High Speed Characterization Report SEAM-XX-11.0-S-XX-2 Mates with SEAF-XX-05.0-S-XX-2 Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch 16mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table of Contents Connector Overview ........................................................................................................ 1 Connector System Speed Rating .................................................................................... 1 Frequency Domain Data Summary ................................................................................. 2 Table 1 - Single-Ended 1:1 S/G Pattern Performance ................................................. 2 Table 2 - Single-Ended 2:1 S/G Pattern Performance ................................................. 3 Table 3 - Differential Optimal Horizontal Performance ................................................. 4 Table 4 - Differential Optimal Vertical Performance ..................................................... 5 Table 5 - Differential High Density Vertical Performance ............................................. 6 Bandwidth Charts – Single-Ended & Differential Insertion Loss .................................. 7 Time Domain Data Summary .......................................................................................... 8 Table 6 – Single-End Impedance () – 1:1 S/G Pattern .............................................. 8 Table 7 – Single-End Impedance () – 2:1 S/G Pattern .............................................. 8 Table 8 – Differential Impedance () – Optimal Horizontal .......................................... 9 Table 9 – Differential Impedance () – Optimal Vertical .............................................. 9 Table 10 – Differential Impedance () – High Density Vertical .................................. 10 Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern .......................................... 11 Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern ......................................... 12 Table 13 - Differential Crosstalk (%) – Optimal Horizontal ......................................... 13 Table 14 - Differential Crosstalk (%) – Optimal Vertical ............................................. 14 Table 15 - Differential Crosstalk (%) – High Density Vertical...................................... 15 Table 16 - Propagation Delay (Mated Connector) ...................................................... 16 Characterization Details ................................................................................................ 17 Differential and Single-Ended Data............................................................................ 17 Connector Signal to Ground Ratio ............................................................................. 17 Frequency Domain Data ............................................................................................ 21 Time Domain Data ..................................................................................................... 21 Appendix A – Frequency Domain Response Graphs .................................................... 23 Single-Ended Application – Insertion Loss ................................................................ 23 Single-Ended Application – Return Loss ................................................................... 23 Single-Ended 1:1 S/G Pattern Application – NEXT.................................................... 24 Single-Ended 1:1 S/G Pattern Application – FEXT .................................................... 24 Single-Ended 2:1 S/G Pattern Application – NEXT.................................................... 25 Single-Ended 2:1 S/G Pattern Application – FEXT .................................................... 25 Differential Application – Insertion Loss ..................................................................... 26 Differential Application – Return Loss ........................................................................ 26 Differential Optimal Horizontal Application – NEXT ................................................... 27 Differential Optimal Horizontal Application – FEXT.................................................... 27 Differential Optimal Vertical Application – NEXT ....................................................... 28 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:ii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Optimal Vertical Application – FEXT ........................................................ 28 Differential High Density Vertical Application – NEXT ............................................... 29 Differential High Density Vertical Application – FEXT ................................................ 29 Appendix B – Time Domain Response Graphs ............................................................. 30 Single-Ended Application – Input Pulse ..................................................................... 30 Single-Ended 1:1 S/G Pattern Application – Impedance ........................................... 31 Single-Ended 1:1 S/G Pattern Application – Propagation Delay ................................ 31 Single-Ended 2:1 S/G Pattern Application – Impedance ........................................... 32 Single-Ended 2:1 S/G Pattern Application – Propagation Delay ................................ 32 Single-Ended 1:1 S/G Pattern Application – NEXT,SEAM167_SEAM147 ................ 33 Single-Ended 1:1 S/G Pattern Application – FEXT,SEAM167_SEAF147.................. 33 Single-Ended 1:1 S/G Pattern Application – NEXT,SEAM167_SEAM165 ................ 34 Single-Ended 1:1 S/G Pattern Application – FEXT,SEAM167_SEAF165.................. 34 Single-Ended 1:1 S/G Pattern Application – NEXT,SEAM167_SEAM176 ................ 35 Single-Ended 1:1 S/G Pattern Application – FEXT,SEAM167_SEAF176.................. 35 Single-Ended 2:1 S/G Pattern Application – NEXT,SEAM156_SEAM146 ................ 