HIGH-END LED AT LOW-END PRICES LM-80 3535 1-3W E-Star products have the advantages of high-reliability, low-thermal-resistance characteristics. It exhibits better luminous efficiency, superior color uniformity characteristics providing excellent illumination quality for the indoor and outdoor lighting applications. www.apt-hk.com www.apt-hk.com Features Dimensions (unit:mm) Ceramic substrate, low thermal resistance Free from bond wires, high reliability ANSI-compatible chromaticity bins Reflow soldering Small form factor allowing more flexibility on luminaries design RoHS compliant 3.10 2.60 2.00 0.7 0.50 0.50 1.30 cathode Application Home Lighting Automotive Lighting Architectural Lighting Street Lighting Commercial Lighting Special Lighting 3.30 3.50 3.30 3.50 TECHNICAL ADVANTAGE (Flip-Chip Bonding, free from bond wires) Uniform phosphor coating Chip is bonded on the ceramic substrate by Flip-Chip bonding technology Heat disspation Feature: Mechanical bonding, Die bonding, Electrical contact, Superior heat dissipation Flip-Chip bonding without bond wires High Reliability Large electrical contact area, can afford large electrical shock Die shear strength > 2000g Conformal Phosphor Coating Low thermal resistance, can be driven at larger current Phosphor Metal-metal interface, low thermal resistance LED chip More uniform spatial CCT distribution Submount Optical & Electrical Characteristics Color 4725-7040K 3710-4503K 2870-3220K CRI >70 >70 >80 Product types Luminous Flux (lm) Forward Voltage (V) Forward Current (mA) Viewing Angle θ1/2 (°) IF=350(mA) IF=700(mA) Typ. Typ. Max. Typ. Max. ESH3 140-160 250 2.8 3.2 350 900 120 ESG3 130-150 230 2.8 3.2 350 780 120 3.0 3.4 350 350 120 ESD3 110-120 ESH3 140-160 250 2.8 3.2 350 900 120 ESG3 130-150 230 2.8 3.2 350 780 120 ESH3 100-120 198 2.9 3.2 350 900 120 ESG3 90-110 164 2.9 3.2 350 780 120 Comment: Recommended current for ESG3 & ESH3 is 700mA www.qualtekusa.com