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LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
PROCEDURE No.
PCP3003
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 1 of 11
Title: PCB MANUFACTURING CAPABILITY
CONTENTS
1. Introduction
2. Data Interface
3. Drilling
4. Machining (Metal Backed)
5. Routing (Softboard/Multilayer)
6. Feature Imaging
7. Surface Finish
8. Solder Mask/Notation
9. Chip & Wire Assembly
Status
Authorised by: Mr P. Bagley
Signed
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 2 of 11
Title: PCB MANUFACTURING CAPABILITY
1. Introduction
Labtech’s capabilities are geared towards the successful manufacture of microwave PTFE Printed Circuit
Boards and has significant experience meeting the demands of this sector. The following pages present
Labtech’s capabilities by specific process.
Labtech produces the following PCB types:
 Metal Backed PTFE Circuits
 Aluminium, Brass and Copper carrier
 Post and pre-bonded processing
 PTH through PTFE and metal carrier
 Single Sided & Double Sided Soft PTFE Circuits
 High tolerance softboard
 Multilayer Microwave Circuits
 PTFE Multilayer
 Mixed dielectric multilayers
 Metal backed multilayers
 Metal core multilayers
 Fusion bonded multilayers
 Blind & buried vias
 Conformal multilayers
 Assembly of embedded resistors, capacitors and connectors
 Chip and wire assembly

For details of laminates used, refer to the file ‘Microwave Materials’ (located under ‘PDF Index’) on our
website, www.labtechmicrowave.com
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 3 of 11
Title: PCB MANUFACTURING CAPABILITY
2. Data Interface
Data Submittal Methods
E-mail:
Modem:
FTP:
Post:
ptfe@labtech.ltd.uk
Contact Technical Sales
Contact Technical Sales
3.5” Disc/ CD Rom / Hard Copy Drawings / Photography Masters
Data Formats
PCB Design Data:
Gerber / Extended Gerber (RS-274X)
Graphicode Workfile
Autocad DWG / DXF
Excellon / Sieb & Meyer NC Data
3D Mechanical Design:
Autocad DWG / DXF
IGES
Please note PCB design data submitted in Autcad DWG / DXF format will require approval plots following
translation.
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 4 of 11
Title: PCB MANUFACTURING CAPABILITY
3. Drilling
Minimum Feature
Softboard / Multilayer Holes
Brass / Copper Backed
Holes
Aluminium Backed Holes
Standard
0.30mm
0.80mm
1.00mm
0.15mm
Laser Drilled Vias
0.012”
0.032”
0.040”
0.006”
Technical
0.20mm
0.40mm
0.60mm
0.10mm
R&D
0.008"
0.016”
0.024”
0.004"
0.05mm
0.002”
Maximum Aspect Ratio (Board Thickness : Hole Diameter)
Standard
Technical
Aluminium Backed
Blind Holes
5:1 up to 1.6mm thickness
6:1 above 1.6mm thickness
8:1
4:1
1:1
On metal backed circuits aspect ratios may be reduced by machining a recess into the metal backing, by
agreement.
Minimum Hole to Hole Spacing
Standard
R&D
0.20mm
0.10 mm
0.008"
0.004”
+/- 0.075mm
+/- 0.050mm
+/- 0.003"
+/- 0.002"
+/- 0.050mm
+/- 0.020mm
+/- 0.002"
+/- 0.0008"
Plated Through Hole Diameter Tolerance (Finished)
Standard
Technical
Non-Plated Through Hole Diameter Tolerance
Standard
Technical
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 5 of 11
Title: PCB MANUFACTURING CAPABILITY
Positional Tolerance
Hole – Hole
+/- 0.020mm
+/- 0.0008"
+/- 0.100mm
+/- 0.050mm
+/- 0.025mm
+/- 0.004"
+/- 0.002"
+/- 0.001
“Z” Axis Depth Control (Softboard / Multilayers)
Standard
Technical
R&D
4. Machining (Metal Backed)
Profile Feature Tolerance
Standard
Technical
R&D
+/- 0.100mm
+/-0.050mm
+/- 0.025mm
+/- 0.004"
+/- 0.002"
+/- 0.001
Minimum Internal Radii
Standard
Technical
R&D
NB:
1.00mm
0.50mm
0.20mm
0.040"
0.020"
0.008
Smaller effective internal radii of corners can be achieved by permitting ‘overshooting’.
Laser machining can be used to ablate material to expose heavy metal backing.
Alignment to Circuit Image
Standard
Technical
+/- 0.100mm
+/-0.050mm
+/- 0.004"
+/- 0.002"
2
“Z” - Axis Depth Control
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 6 of 11
Title: PCB MANUFACTURING CAPABILITY
Standard (Mechanical)
Technical (Mechanical)
Status
+/- 0.100mm
+/-0.050mm
Authorised by: Mr P. Bagley
+/- 0.004"
+/- 0.002"
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 7 of 11
Title: PCB MANUFACTURING CAPABILITY
5. Routing (Softboard/Multilayer)
Profile Feature Tolerance
Standard (Mechanical)
Technical (Mechanical)
Laser
+/- 0.100mm
+/-0.050mm
+/-0.025mm
+/- 0.004"
+/- 0.002"
+/- 0.001"
0.500mm
0.200mm
0.010mm
0.020"
0.008"
0.0004"
+/- 0.100mm
+/-0.050mm
+/-0.020mm
+/- 0.004"
+/- 0.002"
+/- 0.0008"
+/- 0.100mm
+/-0.050mm
+/- 0.004"
+/- 0.002"
Minimum Internal Radii
Standard (Mechanical)
Technical (Mechanical)
Laser
Alignment to Circuit Image
Standard (Mechanical)
Technical (Mechanical)
Laser
“Z” Axis Depth Control
Standard (Mechanical)
Technical (Mechanical)
Laser machining can be controlled to ablate material and thus expose buried tracks and pads.