36 Single-Ended 2:1 S/G Pattern Application – FEXT,SEAM156_SEAF146.................. 36 Single-Ended 2:1 S/G Pattern Application – NEXT,SEAM156_SEAM155 ................ 37 Single-Ended 2:1 S/G Pattern Application – FEXT,SEAM156_SEAF155.................. 37 Single-Ended 2:1 S/G Pattern Application – NEXT,SEAM156_SEAM165 ................ 38 Single-Ended 2:1 S/G Pattern Application – FEXT,SEAM156_SEAF165.................. 38 Differential Application – Input Pulse ......................................................................... 39 Differential Optimal Horizontal Application – Impedance ........................................... 40 Differential Optimal Horizontal Application – Propagation Delay ............................... 40 Differential Optimal Vertical Application – Impedance ............................................... 41 Differential Optimal Vertical Application – Propagation Delay ................................... 41 Differential High Density Vertical Application – Impedance ....................................... 42 Differential High Density Vertical Application – Propagation Delay............................ 42 Diff Optimal Horizontal Application – NEXT,SEAM147,157_SEAM107,117 .............. 43 Diff Optimal Horizontal Application – FEXT,SEAM147,157_SEAF107,117 ............... 43 Diff Optimal Horizontal Application – NEXT,SEAM147,157_SEAM126,136 .............. 44 Diff Optimal Horizontal Application – FEXT,SEAM147,157_SEAF126,136 ............... 44 Diff Optimal Horizontal Application – NEXT,SEAM147,157_SEAM145,155 .............. 45 Diff Optimal Horizontal Application – FEXT,SEAM147,157_SEAF145,155 ............... 45 Diff Optimal Vertical Application – NEXT,SEAM157,158_SEAM137,138 .................. 46 Diff Optimal Vertical Application – FEXT,SEAM157,158_SEAF137,138 ................... 46 Diff Optimal Vertical Application – NEXT,SEAM157,158_SEAM145,146 .................. 47 Diff Optimal Vertical Application – FEXT,SEAM157,158_SEAF145,146 ................... 47 Diff Optimal Vertical Application – NEXT,SEAM157,158_SEAM153,154 .................. 48 Diff Optimal Vertical Application – FEXT,SEAM157,158_SEAF153,154 ................... 48 Diff High Density Vertical Application – NEXT,SEAM156,157_SEAM136,137 .......... 49 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iii Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff High Density Vertical Application – FEXT,SEAM156,157_SEAF136,137 ........... 49 Diff High Density Vertical Application – NEXT,SEAM156,157_SEAM145,146 .......... 50 Diff High Density Vertical Application – FEXT,SEAM156,157_SEAF145,146 ........... 50 Diff High Density Vertical Application – NEXT,SEAM156,157_SEAM153,154 .......... 51 Diff High Density Vertical Application – FEXT,SEAM156,157_SEAF153,154 ........... 51 Appendix C – Product and Test System Descriptions ................................................... 52 Product Description ................................................................................................... 52 Test System Description ............................................................................................ 52 PCB-103314-TST-XX Test Fixtures........................................................................... 52 PCB-103314-TST-XX PCB Layout Panel .................................................................. 53 PCB Fixtures ............................................................................................................. 54 Calibration Board ....................................................................................................... 57 Appendix D – Test and Measurement Setup................................................................. 59 N5230C Measurement Setup .................................................................................... 59 Test Instruments ........................................................................................................ 60 Test Cables & Adapters ............................................................................................. 60 Appendix E - Frequency and Time Domain Measurements .......................................... 61 Frequency (S-Parameter) Domain Procedures ......................................................... 61 Time Domain Procedures .......................................................................................... 61 Impedance (TDR)................................................................................................... 61 Propagation Delay (TDT) ....................................................................................... 62 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) .......................................... 62 Appendix F – Glossary of Terms ................................................................................... 63 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:iv Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Connector Overview SEAM/SEAF is a 1.27mm x 1.27mm pitch interconnects system for elevated high-speed board-to-board applications. The open pin field design allows for both single-ended and differential pair signaling to be employed. The SEAM/SEAF Series is available in 4, 5, 6, 8, and 10 row open pin field arrays. Pins per row selections are 20, 30, 40, or 50. This report reflects only the hi-speed electrical characteristics specific to a mated 16mm stack height SEAM/SEAF test system. Connector System Speed Rating SEAM/SEAF Series, 1.27mm x 1.27mm (.050” x .050”) pitch interconnect, 16mm Stack Height. Signaling Speed Rating Single-Ended: 1:1 S/G 12.5GHz/ 25Gbps Single-Ended: 2:1 S/G 13.5GHz/ 27Gbps Differential: Optimal Horizontal 14.5GHz/ 29Gbps Differential: Optimal Vertical 13GHz/ 26Gbps Differential: High Density Vertical 15 GHz/ 30Gbps The Speed Rating is based on the -3 dB insertion loss point of the connector system. The -3 dB point can be used to estimate usable system bandwidth in a typical, two-level signaling environment. To calculate the Speed Rating, the measured -3 dB point is rounded up to the nearest half-GHz level. The up rounding corrects for a portion of the test board’s trace loss, since a short length of trace loss is included in the loss data in this report. The resulting loss value is then doubled to determine the approximate maximum data rate in Gigabits per second (Gbps). For example, a connector with a -3 dB point of 7.8 GHz would have a Speed Rating of 8 GHz/ 16 Gbps. A connector with a -3 dB point of 7.2 GHz would have a Speed Rating of 7.5 GHz/15 Gbps. