Contech Research

DECEMBER 2, 1996
TEST REPORT #96291F,
TEMPERATURE/HUMIDITY CYCLING
(100 CYCLES OF DURABILITY)
SSW/TSW (10 MICROINCHES GOLD)
SAMTEC CORPORATION
APPROVED BY: LUANNE WITT
PROGRAM MANAGER
CONTECH RESEARCH, INC.
1
Contech Research
CERTIFICATION
This is to certify that the evaluation described herein was
designed and executed by personnel of Contech Research, Inc.
It was performed in concurrence of Samtec Corporation of New
Albany, IN who was the test sponsor.
All equipment and measuring instruments used during testing
were calibrated and traceable to NIST according to IS0
10012-l and ANSI/NCSL 2540-1, as applicable.
All data, raw and summarized, analysis and conclusions
presented herein are the property of the test sponsor. No
copy of this report, in part or in full, shall be forwarded
to any agency, customer, etc., by Contech Research without
the written approval of the test sponsor.
Luanne Witt
Program Manager
LW:js
2
Contech Research
SCOPE
To perform Temperature/Humidity Cycling (with mating cycles)
on Connectors as manufactured and submitted by the test
sponsor, Samtec Corporation.
TEST SAMPLES AND PREPARATION
1.
The following test samples were submitted by the test
sponsor, Samtec Corporation, for the evaluation to be
performed by Contech Research, Inc.
a)
b)
2.
SSW Receptacle Connectors (10 Microinches Gold)
TSW Plug Connectors (10 Microinches Gold)
Unless otherwise indicated, all materials were certified
by the manufacturer to be in accordance with the
applicable product specification.
3.
The test samples as submitted were certified by the
manufacturer as being fabricated and assembled.utilizing
normal product techniques common for this type of
product and inspected in accordance with the quality
criteria as established for the product involved.
4.. All test samples were coded and identified to maintain
continuity throughout the test sequences.
5.
Test boards were supplied by the test sponsor with pads
located as applicable.
6.
The test samples were assembled to test boards. The
assembled test samples were "hand" soldered in place.
7.
After test lead attachments and/or soldering, all test
units were cleaned prior to mating via DI water wash,
isopropyl alcohol rinse, and vapor degreasing (in the
order indicated).
8.
Unless otherwise specified in the test procedures used,
no further preparation was used.
9.
All equipment and measuring instruments used during
testing were calibrated and traceable to NIST according
to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.
f
.
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Contech Research
TEST SELECTION
1.
The following test sequence was established:
LLiCR
DURABILITY
25 TLES
LLiCR
CYCLIC HUMIDITY
(240 TOURS)
LLiCR
DURABILITY
25 cTcLEs
LLCR
I
CYCLIC HUMIDITY
(240 TOURS)
LLiCR
DURABILITY
25 TLES
LLiCR
CYCLIC HUMIDITY
(240 TOURS)
LLCR
I
DURABILITY
25 CYCLES
I
LLCR
I
CYCLIC HUMIDITY
(240 YOURS)
LLCR
TOTAL OF 100 CYCLES OF DURABILITY TEST1
4'
Contech Research
MONITORING TESTS
Throughout the test sequence selected for this evaluation
one test was performed on a periodic basis. The following is
the rational for this test which is significant and
important in evaluating the data in proper perspective.
LOW LEVEL CIRCUIT RESISTANCE
1.
To evaluate contact resistance characteristics of the
contact systems under conditions where applied voltages
and currents do not alter the physical contact interface
and will detect oxides and films which degrade
electrical stability.
2.
The test method is also sensitive to and may detect the
presence of fretting corrosion induced by mechanical or
thermal environments and any significant loss of.contact
pressure.
3.
This attribute was monitored after each preconditioning
and/or test exposure in order to determine said
stability of the connector material systems as they
progress through the applicable test sequences.
4.
The electrical stability of the system is determined by
comparing the resistance value after a given test
exposure to its initial value (prior to any exposure).
The difference is the change in resistance occurringwhose magnitude establishes the stability of the
interface being evaluated.
5.
The test is performed with a four wire system. The test
is performed in accordance with MIL-STD-1344, Method
3002 with a 100 milliamp maximum test current and an
open circuit voltage of 20 millivolts. Measurements are
taken in the forward and reverse direction and averaged.
