PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO.: L-T69FRGBCT-SA REV: A/0 CUSTOMER’S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-7K-12-XXXX DATE : 2012-11-9 PAGE 1 of 15 PARA-FOR-065 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Features Û Û Û Û Û Û l Top view PLCC6, Wide view angle, lighting color Red & Green & Blue. EIA STD package, packing in 12mm tape on 7" diameter reels (ANSI/EIA-481-B-2001). Compatible with automatic Pick & Place equipment. Compatible with IR Reflow soldering and TTW soldering. Pb free product and acceptable lead-free process! Meet RoHS Green Product. Application Û Û Û Backlighting (Switches, keys, displays, illuminated advertising) Emergency lighting / Signal and symbol luminaries. Decorative lighting. l Package Outline Dimensions 3 6 2 1 5 4 Cathode Mark 3 G 6 2 1 R 5 B 4 Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.10mm (.004") unless otherwise noted. DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 2 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit 20 mA 100 mA R Continuous Forward Current If G B R Pulse Forward Current* Ifp G B Power Consumption Pc Electrostatic Discharge ESD R 55 G 75 B 75 R 2000 G 1000 B 1000 mW V Operating Temperature Range Topr -40~+85 ℃ Storage Temperature Range Tstg -40~+100 ℃ Reverse Voltage Vr 5 V Soldering Temperature Tsld Reflow Soldering: 240℃/10sec Hand Soldering:350℃/3sec l Electro-Optical Characteristics (Ta=25℃) Item Symbol Conditio Min R Forward Voltage Vf G If=20mA B R Dominant Wavelength λD G If=20mA B Viewing Angle 2θ 1/2 Δθ Luminous Intensity Iv G B DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 If=20mA Max 2.4 Unit 3.0 3.6 v 3.0 3.6 619 629 520 530 465 475 If=20mA R Typ 2.0 120 350 480 800 1200 190 280 DATE : 2012-11-9 nm deg mcd PAGE 3 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. l Typical Electro-Optical Characteristics Curves 1.0 Intensity (%) 0.8 0.6 0.4 0.2 0.0 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 Wavelength (nm) Relative Intensity VS Wavelength DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 4of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Typical Electro-Optical Characteristics Curves (25℃ Ambient Temperature Unless Otherwise Noted) 1200 Luminous lntensity(mcd) Forward Current(mA) 50 40 30 20 10 0 1.5 2.0 2.5 3.0 Fig.1 Forward Current vs.Forward Voltage 600 400 0 10 20 30 40 50 Forward Current(mA) Fig.2 Luminous Intensity vs.Forward Current 1000 2.0 1.5 1.0 0.5 0 10 20 30 40 50 Relative luminous intensity(%) 2.5 Relative Luminous lntensity Normalized @ 20mA 800 200 3.5 Forward Voltage(v) 1000 100 10 1 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(℃ ) Forward Current(mA) Fig.3 Relative Luminous Intensity vs.Forward Current Fig.4 Luminous Intensity vs.Ambient Temperature 0° 10° 20° 50 Forward Current IF(mA) 30° 40 30 20 10 1.0 40° 0.9 50° 0.8 60° 70° 80° 90° 0.7 0 20 40 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta(℃ ) Fig.5 Forward Current Derating Curve DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 Fig.6 Relative Intensity vs.Angle DATE : 2012-11-9 PAGE 5of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Bin Code List Luminous Intensity(IV), Unit:mcd@20mA COLOR R G B Bin Code Min Max 430 4 1.9 2.0 430 530 5 2.0 2.1 530 650 6 2.1 2.2 7 2.2 2.3 Bin Code Min Max P17 350 P18 P19 P20 Forward Voltage(VF), Unit:V@20mA 650 COLOR R 800 P21 800 1000 8 2.3 2.4 P22 1000 1250 9 2.4 2.5 P23 1250 1550 13 2.8 2.9 P14 190 230 14 2.9 3.0 P15 230 280 15 3.0 3.1 P16 280 350 16 3.1 3.2 17 3.2 3.3 18 3.3 3.4 19 3.4 3.5 20 3.5 3.6 G(B) Tolerance of each bin are±10% Tolerance of each bin are±0.1Vol Dominant Wavelength (Hue),Unit: nm@20mA COLOR R G B Bin Code Min Max OC1 619 624 OC2 624 629 AP 520 525 AQ 525 530 AC 465 470 AD 470 475 Tolerance of each bin are±1nm DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 6 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P16 IV--- Luminous Intensity Code WD--- Dominant Wavelength LOT NO: E L P 1 1 0001 A B C D E F A---E: For series number B---L: Local F: Foreign C---P: PLCC SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 2000pcs max for T670 series 2000pcs max for T650 series 2000pcs max for S020 series 1000pcs max for T690 series DATE CODE：2011 01 G H G--- Year H--- Month I --- Day 08 I DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 7 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Reel Dimensions Notes: 1. 