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:1 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Frequency Domain Data Summary Table 1 - Single-Ended 1:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss SEAM_167 SEAF_167 -3dB@ 12.4 GHz Return Loss SEAM_167 SEAM_167 -8.7dB@ 12.4 GHz SEAM_167 SEAM_147 -21.4dB@ 12.4 GHz SEAM_167 SEAM_165 -35.4dB@ 12.4 GHz SEAM_167 SEAM_176 -26.9dB@ 12.4 GHz SEAM_167 SEAF_147 -25.2dB@ 12.4 GHz SEAM_167 SEAF_165 -53.2dB@ 12.4 GHz SEAM_167 SEAF_176 -33.0dB@ 12.4 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 1:1 S/G Pattern Pin Map Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:2 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 2 - Single-Ended 2:1 S/G Pattern Performance Test Parameter Driver Receiver Insertion Loss SEAM_156 SEAF_156 -3dB@ 13.2 GHz Return Loss SEAM_156 SEAM_156 -5dB@ 13.2 GHz SEAM_156 SEAM_146 -17dB@ 13.2 GHz SEAM_156 SEAM_155 -26.5dB@ 13.2 GHz SEAM_156 SEAM_165 -28.5dB@ 13.2 GHz SEAM_156 SEAF_146 -22.8dB@ 13.2 GHz SEAM_156 SEAF_155 -28.7dB@ 13.2 GHz SEAM_156 SEAF_165 -35.3dB@ 13.2 GHz Near-End Crosstalk Far-End Crosstalk Single-Ended 2:1 S/G Pattern Pin Map Pin155 Pin165 Pin156 Pin146 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:3 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 3 - Differential Optimal Horizontal Performance Test Parameter Driver Receiver Insertion Loss SEAM_147,157 SEAF_147,157 -3dB@ 14.3 GHz Return Loss SEAM_147,157 SEAM_147,157 -3.7dB@ 14.3 GHz SEAM_147,157 SEAM_107,117 -38.4dB@ 14.3 GHz SEAM_147,157 SEAM_126,136 -48.5dB@ 14.3 GHz SEAM_147,157 SEAM_145,155 -43.1dB@ 14.3 GHz SEAM_147,157 SEAF_107,117 -36.7dB@ 14.3 GHz SEAM_147,157 SEAF_126,136 -46.5dB@ 14.3 GHz SEAM_147,157 SEAF_145,155 -51.7dB@ 14.3 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Horizontal Pin Map Pin145 Pin136 Pin155 Pin126 Pin157 Pin107 Pin147 Pin117 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:4 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 4 - Differential Optimal Vertical Performance Test Parameter Driver Receiver Insertion Loss SEAM_157,158 SEAF_157,158 -3dB@ 12.6 GHz Return Loss SEAM_157,158 SEAM_157,158 -9.3dB@ 12.6 GHz SEAM_157,158 SEAM_137,138 -29.5dB@ 12.6 GHz SEAM_157,158 SEAM_145,146 -41.4dB@ 12.6 GHz SEAM_157,158 SEAM_153,154 -27.3dB@ 12.6 GHz SEAM_157,158 SEAF_137,138 -30dB@ 12.6 GHz SEAM_157,158 SEAF_145,146 -39.1dB@ 12.6 GHz SEAM_157,158 SEAF_153,154 -31.3dB@ 12.6 GHz Near-End Crosstalk Far-End Crosstalk Differential Optimal Vertical Pin Map Pin154 Pin153 Pin145 Pin146 Pin137 Pin157 Pin158 Pin138 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:5 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 5 - Differential High Density Vertical Performance Test Parameter Driver Receiver Insertion Loss SEAM_156,157 SEAF_156,157 -3dB@ 14.6 GHz Return Loss SEAM_156,157 SEAM_156,157 -4.8dB@ 14.6 GHz SEAM_156,157 SEAM_136,137 -38.1dB@ 14.6 GHz SEAM_156,157 SEAM_145,146 -34.4dB@ 14.6 GHz SEAM_156,157 SEAM_153,154 -53.1dB@ 14.6 GHz SEAM_156,157 SEAF_136,137 -38.3dB@ 14.6 GHz SEAM_156,157 SEAF_145,146 -32.1dB@ 14.6 GHz SEAM_156,157 SEAF_153,154 -53.9dB@ 14.6 GHz Near-End Crosstalk Far-End Crosstalk Differential High Density Vertical Pin Map Pin153 Pin145 Pin154 Pin136 Pin156 Pin137 Pin157 Pin146 Insertion Loss & Return Loss Crosstalk Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:6 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Bandwidth Charts – Single-Ended & Differential Insertion Loss SEAM/SEAF Array Series Single-Ended Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 1:1 S/G Pattern 2:1 S/G pattern -6 -7 0 2 4 6 8 10 12 14 16 18 20 18 20 Frequency (GHz) Differential Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 -6 Optimal Horizontal Optimal Vertical High Density Vertical -7 -8 0 2 4 6 8 10 12 14 16 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:7 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Time Domain Data Summary Table 6 – Single-End Impedance () – 1:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 79.5 70.5 64.1 56.7 53.7 Minimum Impedance 47.9 49.7 49.8 49.8 49.9 Single-Ended Application - Impedance vs. Risetime 80 Impedance (Ohms) 75 70 65 60 55 50 45 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Table 7 – Single-End Impedance () – 2:1 S/G Pattern Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 80.5 72.8 65.4 57.4 54.5 Minimum Impedance 47.1 49.1 49.8 49.8 49.9 Single-Ended Application - Impedance vs. Risetime 85 Impedance (Ohms) 80 75 70 65 60 55 50 45 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:8 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 8 – Differential Impedance () – Optimal Horizontal Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 125.9 113.4 106.5 104.9 103.0 Minimum Impedance 82.5 89.3 96.0 99.3 99.8 Differential Application - Impedance vs. Risetime 130 Impedance (Ohms) 120 110 100 90 80 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Table 9 – Differential Impedance () – Optimal Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 136.2 125.3 114.2 105.1 102.6 Minimum Impedance 88.2 93.6 96.5 99.9 99.9 Differential Application - Impedance vs. Risetime 140 Impedance (Ohms) 130 120 110 100 90 80 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:9 