EnviroMark® 828 Low-Voiding Lead-Free Water

EnviroMark 828
Low-Voiding Lead-Free Water-Soluble Solder Paste
Product Description
Physical Properties
Kester EnviroMark 828 is a lead-free, water-soluble
solder paste formulated specifically to reduce
voiding behavior that is common with lead-free
solder paste products. EM828 represents a
break-through in water-soluble solder paste
technology with the combination of low voiding,
excellent wetting behavior and ease of cleaning.
Additionally, EM828 is extremely stable in the
stencil printing process, regardless of print speed,
idle time and throughput. EM828 provides
tremendous wetting to a wide variety of board and
component finishes in order to simplify your
transition to lead-free processes.
(Data given for Sn96.5 Ag3.0 Cu0.5, 89.5% metal, -325+500 mesh)
Viscosity (typical): 1700 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 40 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Preferred
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Low-voiding underneath area array components
Excellent wetting on a variety of metallizations
Residues are easily removed in hot DI water
Long stencil life and tack time (process
Tremendous brick definition and slump resistance for reduction of bridging defects
Print speed up to 150 mm/sec (6 in/sec)
Capable of breaks in printing of up to 60
minutes without any kneading
Classified as ORH1 per J-STD-004A
Reliability Properties
Copper Mirror Corrosion: High
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method
Standard Applications
89.5% Metal – Stencil Printing
89.5% Metal – Enclosed Head Printing
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
Day 1
Day 4
Day 7
1.5 ×10 Ω
1.3 ×109 Ω
9.5 ×108 Ω
9.0 × 108 Ω
9.8 × 108 Ω
1.2 × 109 Ω
Application Notes
Kester EM828 is available in the Sn96.5Ag3.0Cu0.5 alloy with Type 3 and Type 4 powder. Type 3 powder
mesh is recommended, but Type 4 powder is available for finer pitch applications. For specific packaging
information see Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination
depends on process variables and the specific application.
Printing Parameters:
Squeegee Blade
Squeegee Speed
Stencil Material
80 to 90 durometer polyurethane or stainless steel
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated, Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Kester Reflow Profile
SAC Alloys
Recommended Reflow Profile:
Peak Temp.
235 - 255 C
Temperature (C)
The recommended reflow profile for EM828 made
with SAC alloys is shown here. This profile is
simply a guideline. Since EM828 is a highly
active solderpaste, it can solder effectively over a
wide range of profiles. Your optimal profile may be
different from the one shown based on you oven,
board and mix of defects. Please contact Kester if
you need additional profiling advice.
<2.5 C/Sec
Soaking Zone
Reflow Zone
(2.0 min.max.)
60-90 sec. typical
time above 217 C
(90 sec max)
60-75 sec. typical
Pre-heating Zone
(2.0-4.0 min. max.)
Time (sec.)
EM828 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of
soldering. De-ionized water is recommended for the final rinse. Water temperatures should be 49-60°C
(120-140°F). Kester's 5768 Bio-Kleen® saponifier can also be used in a 1-2% ratio for aqueous cleaning
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,
reflow characteristics, and overall performance. EM828 should be stabilized at room temperature prior to
printing. EM828 should be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 6
months from date of manufacture and held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143 USA
Phone: (+1) 847-297-1600 • Email: [email protected] • Website: www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
[email protected]
European Headquarters
Zum Plom 5
08541 Neuensalz
(+49) 3741 4233-0
[email protected]
Japanese Headquarters
20-11 Yokokawa 2-Chome
Tokyo 130-0003 Japan
(+81) 3-3624-5351
[email protected]
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the
potential hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used
in the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 8Jul08