5
Contech Research
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EIA 364, TP23
SPECIFICATION:
PROJECT NO.:
96291F
-------------------_---------------------------------------PART DESCRIPTION: Plug & Receptacle
PART NO.: SSW/TSW
Connector
-----------------------------------------------------------TECHNICIAN: SR
SAMPLE SIZE: Two
-----------------------------------------------------------11-8-96
COMPLETE DATE:
9-11-96
START DATE:
__-___-_---------------------------------------------------50%
RELATIVE HUMIDITY:
ROOM AMBIENT: 23OC
______-----------------------------------------------------266, 280, 297, 518
EQUIPMENT ID#:
-----------------------------------------------------------LOW LEVEL CIRCUIT RESISTANCE (LLCR)
PURPOSE:
To evaluate contact resistance characteristics of the
contact systems under conditions where applied voltages and
currents do not alter the physical contact interface and
will detect oxides and films which degrade electrical
It is also sensitive to and may detect the
stability.
presence of fretting corrosion induced by mechanical or
thermal environments as well as any significant loss of
pressure.
1
__--__-___-_------------------------------------------------
PROCEDURE:
1.
This test was performed in accordance with EIA 364;TP23
with a 100 milliamp maximum test current and an open
circuit voltage of 20 millivolts (four wire technique).
2.
The voltage probes were attached to the contact
terminations within 0.060" of the connector housing.
i
3
i
The low level circuit resistance as measured shall not
exceed 15.0 mS2.
----------___-----------------------------------------------
RESULTS:
See next page.
Contech Research
RESULTS:
1.
The following is a summary of the data observed:
Sample ID#
1
2
2.
LOW LEVEL CIRCUIT RESISTANCE
(Milliohms)
Std.
Dev.
Min.
4.0
3.9
4.2
4.2
3.7
3.6
0.1
0.2
See pages 13a thru 13b for individual data points.
a
Contech Research
-
EIA 364, TP09
SPECIFICATION:
96291F
PROJECT NO.:
---______________-__---------------------------------------PART DESCRIPTION: Plug & Receptacle
SSW/TSW
PART NO.:
Connector
---________-__---------------------------------------------TECHNICIAN: SR
SAMPLE SIZE: Two
________________------------------ __-__--_________----___^__
10-29-96
COMPLETE DATE:
9-12-96
START DATE:
---_____----_----------------------------------------------RELATIVE HUMIDITY: 50%
23OC
ROOM AMBIENT:
_________________-_----------------------------------------11, 150, 152, 159, 206, 297, 315, 518
EQUIPMENT ID#:
__________--_____-__----------- ---_______--__----__--------DURABILITY
PURPOSE:
1.
To determine the effects of subjecting the test samples
to a predetermined number of mating and unmating cycles
simulating the expected mechanical life of the product
being evaluated.
2.
This is a preconditioning sequence which is used to
induce the type of wear on the contacting surfaces which
may occur under normal service conditions. The
connectors are mated and unmated a predetermined number
of cycles. Upon completion, the units being evaluated
are exposed to the environments as specified to asses
any impact on electrical stability resulting from wear
or other wear dependent phenomenon.
3.
This type of preconditioning sequence is also used to
mechanically stress the-connector system as would
This sequence in
normally occur in actual service.
conjunction with other tests is used to determine if a
significant loss of contact pressure occurs from said
stresses which in turn, may result in an unstable
electrical condition to exist.
------------------------------------------~------~---PROCEDURE:
------
1.
The test was performed in accordance with EIA 364, TP09.
2.
Test Conditions:
a) No. of cycles :
:
b) Rate
25 per interval
500 cycles/hr
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Contech Research
PROCEDURE - Continued:
3.
The test samples were axially aligned to accomplish the
mating and unmating function allowing for self-centering
movement.
4.
Low level circuit resistance was performed in accordance
with EIA 364, TP23 using a 100 milliamp maximum test
voltage and a 20.0 millivolt open circuit voltage.
___--------------------------------------------------------REQUIREMENTS:
1.
There shall be no evidence of physical damage to the
test sample so tested.
2.
The change in low level circuit resistance shall not
exceed +15.0 m.
___-_------------------------------------------------------RESULTS :
1.
There was no evidence of physical damage to the test
samples as tested.
2.
The following is a summary of the data observed:
LOW LEVEL CIRCUIT RESISTANCE
(Milliohms)
Sample ID#
1
2
3.
Avg.
-
Max.
-
Min.
-
4.0
3.9
4.2
4.4
3.5
3.6
Avg.
Change
Max.
Change
+o.o
0.0
+0.2
+0.3
Std.
Dev.
0.1
0.1
See pages 13a thru 13b for individual data points.