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 10 – Differential Impedance () – High Density Vertical Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps Maximum Impedance 147.1 132.0 118.9 107.7 104.8 Minimum Impedance 91.0 95.1 99.3 99.9 99.9 Differential Application - Impedance vs. Risetime 150 Impedance (Ohms) 140 130 120 110 100 90 0 50 100 150 200 250 300 350 400 450 500 Risetime (psec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:10 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 11 - Single-Ended Crosstalk (%) – 1:1 S/G Pattern Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_167 SEAM_147 0.61 0.53 0.43 0.25 0.15 SEAM_167 SEAM_165 1.32 0.74 0.38 0.2 0.12 SEAM_167 SEAM_176 2.53 2.33 2.15 1.34 0.76 SEAM_167 SEAF_147 0.57 0.45 0.27 0.16 0.1 SEAM_167 SEAF_165 1.27 0.69 0.32 0.1 <0.1 SEAM_167 SEAF_176 0.91 0.86 0.65 0.35 0.22 Single-Ended 1:1 S/G Pattern Crosstalk Pin Map Pin176 Pin165 Pin167 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin147 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:11 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 12 - Single-Ended Crosstalk (%) – 2:1 S/G Pattern Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_156 SEAM_146 13.71 13.26 12.12 7.5 4.24 SEAM_156 SEAM_155 8.95 8.31 7.39 4.65 2.68 SEAM_156 SEAM_165 3.69 3.38 3.09 2.08 1.25 SEAM_156 SEAF_146 5.05 4.79 4.07 2.42 1.5 SEAM_156 SEAF_155 3.98 3.68 3.28 2.03 1.25 SEAM_156 SEAF_165 2.45 2.29 2.04 1.28 0.78 Single-Ended 2:1 S/G Pattern Crosstalk Pin Map Pin155 Pin165 Pin156 Pin146 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:12 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 13 - Differential Crosstalk (%) – Optimal Horizontal Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_147,157 SEAM_107,117 0.3 0.15 <0.1 <0.1 <0.1 SEAM_147,157 SEAM_126,136 0.91 0.83 0.74 0.44 0.24 SEAM_147,157 SEAM_145,155 <0.1 <0.1 <0.1 <0.1 <0.1 SEAM_147,157 SEAF_107,117 0.69 0.48 0.25 0.11 <0.1 SEAM_147,157 SEAF_126,136 0.17 0.13 <0.1 <0.1 <0.1 SEAM_147,157 SEAF_145,155 0.18 <0.1 <0.1 <0.1 <0.1 Differential Optimal Horizontal Crosstalk Pin Map Pin145 Pin136 Pin155 Pin126 Pin157 Pin107 Pin147 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin117 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:13 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 14 - Differential Crosstalk (%) – Optimal Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_157,158 SEAM_137,138 0.4 0.3 0.2 0.12 <0.1 SEAM_157,158 SEAM_145,146 1 0.93 0.85 0.51 0.28 SEAM_157,158 SEAM_153,154 0.2 0.13 <0.1 <0.1 <0.1 SEAM_157,158 SEAF_137,138 0.21 0.17 0.1 <0.1 <0.1 SEAM_157,158 SEAF_145,146 0.29 0.23 0.15 <0.1 <0.1 SEAM_157,158 SEAF_153,154 0.29 0.19 <0.1 <0.1 <0.1 Differential Optimal Vertical Crosstalk Pin Map Pin154 Pin153 Pin145 Pin146 Pin137 Pin157 Pin158 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin138 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:14 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 15 - Differential Crosstalk (%) – High Density Vertical Input(tr) NEXT FEXT Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps SEAM_156,157 SEAM_136,137 0.75 0.63 0.58 0.43 0.26 SEAM_156,157 SEAM_145,146 0.91 0.83 0.74 0.44 0.24 SEAM_156,157 SEAM_153,154 <0.1 <0.1 <0.1 <0.1 <0.1 SEAM_156,157 SEAF_136,137 0.94 0.77 0.68 0.41 0.23 SEAM_156,157 SEAF_145,146 1.31 1.14 0.81 0.38 0.2 SEAM_156,157 SEAF_153,154 0.2 0.15 0.1 <0.1 <0.1 Differential High Density Vertical Crosstalk Pin Map Pin153 Pin145 Pin154 Pin136 Pin156 Pin137 Pin157 Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 Pin146 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:15 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Table 16 - Propagation Delay (Mated Connector) Single-Ended: 1:1 S/G 76 ps Single-Ended: 2:1 S/G 74 ps Differential: Optimal Horizontal 72 ps Differential: Optimal Vertical 72 ps Differential: High Density Vertical 75 ps Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:16 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true performance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to reduce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended applications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be implemented using various signal and ground pin assignments. In high-speed systems, provisions must be made in the interconnect for signal return currents. Such paths are often referred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Various combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. However, dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:17 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height For this connector, the following array configurations are evaluated: Open pin field Signal pin field Grounded pin field G T 50 ohm termination field Single-Ended Impedance (denoted by green circles): 1:1 S:G ratio 2:1 S:G ratio Single-Ended Crosstalk (denoted by red circles): 1:1 S:G ratio 2:1 S:G ratio Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:18 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:19 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Impedance (denoted by green circles): Optimal Horizontal Optimal Vertical High Density Vertical Differential Crosstalk (denoted by red circles): Optimal Horizontal Optimal Vertical High Density Vertical Only one single-ended signal or differential pair was driven for crosstalk measurements. Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended signals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from laboratory results. However, in most applications, performance can safely be considered equivalent. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:20 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary significantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worstcase performance. In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 500ps. