RENESAS UPG2163T5N-E2-A

PreliminaryData Sheet
μPG2163T5N
R09DS0019EJ0300
Rev.3.00
May 19, 2011
GaAs Integrated Circuit
Broadband SPDT Switch for Dual-Band Wireless LAN
DESCRIPTION
The μ PG2163T5N is GaAs MMIC SPDT (Single Pole Double Throw) switch which was developed for 2.4 GHz and 6
GHz dual-band wireless LAN. This device can operate at frequencies from 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz,
with low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to
high-density surface mounting.
<R>
FEATURES
• Operating frequency
: f = 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz
• Switch control voltage
: Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.)
: Vcont (L) = −0.3 to 0.3 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.40 dB TYP. @ f = 2.4 to 2.5 GHz
: Lins2 = 0.50 dB TYP. @ f = 4.9 to 6.0 GHz
: Lins3 = 0.90 dB TYP. @ f = 8.0 GHz
: Lins4 = 0.50 dB TYP. @ f = 0.5 to 2.5 GHz
• High isolation
: ISL1 = 38 dB TYP. @ f = 2.4 to 2.5 GHz
: ISL2 = 30 dB TYP. @ f = 4.9 to 6.0 GHz
: ISL3 = 23 dB TYP. @ f = 8.0 GHz
: ISL4 = 43 dB TYP. @ f = 0.5 to 1.0 GHz
: ISL5 = 38 dB TYP. @ f = 1.0 to 2.5 GHz
• Handling power
: Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)
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APPLICATIONS
• Dual-band wireless LAN (IEEE802.11a/b/g/n), etc.
ORDERING INFORMATION
Part Number
Order Number
μPG2163T5N-E2
μPG2163T5N-E2-A
Package
Marking
6-pin plastic TSON
G4X
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
(Pb-Free)
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2163T5N
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 1 of 8
μPG2163T5N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
G4X
1
2
(Bottom View)
(Top View)
3
6
1
6
6
1
5
2
5
5
2
4
4
3
3
4
Pin No.
Pin Name
1
GND
2
Vcont2
3
OUT2 (RX)
4
OUT1 (TX)
5
Vcont1
6
IN (ANT)
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
IN (ANT)−OUT1 (TX)
IN (ANT)−OUT2 (RX)
High
Low
OFF
ON
Low
High
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Vcont
−6.0 to +6.0
V
Input Power
Pin
+32
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +135
°C
Switch Control Voltage
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RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.8
3.0
5.0
V
Switch Control Voltage (L)
Vcont (L)
−0.3
0
0.3
V
Operating Frequency 1
Note 1
f1
2.4
−
2.5
GHz
Operating Frequency 2
Note 1
f2
4.9
−
6.0
GHz
Operating Frequency 3
Note 2
f3
−
8.0
−
GHz
Operating Frequency 4
Note 3
f4
0.5
−
1.0
GHz
Operating Frequency 5
Note 3
f5
1.0
−
2.4
GHz
Notes 1. DC blocking capacitors = 4 pF
2. DC blocking capacitors = 2 pF
3. DC blocking capacitors = 100 pF
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 2 of 8
μPG2163T5N
<R>
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF,
unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 2.4 to 2.5 GHz
−
0.40
0.60
dB
Insertion Loss 2
Lins2
f = 4.9 to 6.0 GHz
−
0.50
0.80
dB
−
0.90
−
dB
−
0.50
−
dB
Insertion Loss 3
Lins3
f = 8.0 GHz
Note 1
Note 2
Insertion Loss 4
Lins4
f = 0.5 to 2.5 GHz
Isolation 1
ISL1
f = 2.4 to 2.5 GHz
35
38
−
dB
Isolation 2
ISL2
f = 4.9 to 6.0 GHz
27
30
−
dB
Isolation 3
ISL3
f = 8.0 GHz
Isolation 4
ISL4
−
23
−
dB
f = 0.5 to 1.0 GHz
Note 2
40
43
−
dB
Note 2
35
38
−
dB
Note 1
Isolation 5
ISL5
f = 1.0 to 2.5 GHz
Input Return Loss 1
RLin1
f = 2.4 to 2.5 GHz
−
15
−
dB
Input Return Loss 2
RLin2
f = 4.9 to 6.0 GHz
−
15
−
dB
Input Return Loss 3
RLin3
f = 8.0 GHz
−
15
−
dB
−
20
−
dB
Note 1
Note 2
Input Return Loss 4
RLin4
f = 0.5 to 2.5 GHz
Output Return Loss 1
RLout1
f = 2.4 to 2.5 GHz
−
15
−
dB
Output Return Loss 2
RLout2
f = 4.9 to 6.0 GHz
−
15
−
dB
−
15
−
dB
−
20
−
dB
Pin (1 dB) 1 f = 2.4 to 2.5 GHz
−
+31.0
−
dBm
Pin (1 dB) 2 f = 4.9 to 6.0 GHz
−
+29.0
−
dBm
Note 1
Output Return Loss 3
RLout3
f = 8.0 GHz
Output Return Loss 4
RLout4
f = 0.5 to 2.5 GHz
1 dB Loss Compression
Input Power 1
Note 3
1 dB Loss Compression
Input Power 2
Note 2
Note 3
Input 3rd Order Intercept Point
IIP3
−
+55
−
dBm
Switch Control Current
Icont
−
0.1
1.0
μA
Switch Control Speed
tSW
−
50
−
ns
50% CTL to 90/10%
Notes 1. DC blocking capacitors = 2 pF
2. DC blocking capacitors = 100 pF
3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 3 of 8
μPG2163T5N
<R>
EVALUATION CIRCUIT
4 pF
Vcont2
1
6
2
5
1 000 pF
Vcont1
1 000 pF
4
3
OUT2 (RX)
IN (ANT)
Remark C1: 2.4 to 2.5 GHz and 4.9 to 6.0 GHz
8.0 GHz
0.5 to 2.5 GHz
OUT1 (TX)
C1
C1
4 pF
2 pF
100 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 4 of 8
μPG2163T5N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
MOUNTING PAD
0.3
0.2
0.5
1.0
0.5
0.3
0.5
0.3
0.3
SOLDER MASK
0.475
0.15
0.5
0.55
0.5
0.25
0.35
0.475
0.25
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 5 of 8
μPG2163T5N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
(Bottom View)
(Side View)
0.3±0.07
0.2+0.07
–0.05
1.5±0.1
0.5±0.06
1.5±0.1
1.2±0.1
(Top View)
0.37+0.03
–0.05
R09DS0019EJ0300 Rev.3.00
May 19, 2011
0.2±0.1
0.7±0.1
Page 6 of 8
μPG2163T5N
<R>
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 3 times
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
HS350
Caution Do not use different soldering methods together (except for partial heating).
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 7 of 8
μPG2163T5N
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R09DS0019EJ0300 Rev.3.00
May 19, 2011
Page 8 of 8
μPG2163T5N Data Sheet
Revision History
Rev.
−
3.00
Date
Page
Feb 2008
May 19, 2011
−
Throughout
Description
Summary
Previous No. :PG10626EJ02V0DS
Modification of operating frequencies
f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz -> f = 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz
p.1
p.7
Modification of APPLICATIONS
Modification of RECOMMENDED SOLDERING CONDITIONS
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