C365-3SRA1 TECHNICAL DATA UV LED high power chip die, 365nm Drawing All dimensions in µm Thickness: 120 µm ± 10 µm Storage Conditions Item Storage time Storage Temperature Storage Humidity Value 3 Months 5 … +35 °C 45 …85 % Specifications (If=100mA, Ta=25°C) Item Electrical Specification 1 Forward Voltage * Reverse Current Optical Specification Optical Power 2 Peak Wavelength * Spectral Half Width (FWHM) Symbol Min. Typ. Max. Unit UF IR 3.2 3.6 4.2 10.0 V µA PO λP Δλ 5 363 15 10 370 mW nm nm * measurement tolerance is ± 0.2 V, ± 2 nm Device Materials Item Wafer material Electrodes Material GaN based on Sapphire Substrate n-contact Au p-contact Au C365-3SRA1 is RoHS compliant 29.01.2013 C365-3SRA1 1 of 3 Typical Performance Curves forward voltage vs. forward current: forward voltage vs. relative output power: ambient temperature vs. relative output power: ambient temperature vs. forward voltage: spectrum: *above measurements derive from chip die packaged into resin mold LED package 29.01.2013 C365-3SRA1 2 of 3 Configuration Chips are arranged on 200x200 mm adhesive sheet at 0,75mm pitch Precaution for Use 1. Static Electricity • The LED chip dies are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the chips. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the chips. 2. Heat Generation • Thermal design of the end product is of paramount importance. Please consider the heat generation of the chip when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of chip placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. • The operating current should be decided after considering the ambient maximum temperature of the chip dies. 29.01.2013 C365-3SRA1 3 of 3