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, parameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network analyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response. Time Domain procedure is provided in Appendix E of this report. Parameters or formats not included in this report may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the connector and connector footprint. It includes 10 mils of PCB trace on each end of the connector. Delay is measured at 30 picoseconds signal rise-time. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:21 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Crosstalk or coupled noise data is provided for various signal configurations. All measurements are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the nearend and far-end of the SUT. Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for determining acceptable interconnect performance. However, modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appendices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected]. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:22 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix A – Frequency Domain Response Graphs Single-Ended Application – Insertion Loss Single-Ended Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 1:1 S/G Pattern 2:1 S/G pattern -6 -7 0 2 4 6 8 10 12 14 16 18 20 18 20 Frequency (GHz) Single-Ended Application – Return Loss Single-Ended Application - Return Loss 0 Return Loss (dB) -10 -20 -30 -40 1:1 S/G Pattern 2:1 S/G pattern -50 -60 0 2 4 6 8 10 12 14 16 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:23 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT Single-Ended Application - NEXT 0 Near-End Crosstalk (dB) -20 -40 -60 SEAM167_SEAM147 -80 SEAM167_SEAM165 SEAM167_SEAM176 -100 0 2 4 6 8 10 12 14 16 18 20 16 18 20 Frequency (GHz) Single-Ended 1:1 S/G Pattern Application – FEXT Single-Ended Application - FEXT 0 Far-End Crosstalk (dB) -20 -40 -60 -80 SEAM167_SEAF147 SEAM167_SEAF165 SEAM167_SEAF176 -100 0 2 4 6 8 10 12 14 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:24 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT Single-Ended Application - NEXT 0 Near-End Crosstalk (dB) -20 -40 -60 SEAM156_SEAM146 -80 SEAM156_SEAM155 SEAM156_SEAM165 -100 0 2 4 6 8 10 12 14 16 18 20 16 18 20 Frequency (GHz) Single-Ended 2:1 S/G Pattern Application – FEXT Single-Ended Application - FEXT 0 Far-End Crosstalk (dB) -20 -40 -60 SEAM156_SEAF146 -80 SEAM156_SEAF155 SEAM156_SEAF165 -100 0 2 4 6 8 10 12 14 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:25 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Application – Insertion Loss Differential Application - Insertion Loss 0 Insertion Loss (dB) -1 -2 -3 -4 -5 -6 Optimal Horizontal Optimal Vertical High Density Vertical -7 -8 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Differential Application – Return Loss Differential Application - Return Loss 0 Return Loss (dB) -10 -20 -30 -40 Optimal Horizontal Optimal Vertical High Density Vertical -50 -60 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:26 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Optimal Horizontal Application – NEXT Differential Application - NEXT 0 Near-End Crosstalk (dB) -20 -40 -60 SEAM147,157_SEAM107,117 SEAM147,157_SEAM126,136 SEAM147,157_SEAM145,155 -80 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Differential Optimal Horizontal Application – FEXT Differential Application - FEXT 0 Far-End Crosstalk (dB) -20 -40 -60 SEAM147,157_SEAF107,117 -80 SEAM147,157_SEAF126,136 SEAM147,157_SEAF145,155 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:27 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Optimal Vertical Application – NEXT Differential Application - NEXT 0 Near-End Crosstalk (dB) -20 -40 -60 SEAM157,158_SEAM137,138 SEAM157,158_SEAM145,146 SEAM157,158_SEAM153,154 -80 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Differential Optimal Vertical Application – FEXT Differential Application - FEXT 0 Far-End Crosstalk (dB) -20 -40 -60 SEAM157,158_SEAF137,138 -80 SEAM157,158_SEAF145,146 SEAM157,158_SEAF153,154 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:28 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential High Density Vertical Application – NEXT Differential Application - NEXT 0 Near-End Crosstalk (dB) -20 -40 -60 SEAM156,157_SEAM136,137 SEAM156,157_SEAM145,146 SEAM156,157_SEAM153,154 -80 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Differential High Density Vertical Application – FEXT Differential Application - FEXT 0 Far-End Crosstalk (dB) -20 -40 -60 SEAM156,157_SEAF136,137 -80 SEAM156,157_SEAF145,146 SEAM156,157_SEAF153,154 -100 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:29 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix B – Time Domain Response Graphs Single-Ended Application – Input Pulse Single-Ended Application - Input Pulse 1.2 Amplitude (Volts) 1.0 0.8 0.6 30 psec 50 psec 0.4 100 psec 250 psec 500 psec 0.2 0.0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:30 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 1:1 S/G Pattern Application – Impedance Single-Ended Application - Impedance 90 30 psec 50 psec 80 Impedance (ohms) 100 psec 250 psec 500 psec 70 60 50 40 1.0 1.5 2.0 2.5 3.0 Time (nsec) Single-Ended 1:1 S/G Pattern Application – Propagation Delay Single-Ended Application - Propagation Delay 1.2 1.0 Amplitude (Volts) 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:31 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 2:1 S/G Pattern Application – Impedance Single-Ended Application - Impedance 90 30 psec 50 psec 80 Impedance (ohms) 100 psec 250 psec 500 psec 70 60 50 40 1.0 1.5 2.0 2.5 3.0 Time (nsec) Single-Ended 2:1 S/G Pattern Application – Propagation Delay Single-Ended Application - Propagation Delay 1.2 1.0 Amplitude (Volts) 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:32 