SDA-5000 SDA-5000 GaAs Distributed Amplifier Package: Die, 2.2mm x 1.45mm x 0.102mm RFMD’s SDA-5000 is a directly coupled (DC) GaAs microwave monolithic integrated circuit (MMIC) distributed driver amplifier designed to support a wide array of high frequency commercial, military, and space applications. They are ideal for wideband amplifier gain blocks, broadband test equipment (ATE), military, and aerospace applications. Features ■ DC to 35GHz Operation ■ +17dBm P3dB ■ Gain = 11.8dB Typical ■ Noise Figure = 4dB ■ Output Voltage to 8VPP ■ 100mA Total Current Applications ■ Instrumentation ■ Military ■ Aerospace ■ Broadband ATE Functional Block Diagram Ordering Information SDA-5000 GaAs Distributed Amplifier, GelPak, 10 pieces or more SDA-5000SB GaAs Distributed Amplifier, GelPak, 2 pieces RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. ® DS140210 ® RF MICRO DEVICES and RFMD are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks, and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc. 1 of 7 SDA-5000 Absolute Maximum Ratings Parameter Rating Unit +8.0 VDC Gate Bias Voltage (VTI) -2 to +0 VDC Gate Bias Voltage (VG2) (VDD-8.0) VDC to VDD V Drain Bias Voltage (VDD) RF Input Power (VDD = +8.0VDC) 15 dBm Operating Junction Temperature (TJ) +175 °C Continuous Power Dissipation (T = +85°C) 750 mW Thermal Resistance (Pad to Die Bottom) 116 °C/W -40 to +150 °C -40 to +85 °C Storage Temperature Operating Temperature ESD JESD22-A114 Human Body Model (HBM) Class 0 (All Pads) Caution! ESD sensitive device. RFMD Green: RoHS compliant per EU Directive 2011/65/EU, halogen free per IEC 61249-2-21, <1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony solder. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. Nominal Operating Parameters Specification Parameter Unit Min Typ Condition Max TA = +25°C, VDD = +8VDC, VG2 = +1.5VDC, IDD = 100mA* General Performance Operating Frequency GHz 3dB BW 11.8 dB 20GHz IP3 25 dBm POUT 0dBm, 20GHz P1dB 15 dBm 20GHz 17.5 dBm 20GHz Noise Figure at Mid-Band 4 dB 20GHz Input Return Loss 16 dB Output Return Loss 15 Supply Current 100 mA Supply Voltage 6.5 VDC Gain P3dB 0 10.8 35 *Adjust VTI between -1.5VDC to +0.2VDC to achieve IDD = 160mA typical., VG2 = 2.75VDC RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 2 of 7 SDA-5000 Typical Performance RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 3 of 7 SDA-5000 Typical Performance (Continued) RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 4 of 7 SDA-5000 Application Schematic NOTE: Drain Bias (VDD) must be applied through a broadband bias tee or external bias network. Die Drawing (Dimensions in millimeters) Notes: 1. 2. 3. 4. 5. 6. 7. No connection required for unlabeled bond pads Die thickness is 0.102mm (4mil) Typical bond pad is 0.100mm square Backside metallization: gold Backside metal is ground Bond pad metallization: gold Refer to drawing posted at www.rfmd.com for tolerances RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 5 of 7 SDA-5000 Pin Names and Descriptions Pin Name Description 1 RFIN RF Input. This pad is DC coupled and matched to 50Ω from DC to 35GHz. 50Ω microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate is recommended for RF input and output. 2 VG2 VG2 is an optional pad. It may be used to bias the cascode gate of the amplifier. If this port is used, a 1000pF bypass capacitor with the shortest wirebond length possible is recommended to prevent low frequency gain ripple. 3 VTO The output drain termination pad. This pad requires a suggested 1000pF bypass capacitor with the shortest wirebond length to prevent low frequency gain ripple. The value of the external capacitance limits the low frequency response of the amplifier. 4 RFOUT and VDD 5 VCAS Provides VG2 gate voltage to the cascode amplifier. The value is ~ (VCC/2 – absolute value of VTI). 6 VG21 Not connected. Interface Schematic RF Output. 50Ω microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate is recommended for RF input and output. Connect the DC bias (VDD) network to provide drain current (IDD). 7 VTI Input gate voltage, used to bias the amplifier. The value is between -1.5VDC (device is pinched OFF) to +0.2VDC (fully ON). This pad requires a bypass capacitor to ground with the shortest possible wirebond length to prevent low frequency gain ripple. The value of the external capacitance limits the low frequency response of the amplifier. Die GND Ground connection. Connect die bottom directly to ground plane for best performance. NOTE: The die should be connected directly to the ground plane with conductive epoxy. RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 6 of 7 SDA-5000 Assembly Diagram Measurement Technique All specifications and typical performances reported in this document were measured in the following manner. Data was taken using a temperature controlled probe station utilizing 150μm pitch GSG probes. The interface between the probes and integrated circuit was made with a coplanar to microstrip ceramic test interface. The test interface was then wire bonded to the die as shown in the figure below using 1 mil diameter bondwires. The spacing between the test interface and the die was 200μm, and the bond wire loop height was 100μm. The thickness of the test interface is 125μm (5mil). The calibration of the test fixture included the probes and test interfaces, so that the measurement reference plane was at the point of bond wire attachment. Therefore, all data represents the integrated circuit and accompanying bond wires. RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 For sales or technical support, contact RFMD at +1.336.678.5570 or [email protected]. DS140210 The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 7 of 7