Notes: 1. All dimensions are in mm. Angles in degrees. 2. Coplanarity applies to the exposed pad as well as the terminals. 3. Refer JEDEC MO-220 4. Recommended land pattern is for reference only. 5. Thermal pad soldering area. 6. Recommended thermal via diameter (drill size) is 0.3mm and via pitch is 1.27mm. DATE: 06/10/11 DESCRIPTION: 72-contact, Very Thin Quad Flat No-Lead (TQFN) PACKAGE CODE: ZL72 DOCUMENT CONTROL #: PD-2075 11-0119 REVISION: B