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM167_SEAM147 Single-Ended Application - NEXT 0.8 30 psec 50 psec 0.6 100 psec Crosstalk (%) 0.4 250 psec 500 psec 0.2 0.0 -0.2 -0.4 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM167_SEAF147 Single-Ended Application - FEXT 0.2 Crosstalk (%) 0.0 -0.2 30 psec 50 psec 100 psec -0.4 250 psec 500 psec -0.6 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:33 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM167_SEAM165 Single-Ended Application - NEXT Crosstalk (%) 1.4 1.2 30 psec 50 psec 1.0 100 psec 0.8 250 psec 500 psec 0.6 0.4 0.2 0.0 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM167_SEAF165 Single-Ended Application - FEXT 1.4 1.2 30 psec 50 psec 1.0 100 psec Crosstalk (%) 0.8 250 psec 500 psec 0.6 0.4 0.2 0.0 -0.2 -0.4 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:34 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 1:1 S/G Pattern Application – NEXT, SEAM167_SEAM176 Single-Ended Application - NEXT Crosstalk (%) 3.0 2.5 30 psec 50 psec 2.0 100 psec 250 psec 500 psec 1.5 1.0 0.5 0.0 -0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 1:1 S/G Pattern Application – FEXT, SEAM167_SEAF176 Single-Ended Application - FEXT 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec 100 psec -0.6 -0.8 250 psec 500 psec -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:35 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM156_SEAM146 Single-Ended Application - NEXT 14 12 30 psec 50 psec 100 psec Crosstalk (%) 10 250 psec 500 psec 8 6 4 2 0 -2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM156_SEAF146 Single-Ended Application - FEXT 1 0 Crosstalk (%) -1 -2 -3 30 psec 50 psec -4 100 psec 250 psec 500 psec -5 -6 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:36 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM156_SEAM155 Single-Ended Application - NEXT 10 30 psec 50 psec 8 Crosstalk (%) 100 psec 250 psec 500 psec 6 4 2 0 -2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM156_SEAF155 Single-Ended Application - FEXT 1 Crosstalk (%) 0 -1 -2 30 psec 50 psec 100 psec -3 250 psec 500 psec -4 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:37 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Single-Ended 2:1 S/G Pattern Application – NEXT, SEAM156_SEAM165 Single-Ended Application - NEXT 4 30 psec 50 psec Crosstalk (%) 3 100 psec 250 psec 500 psec 2 1 0 -1 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Single-Ended 2:1 S/G Pattern Application – FEXT, SEAM156_SEAF165 Single-Ended Application - FEXT 0.5 Crosstalk (%) 0.0 -0.5 -1.0 30 psec 50 psec -1.5 100 psec 250 psec 500 psec -2.0 -2.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:38 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Application – Input Pulse Differential Application - Input Pulse 0.8 Amplitude (Volts) 0.6 0.4 0.2 30 psec 50 psec 0.0 100 psec -0.2 250 psec 500 psec -0.4 -0.6 -0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:39 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Optimal Horizontal Application – Impedance Differential Application - Impedance 140 30 psec 50 psec 130 Impedance (ohms) 100 psec 250 psec 500 psec 120 110 100 90 80 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Time (nsec) Differential Optimal Horizontal Application – Propagation Delay Differential Application - Propagation Delay 1.2 1.0 Amplitude (Volts) 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:40 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential Optimal Vertical Application – Impedance Differential Application - Impedance 140 30 psec 50 psec Impedance (ohms) 130 100 psec 120 250 psec 500 psec 110 100 90 80 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Time (nsec) Differential Optimal Vertical Application – Propagation Delay Differential Application - Propagation Delay 1.2 Amplitude (Volts) 1.0 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:41 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Differential High Density Vertical Application – Impedance Differential Application - Impedance Impedance (ohms) 150 140 30 psec 50 psec 130 100 psec 250 psec 500 psec 120 110 100 90 80 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Time (nsec) Differential High Density Vertical Application – Propagation Delay Differential Application - Propagation Delay 1.2 Amplitude (Volts) 1.0 0.8 0.6 0.4 0.2 Input Output 0.0 -0.2 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:42 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM147,157_SEAM107,117 Differential Application - NEXT Crosstalk (%) 0.3 0.2 30 psec 50 psec 0.1 250 psec 500 psec 100 psec 0.0 -0.1 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Horizontal Application – FEXT, SEAM147,157_SEAF107,117 Differential Application - FEXT Crosstalk (%) 0.8 0.6 30 psec 50 psec 0.4 250 psec 500 psec 100 psec 0.2 0.0 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:43 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM147,157_SEAM126,136 Differential Application - NEXT 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec -0.6 100 psec -0.8 250 psec 500 psec -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Horizontal Application – FEXT, SEAM147,157_SEAF126,136 Differential Application - FEXT 0.20 0.15 Crosstalk (%) 0.10 0.05 0.00 -0.05 30 psec 50 psec 100 psec -0.10 250 psec 500 psec -0.15 -0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:44 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Horizontal Application – NEXT, SEAM147,157_SEAM145,155 Differential Application - NEXT 0.10 Crosstalk (%) 0.05 0.00 30 psec 50 psec -0.05 100 psec 250 psec 500 psec -0.10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Horizontal Application – FEXT, SEAM147,157_SEAF145,155 Differential Application - FEXT 0.15 Crosstalk (%) 0.10 0.05 0.00 -0.05 30 psec 50 psec -0.10 100 psec 250 psec 500 psec -0.15 -0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:45 