2. Taping Quantity : 1000pcs/reel、500pcs/reel The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm. l Suggest Soldering Pad Dimensions DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 8 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l Package Dimensions Of Tape And Reel Notes: All dimensions are in millimeters. DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 9of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA Moisture Resistant Packaging Label H: \SM D \SM D \SM D° ü × ° \± ê ? ? .j pg H:\ SM D \SM D \SM D ° ü × ° \± ê ? ? .jp g H:\S M D\SM D \SM × D° ü ê ° \± .jpg ?? l REV: A/0 Reel Label Desiccant Aluminum moistue-proof bag 2 40 M S M D \S H :\ D\S M D° ? \± ê ? ü× ° .jp g 145 21 0 25 5 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. l Cleaning Û If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Û Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.) Û Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be confirm whether any damage to the LEDS will occur. DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 10of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA ● REV: A/0 Suggest Sn/Pb IR Reflow Soldering Profile Condition: ● Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 11 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 l CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65±5℃. * Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 12 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp: 150-200℃,120sec.Max. 2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,30sec.Max. 3、Peak Temperature: 260℃，10sec. 4、Reflow Repetition: 2 Times Max. 5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp: 350℃ Max. 2、Soldering Iron: 30w Max. 3、Soldering Time: 3 Sec. Max. One Time. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6. Reliability 1、Criteria For Judging The Damage Item Symbol Test Conditions Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN. Max. IF=20mA - U.S.L.*)×1.1 IR VR=5V - U.S.L.*)×2.0 IV IF=20mA L.S.L**)×0.7 - *) U.S.L.: Upper Standard Level **) L.S.L: Lower Standard Level DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 13 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA REV: A/0 2、Test Items And Results Test Item Reference Standard Resistance to Soldering Heat JEITA (Reflow Soldering) ED-4701300 301 Solder ability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage JEITA ED-4701300 303 JEITA ED-4701300 307 JEITA ED-4701100 105 JEITA ED-4701200201 JEITA ED-4701100 103 JEITA ED-4701200 202 Steady State Operating Life Condition Steady State Operating Life of High Humidity Heat Test Condition Note Tsld=260℃,10sec. (Pre treatment 2times 30℃,70%,168hrs) Tsld=215℃,3sec. 1time (Lead Solder) over 95% -40℃ ~ 100℃ 100cycles 30min. 30min. -40℃ ~ 25℃~100℃~25℃ 100cycles 30min. 5min. 30min. 5min Number of Damaged 0/50 0/50 0/50 0/50 Ta=100℃ 1000hrs. 0/50 Ta=60℃,RH=90% 1000hrs. 0/50 Ta=-40℃ 1000hrs. 0/50 Ta=25℃,IF=20mA 1000hrs. 0/50 Ta=60℃,RH=90%,IF=15mA 500hrs. 0/50 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 DATE : 2012-11-9 PAGE 14 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T69FRGBCT-SA l PART NO. SYSTEM : L– T 69 F RGB C T Z-XXXX REV: A/0 XXXX : Special Code (Such as CCT、Luminous or others) Z: With zener (It not be showed if with no zener ) T : Taping for 7 inch reel Lens color C : Water Clear W : White Diffused D : Color Diffused KY : 9mil AlInGap 590nm Super Yellow KR : 9mil AlInGap 630 nm Super Red TE(HE) : 14mil AlInGap 624 nm Super Red TY(HY): 14mil AlInGap590 nm Super Yellow LB : InGaN ITO rough 470nm Blue LG(SG) : InGaN ITO rough520nm Green W : InGaN + YAG White color …… 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) C : PCB Top View Type T :PLCC Top View Type S : Side View Type DRAWING NO. : DS-7K-12-XXXX PARA-FOR-068 65 : 3020 1.3T TYPE 67 : 3528 1.9T TYPE 020 : 3812 0.6T TYPE 68: 5630 0.9T TYPE 69: 5050 1.5T TYPE DATE : 2012-11-9 PAGE 15of 15