ROHS COMPLIANT Thin Film Custom Substrates SUBSTRATES: Material, K value Standard Standard X,Y (inches) X,Y (mm) Standard Thickness (mils) Standard Thickness (mm) Available Available Thickness (mil) Thickness (mm) 0.127, 0.254, 0.381, 0.635 5-50 0.127, 0.254, 0.381, 0.508 99.6% pure Al2O3, 9.9 2x2 50.8 x 50.8 5, 10, 15, 20 5-25 Quartz, 3.8 2" round 50.8 diam. 10 0.254 5-25 X7R B, 1200 1x1 25.4 x 25.4 5, 10 0.127, 0.254 4-25 X7R X, 2700 1x1 25.4 x 25.4 5, 10 0.127, 0.254 4-25 X7R T, 4000 1x1 25.4 x 25.4 7, 10 0.178, 0.254 4-25 GBBL A, 20,000 1.4 x 1.4 35.6 x 35.6 7, 10 0.178, 0.254 5-15 GBBL A, 60,000 1.4 x 1.4 35.6 x 35.6 7, 10 0.178, 0.254 5-15 NOTE: On Alumina and Aluminum Nitride, typical surface is as-fired condition, polish to 2 µ-inch is available 96% AlN, 9.0 2x2 50.8 x 50.8 5, 10, 15, 25 0.127-1.27 0.127-0.635 0.127-0.635 0.100-0.635 0.100-0.635 0.100-0.635 0.127-0.381 0.127-0.381 METAL FILMS: Metal Deposition Method Thickness(Angstroms) 200-1,000 200-2,000 200-2,000 5,000-25,000 1,000-10,000 5,000-75,000 5,000-50,000 1,000-20,000 500-5,000 Titanium(Ti) Sputter Deposition Titanium Tungsten(TiW) Sputter Deposition Nickel(Ni) Sputter Deposition Nickel(Ni) Plating Gold(Au) Sputter Deposition Gold(Au) Plating Gold/Tin(AuSn-80/20) NA Copper(Cu) Sputter Deposition Tantalum Nitride(TaN) Reactive Sputter Dep Others in development available upon request Typical Use Barrier, Adhesion Barrier, Adhesion Barrier for solder die attach Barrier for solder die attach Die attach, Wirebond Die attach, Wirebond Eutectic High Reliability solder Conductor Resistor(Typical 1000A, 50Ω/□) FEATURE DIMENSIONS: Minimum Dimension (µm)* Available Conductor Line 25 Now Space 25 Now Line/Space Tolerance 5 Now Laser drilled holes 75 Now Plated Vias 75 Now +/- 7 25 Now Q3, 2015 AuSn(80/20) Blanket Now AuSn(80/20) *-> µm = microns = 10-6m 75 Q3, 2015 25.4µm=1 mil Feature 2nd layer alignment 50Ω/□ Resistor 4001 Calle Tecate CAMARILLO, CA DATE 6/9/2015 SHEET 1 OF 1 REV TITLE Thin Film Custom Substrates PART NO. NA DW G. SCALE NA NONE