C365-2SR2 TECHNICAL DATA UV LED, Chip Die GaN C365-2SR2 is a 280x280 µm UV LED chip die, based on GaN material. On forward bias, it emits a radiation of typical 1.0-1.5 mW at a peak wavelength of 365 nm. Specifications • • • • Structure: Substrate: Peak Wavelength: Optical Output Power: GaN based material Sapphire 365 nm 1.0-1.5 mW • • Bottom Area: Electrodes: 280x280 µm ±20 µm Au alloy (Unit: µm) Electro-Optical Characteristics Item Forward Voltage Reverse Current 1 Peak Wavelength * Half Width Total Radiated Power Symbol VF IR λP Δλ Po Condition IF = 20 mA VR = 5 V IF = 20 mA IF = 20 mA IF = 20 mA Min. 3.2 363 1.0 Typ. 3.6 15 - Max. 4.2 10 370 1.5 Unit V µA nm nm mW *1 Measurement error: ±2 nm *² Radiated Power is measured as chip mounted in TO-18 header; measurement error: 10% *³ on request Note: The above specifications are for reference purpose only and subjected to change without prior notice. 23.01.2013 C365-2SR2 1 of 4 Typical Performance Curves Forward Current – Forward Voltage Forward Current – Relative Output Power Ambient Temperature – Relative Output Power Ambient Temperature – Forward Voltage Relative Spectral Emission Note: Typical performance curves are depending on packaging method. The above data are for SMD packaged LEDs. 23.01.2013 C365-2SR2 2 of 4 Dimensions and Design Dimensions Mechanical Specification Emission Area: Bottom Area: Chip Thickness: 201x201 ±5 µm 280x280 µm ±20 µm 120 µm ±10 µm N Bonding Pad Electrode: P Bonding Pad Electrode: 90 µm ±5 µm 90 µm ±5 µm (R=45) Electrodes Spacing: 128 µm ±5 µm (Unit: µm) Cross Section Diagram Material Substrate: Epitaxial Layer: Sapphire GaN Based Material N Bonding Pad Electrode: P Bonding Pad Electrode: Au alloy Au alloy Package Chips are attached on an arranging sheet. Arranging sheet: Tecni tape T4, TECNISCO Sheet size: 200x200 mm Adhesive side: the back of chips Arranging pitch: 0.43 mm Inspection • All chips will be inspected on each item of the electrical and optical characteristics (VF, IR, PO, λP, Δλ). • Verification of quantity: Calculated quantity of chips on an arranging sheet without shortage. 23.01.2013 C365-2SR2 3 of 4 Precaution for Use 1. Cautions • DO NOT look directly into the emitting area of the LED during operation! • The LED is emitting UV radiation, which may harm your eyes. To prevent inadequate exposure of UV radiation, wear UV protective glasses. • Please handle with care when taking out the chips on sheet. • A UV light resistance paste for chip mounting is recommended. 2. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 23.01.2013 C365-2SR2 4 of 4