产品规格书 SPECIFICATION

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDBF07009E64 SF6-4
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2008-1-31
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 1 of 5
SAW FILTER
HDBF07009E64
SF6-4
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规格书编号
Spec. No.
产品型号
Part No.
客户产品型号
Customer No.
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E-mail:[email protected]
Page 2 of 5
SAW FILTER
HDBF07009E64
SF6-4
1. SCOPE
This specification shall cover the characteristics of SAW filter BF07009E64
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V
10V50Hz/60Hz
-20℃ to +55℃
-45℃ to +85℃
0dBm
Electronic Characteristics
This filter can be used in single-end Input/Output or Balanced.
Item
Spec requirement
IF center Frequency f0
Unit
Min.
Typ.
Max.
68.5
70
71.5
MHz
23.5
26
dB
Minimum insertion loss attenuation
1dB Bandwidth
9.7
9.9
10.1
MHz
3dB Bandwidth
10.0
10.2
10.4
MHz
40dB Bandwidth
—
11.2
11.5
MHz
—
1.0
1.2
dB
—
100
150
ns
Ultimate Rejection
50
—
—
dB
Operating Temperature(°C)
-40
+85
°C
Storage Temperature(°C)
-55
+125
°C
Amplitude ripple(p-p)
Δα
f0±4.675MHz
Group delay ripple
f0±4.675MHz
DIP 35x12
Package
f0 frequency shift for all temperature
relative to T0 (25°C)
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
mm
25
E-mail:[email protected]
kHz
Page 3 of 5
SAW FILTER
HDBF07009E64
SF6-4
3. DIMENSION
4.TEST CIRCUIT
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into the room conditions
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Tel:0755-82916880 Fax:0755-82916881
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Page 4 of 5
SAW FILTER
HDBF07009E64
SF6-4
for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +80℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The device shall satisfy all the
initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g weight in the direction
of thickness. This operation shall be done toward both direction. The device shall show no
evidence of damage and shall satisfy all the initial electrical characteristics.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
Page 5 of 5