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 8 of 11
Title: PCB MANUFACTURING CAPABILITY
6. Feature Imaging
Minimum Circuit Feature (Track)
Standard
Technical
R&D
0.100mm
0.050mm
0.025mm
0.004"
0.002"
0.001”
Standard
Technical
0.100mm
0.050mm
0.004"
0.002"
Standard
Technical
+/- 0.020mm
+/- 0.010mm
+/- 0.0008"
+/- 0.0004"
Minimum Circuit Feature – Feature Spacing (Gap)
Track & Gap Tolerances
NB.
Final tolerances will be dependant on etched copper weight and customer design.
Pad – Drilled Hole Registration
Standard
Technical
R&D
+/- 0.100mm
+/- 0.050mm
+/- 0.030mm
+/- 0.004"
+/- 0.002"
+/- 0.0012
+/- 0.100mm
+/- 0.040mm
+/- 0.020mm
+/- 0.004"
+/- 0.0016"
+/- 0.0008"
Image Registration Side – Side
Standard
Technical
R&D
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 9 of 11
Title: PCB MANUFACTURING CAPABILITY
7. Surface Finish
Standard
Technical
Tin / Lead (90 / 10 Ratio) or Tin (dull)
(As Plated or Brushed)
5.00 – 15.00m
Bright Acid Tin
5.00 – 15.00m
Electroless Tin
Immersion Tin
0.10 – 1.00m
0.10m maximum
Electroless Nickel / Immersion Gold
Ni
Au
3.50 – 8.00m
0.05 – 0.08m
Electroless Nickel / Immersion Gold
(Higher Build Gold for wire Bonding)
Ni
Au
3.50 – 8.00m
0.08 – 0.10m
Electroless Nickel / Palladium / Gold
(Universal Plating for wire bonding)
Ni
Pd
Au
3.50 – 8.00m
0.20 – 0.50m
0.01 – 0.06m
Electrolytic Pure Soft Gold Plating
(Suitable for wire bonding)
Optional Nickel Under-layer
Au
1.00 – 5.00m
Ni
1.00 – 10.00m
Electrolytic Nickel / Hard Gold
Ni
Au
1.00 – 10.00m
1.00 – 5.00m
Hot Air Solder Levelled (Vertical)
(Note: Thickness will reduce in holes and
on track/pad corners)
Deposit thickness will vary across
the circuit, due to variations in design
0.75 – 5.00m
Other processes may be offered under R & D services by agreement
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 10 of 11
Title: PCB MANUFACTURING CAPABILITY
8. Solder Mask
Solder Mask
Type:
Thickness:
Colour:
Pencil Hardness:
Photoimageable Lea Ronal SPSR 5600 Series
20-30m / 0.0008"-0.0012"
Green (Red or Blue also Available)
6-7 H
Circuit Feature – Mask Clearance on Design
Standard
Technical
0.100mm
0.075mm
0.004"
0.003"
0.150mm
0.100mm
0.006"
0.004"
0.150mm
0.100mm
0.008"
0.004"
Minimum Soldermask Web (Isolation)
Standard
Technical
Solder Resist Dams (Line Thickness)
Standard
Technical
Notation
Type:
Colour:
Pencil Hardness:
Tamura USI-210 series
White, Yellow & Black (Others also Available)
4H
Minimum Character Size
Standard
Technical
1.500mm
1.000mm
0.060"
0.040"
Standard
Technical
0.254mm
0.150mm
0.010"
0.006"
Minimum Line Thickness
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 11 of 11
Title: PCB MANUFACTURING CAPABILITY
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 12 of 12
Title: PCB MANUFACTURING CAPABILITY
Peelable (Temporary) Solder Masks
Peters SD 2962P (Green)
Peters SD 2954 (Blue)
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4
PROCEDURE No.
PCP3003
LABTECH LIMITED
ISO9001 QMS LEVEL THREE PROCEDURE
Computer File Name:
PCP3003~A4_Capability_Document.
doc
Page 13 of 13
Title: PCB MANUFACTURING CAPABILITY
9. Chip & Wire Assembly
 Silver Epoxy transfer print and dispense
 Bond Wires:
Standard – Gold 25m diameter
Options:
Gold – 12.7 – 76m diameter
Aluminium – 20 to 76m diameter
Gold Ribbon – up to 25 x 250m (standard 25 x 50m)
 Maximum working assembly area 100mm x 100mm
 Typical placement accuracy 20m depending upon positioning indications
 Surface finished for bonding:
Strengths with 25m gold wire
Finish
Electrolytic pure gold
Universal finish
High build electroless gold
Typical Bond
- 8.00grms
- 9.00grms
- 7.50grms
 Component sizes down to 0202 (smaller by arrangement)
 Components picked from waffle or gel pack
Change Record
A2->A3
Minimum Track & Gap (technical) amended from 100 to 50 microns. Image registration side to side
(technical) from 50 to 40 microns
A3 ->A4
Changes throughout to table values. R&D category added. List of laminates added.
Status
Authorised by: Mr P. Bagley
Date: 9th January 2007
Issue: A4