 SERIES
(EXTRUSION PROFILE 1284)
SEMICONDUCTOR MOUNTING HOLES
K
E
F
Dimensions: in. (mm)
635 SERIES
Standard
P/N
Space-Saving Low-Cost Heat Sinks
Height Above
PC Board “A”
in. (mm)
TO-3
Outline
Dimensions
in. (mm)
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
635-5B2
0.500 (12.7)
1.900 (48.3) x 1.420 (36.0)
635-75B2
0.750 (19.1)
1.900 (48.3) x 1.420 (36.0)
635-10B2
1.000 (25.4)
1.900 (48.3) x 1.420 (36.0)
635-125B2
1.250 (31.8)
1.900 (48.3) x 1.420 (36.0)
Material: Aluminum Alloy, Black Anodized
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is
90°C @ 8.0W
77°C @ 8.0W
61°C @ 8.0W
53°C @ 8.0W
Semiconductor
Mounting
Hole Pattern
Weight
lbs. (grams)
TO-3
TO-3
TO-3
T0-3
0.0200 (9.07)
0.0220 (9.98)
0.024 (10.89)
0.028 (12.70)
6.0°C/W @ 300 LFM
4.8°C/W @ 300 LFM
3.6°C/W @ 300 LFM
3.1°C/W @ 300 LFM
available for heat sinking. Four different heights are available, all with TO-3 mounting hole
pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
635 SERIES
Dimensions: in. (mm)
G Normally stocked
49
All other products, please contact factory for price, delivery, and minimums.