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM157,158_SEAM137,138 Differential Application - NEXT Crosstalk (%) 0.4 0.3 30 psec 50 psec 0.2 100 psec 250 psec 500 psec 0.1 0.0 -0.1 -0.2 -0.3 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Vertical Application – FEXT, SEAM157,158_SEAF137,138 Differential Application - FEXT 0.15 0.10 Crosstalk (%) 0.05 0.00 -0.05 -0.10 30 psec 50 psec 100 psec -0.15 250 psec 500 psec -0.20 -0.25 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:46 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM157,158_SEAM145,146 Differential Application - NEXT 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec -0.6 100 psec -0.8 250 psec 500 psec -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Vertical Application – FEXT, SEAM157,158_SEAF145,146 Differential Application - FEXT 0.3 30 psec 50 psec 100 psec Crosstalk (%) 0.2 250 psec 500 psec 0.1 0.0 -0.1 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:47 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff Optimal Vertical Application – NEXT, SEAM157,158_SEAM153,154 Differential Application - NEXT 0.15 Crosstalk (%) 0.10 0.05 0.00 -0.05 30 psec 50 psec -0.10 100 psec 250 psec 500 psec -0.15 -0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff Optimal Vertical Application – FEXT, SEAM157,158_SEAF153,154 Differential Application - FEXT 0.3 30 psec 50 psec 100 psec Crosstalk (%) 0.2 250 psec 500 psec 0.1 0.0 -0.1 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:48 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff High Density Vertical Application – NEXT, SEAM156,157_SEAM136,137 Differential Application - NEXT Crosstalk (%) 0.8 0.6 30 psec 50 psec 0.4 250 psec 500 psec 100 psec 0.2 0.0 -0.2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff High Density Vertical Application – FEXT, SEAM156,157_SEAF136,137 Differential Application - FEXT 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec -0.6 100 psec -0.8 250 psec 500 psec -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:49 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff High Density Vertical Application – NEXT, SEAM156,157_SEAM145,146 Differential Application - NEXT 0.2 Crosstalk (%) -0.0 -0.2 -0.4 30 psec 50 psec -0.6 100 psec -0.8 250 psec 500 psec -1.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff High Density Vertical Application – FEXT, SEAM156,157_SEAF145,146 Differential Application - FEXT 1.4 1.2 30 psec 50 psec 1.0 100 psec Crosstalk (%) 0.8 250 psec 500 psec 0.6 0.4 0.2 0.0 -0.2 -0.4 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:50 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Diff High Density Vertical Application – NEXT, SEAM156,157_SEAM153,154 Differential Application - NEXT 0.10 Crosstalk (%) 0.05 0.00 30 psec 50 psec -0.05 100 psec 250 psec 500 psec -0.10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Diff High Density Vertical Application – FEXT, SEAM156,157_SEAF153,154 Differential Application - FEXT Crosstalk (%) 0.20 0.15 30 psec 50 psec 100 psec 0.10 250 psec 500 psec 0.05 0.00 -0.05 -0.10 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Time (nsec) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:51 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix C – Product and Test System Descriptions Product Description Product test samples are 16 mm (0.630”) stack height SEAM/SEAF Series connectors. The part numbers are SEAM-30-11.0-S-10-2-A-K-TR and SEAF-30-05.0-S-10-2-A-KTR. The SEAM/SEAF Series is an open pin field connector designed for single-ended signals with various options for differential signaling configurations. The open pin field array is 10 row providing 30 signal pins per row. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. Ten test fixtures are specific to the SEAM/SEAF Series connector set and identified by part numbers PCB-103314-TST-01-A and B to PCB-103314-TST-05 A and B. Calibration standards specific to the SEAM/SEAF Series are located on the calibration boards PCB-103314-TST-06 and PCB-103314-TST07. To keep trace lengths short, five different test board sets were required to access the necessary signal pins. PCB-103314-TST-XX Test Fixtures Shown below is a photograph of one of the five test board sets. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:52 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height PCB-103314-TST-XX PCB Layout Panel Artwork of the PCB design is shown below. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:53 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height PCB Fixtures The test fixtures used are as follows: PCB-103314 -TST-04-B Rev – SEAM Series Test Board for SE 1:1 Pattern PCB-103314 -TST-04-A Rev – SEAF Series Test Board for SE 1:1 Pattern PCB-103314 -TST-05-B Rev – SEAM Series Test Board for SE 2:1 Pattern PCB-103314 -TST-05-A Rev – SEAF Series Test Board for SE 2:1 Pattern PCB-103314 -TST-01-B Rev – SEAM Series Test Board for Differential Optimal Horizontal PCB-103314 -TST-01-A Rev – SEAF Series Test Board for Differential Optimal Horizontal PCB-103314 -TST-02-B Rev – SEAM Series Test Board for Differential Optimal Vertical PCB-103314 -TST-02-A Rev – SEAF Series Test Board for Differential Optimal Vertical PCB-103314 -TST-03-B Rev – SEAM Series Test Board for Differential High Density Vertical PCB-103314 -TST-03-A Rev – SEAF Series Test Board for Differential High Density Vertical Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:54 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:55 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:56 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Calibration Board Test fixture losses and test point reflections were removed from the data by use of TRL calibration. The calibration board is shown below. Prior to making any measurements, the calibration board is characterized to obtain parameters required to define the