Contech Research
PROJECT NO.:
PART NO.:
96291F
SSW/TSW
SPECIFICATION:
EIA 364, TP31
PART DESCRIPTION: Plug 6: Receptacle
Connector
__________________-_____________________--------------------
SAMPLE
SIZE:
Two
TECHNICIAN:
SR
_______________-___-----------------------------------------
START DATE:
9-13-96
COMPLETE DATE:
11-8-96
___________________-----------------------------------------
ROOMAMBIENT:
23OC
RELATIVE HUMIDITY:
52%
___________________-____________________--------------------
EQUIPMENT ID#:
1, 27, 36, 297, 518
____-----------------------------------------------------HUMIDITY (THERMAL CYCLING)
PURPOSE:
To evaluate the impact on electrical stability of the
contact system when exposed to any environment which may
generate thermal/moisture type.failure mechanisms such as:
a)
Fretting corrosion due to wear resulting from
micromotion. Thermal cycling induces micromotion
between contacting surfaces and humidity accelerates
the oxidation process.
b)
Oxidation of wear debris resulting from induced
micromotion which may have become entrapped between the
contacting surfaces.
cl
Oxidation of particulates which may have been deposited
on the contacting surfaces from the surrounding
atmosphere which may have been entrapped between them
due to induce micromotion.
d)
Failure mechanisms resulting from a wet oxidation
process.
d
To determine the number of mating cycles which may be
performed whereby the change in low level circuit
resistance is <+15.0 mf~ (stable). Wear occurs on the
contacting surfaces as the number of mating cycles
increase.
If the wear does not result in gross exposure
of the underplate/base metal and the wear debris is not
entrapped, then electrical stability will remain in the
stable region. If gross exposure of the underplate/base
metal occurs and sufficient debris is entrapped,
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Contech Research
PURPOSE:
Continued
electrical instability or marginal conditions will
result due to the temp/humidity exposure.
f) This test obtains added effectiveness in employment of
temperature cycling that provides a breathing action,
inducing corrosion processes, and the introduction of
moisture into partially sealed test samples. This
condition imposes a vapor pressure on the samples which
constitutes the major force behind the moisture
migration and penetration.
--_--_-----------------------------------------------------PROCEDURE:
1.
The test was performed in accordance with EIA 364, TP31
with the following conditions.
2.
Test Conditions:
a)
b)
c)
d)
e)
f)
Preconditioning (24 hours)
Relative Humidity
Temperature Conditions
Mating Conditions
Mounting Conditions
Duration
:
:
:
:
:
:
5ooc f 2°C
90% to 95%
25°C to 65°C
Mated
Mounted
960 hours
3.
Prior to performing attribute measurements, the test
samples were allowed to recover to room ambient
conditions.
4.
All subsequent attribute testing was performed in
accordance with the procedures previously indicated.
5 *.
During the exposure, resistance measurements were taken
at specific intervals and in the following sequence.
a)
Place the test samples in the test chamber.
b) After the initial 240 hours of exposure, remove the
test units from the test chamber when it is at 25°C.
The test samples were exposed to room ambient for
one hour prior to making low level circuit
resistance measurements.
E
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Contech Research
-
.
PROCEDURE:
CS
Continued
LOW level circuit resistance was measured.
If the
measurements remained within the stable range
(x+15.0 ti AR), perform additional 25 mating cycles
and remeasure low level circuit resistance.
d) Upon completion of the measurements, place the test
units back into the test chamber for an additional
240 hours (when the chamber is at 25°C).
d
Repeat Steps c) and d) until a AR measurement is
>+15.0 mR or the total specified duration is
completed whichever occurs first.
--_-----------------------------------
----------------------
REQUIREMENTS:
1.
There shall be no evidence of physical deterioration of
the test samples as tested.
2.
The change in low level circuit resistance shall not
exceed +15.0 m when based on 3 sigma limits.
---------------------‘---‘--“-““----’-~------------------
RESULTS:
1.
The test samples as tested showed no evidence of
physical.,deterioration.
:
2.
The following is a summary of the observed data:
i
LOW LEVEL CIRCUIT RESISTANCE
(Milliohms)
Sample ID#
Avg.
Max.
Min.
Avg.
Change
Max.
Change
Std.
Dev.
+4.2
+5.3
0.9
1.8
Cycled (After 960 Hrs, 100 Mating Cycles)
ID# 1
ID# 2
3.
5.8
4.8
8.3
9.3
4.3
3.5
+1.8
+0.9
See pages 13a thru 13b for individual data points.
r
f
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Contech Research