calibration kit. Once a cal kit is defined, calibration using the standards on the calibration board can be performed. Finally, the device can be measured and the test board effects are automatically removed. Thru line – 2980 mils Open Reflect – 1490 mils Line 1 – 6370 mils Line 2 – 3660 mils Line 3 – 3120 mils Match – 1490 mils Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:57 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height All traces on the test boards are length matched to 1.5” measured from the center of the pad to the SMA. The TRL calibration effectively removes 1.490” of test board trace effects. This means that 10 mils of test board trace length effects are included in the measurement. The S-Parameter measurement includes: A- The SEAM/SEAF Series connector set B- Test board vias, pads (footprint effects) C- 10 mils of 9.5 mil wide microstrip trace The figure below shows the location of the measurement reference plane. B C Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:58 Measurement reference plane Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix D – Test and Measurement Setup The test instrument is the Agilent N5230C PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network analyzer is configured as follows: Start Frequency – 300 KHz Stop Frequency – 20 GHz Number of points -1601 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5230C Measurement Setup Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:59 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Test Instruments QTY Description 1 Agilent N5230C PNA-L Network Analyzer (300 KHz to 20 GHz) 1 Agilent N4433A ecal module (300 KHz to 20 GHz) Test Cables & Adapters QTY Description 4 Gore OWD01D02039-4 (DC-50 GHz) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:60 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the LRM calibration standards, the SI test boards, and the selection of the PCB vendor. The measurement process begins with a measurement of the LRM calibration standards. A coaxial SOLT calibration is performed using an N4433A ecal module. This measurement is required in order to obtain precise values of the line standard offset delay and frequency bandwidths. Measurements of the reflect and 2x through line standard can be used to determine the maximum frequency for which the calibration standards are valid. For the SEAM/SEAF Series test boards, this is greater than 20 GHz. From the LRM calibration standard measurements, a user defined calibration kit is developed and stored in the network analyzer. Calibration is then performed on all 4 ports following the calibration wizard within the Agilent N5230C. This calibration is saved and can be recalled at any time. Calibration takes roughly 30 minutes to perform. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain response. Perfect transformation requires Frequency Domain data from DC to infinity Hz. Fortunately, a very accurate Time Domain response can be obtained with bandwidth-limited data, such as measured with modern network analyzer. The Time Domain responses were generated using Agilent ADS 2009 update 1. This tool has a transient convolution simulator, which can generate a Time Domain response directly from measured S-Parameters. An example of a similar methodology is provided in the Samtec Technical Note on domain transformation. http://www.samtec.com/Technical_Library/reference/articles/pdfs/tech-note_usingPLTS-for-time-domain-data_web.pdf Impedance (TDR) A step pulse is applied to the touchstone model of the connector and the reflected voltage is monitored. The reflected voltage is converted to a reflection coefficient and then transformed into an impedance profile. All ports of the Touchstone model are terminated in 50 ohms. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:61 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Propagation Delay (TDT) The Propagation Delay is a measure of the Time Domain delay through the connector and footprint. A step pulse is applied to the touchstone model of the connector and the transmitted voltage is monitored. The same pulse is also applied to a reference channel with zero loss, and the Time Domain pulses are plotted on the same graph. The difference in time, measured at the 50% point of the step voltage is the propagation delay. Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) A step pulse is applied to the touchstone model of the connector and the coupled voltage is monitored. The amplitude of the peak-coupled voltage is recorded and reported as a percentage of the input pulse. Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:62 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved High Speed Characterization Report Series: SEAM/SEAF Description: Open Pin Field Array, 1.27mm x 1.27mm Pitch, 16mm Stack Height Appendix F – Glossary of Terms ADS – Advanced Design Systems BC – Best Case crosstalk configuration DUT – Device under test, term used for TDA IConnect & Propagation Delay waveforms FD – Frequency domain FEXT – Far-End Crosstalk GSG – Ground–Signal-Ground; geometric configuration GSSG - Ground–Signal-Signal-Ground; geometric configuration HDV – High Density Vertical NEXT – Near-End Crosstalk OV – Optimal Vertical OH – Optimal Horizontal PCB – Printed Circuit Board PPO – Pin Population Option SE – Single-Ended SI – Signal Integrity SUT – System Under Test S – Static (independent of PCB ground) SOLT – acronym used to define Short, Open, Load & Thru Calibration Standards TD – Time Domain TDA – Time Domain Analysis TDR – Time Domain Reflectometry TDT – Time Domain Transmission WC – Worst Case crosstalk configuration Z – Impedance (expressed in ohms) Samtec Inc. 520 Park East Blvd. New Albany IN 47151-1147 USA ©Samtec, Inc. 2005 WWW.SAMTEC.COM 1-800-SAMTEC-9 (US & Canada) [email protected] Page:63 Phone: 812-944-6733 Fax: 812-948-5047 Report Revision: 2/28/2012 All Rights Reserved