SC2604 Simple PWM Boost Controller with Input Disconnect FET Drive POWER MANAGEMENT Features Description Input Voltage Range: 4.5V to 16V 1% Voltage Reference Accuracy Up to 95% Efficiency Input Disconnect FET Drive In-rush Current Control Internal Compensation Programmable Current Limit Programmable Soft Start 800mA Typical PWM Gate Drive 400kHz Switching Frequency Under Voltage Lockout <200uA Shutdown Current -40oC to +85oC Temperature Range MSOP-8 MSOP-8 and MLPD-UT8 Package, Pb Free, Halogen Free and WEEE/RoHS Compliant Applications 4 The SC2604 is a versatile, low-cost, voltage-mode PWM controller designed for boost DC/DC power supply applications. It features input disconnect FET driver allowing power source and load separation at shutdown mode, which eliminates possible leakage current from source to load. Also, it prevents catastrophic failure when output is shorted during operation. The SC2604 also includes temperature compensated voltage reference, internal ramp, current limit comparator, internally compensated error amplifier, and floating driver with charge pump. Programmable soft start controls in-rush current and reduces output voltage overshoot. Hiccup mode over-current protection allows system autoretry and ease of trouble shooting. 3 2 Internally compensated feedback loop makes power supply design simple, and eliminates the need for external compensation network. Portable Devices Flat Panel TV TV Set Top Box Auxiliary Supplies Peripheral Card Supplies Industrial Power Supply High Density DC/DC Conversion The SC2604 is available in low profile MLPD-UT and MSOP-8 package with rated temperature range of -40oC to +85oC. Typical Application Circuit Rs Vin Q1 sensing resistor + C1 1 L1 D1 Vo 2 C4 Rcc C11 + C7 U1 C13 1 CS DRV 8 2 VIN GATE 3 5 SS/VREF FB 6 7 OCP/EN GND 4 C14 Q2 R3 R5 SC2604 Figure 1. 12V to 25V/1A Boost Converter with Over Current Protection December 31, 2010 www.semtech.com 1 SC2604 5 Pin Configuration, MSOP-8 4 3 2 Pin Configuration, MLPD-UT8 1 D CS 1 8 DRV VIN 2 7 OCP/EN GATE 3 6 FB GND 4 5 SS/VREF D CS C VIN GATE GND 1 2 8 DRV 7 OCP/EN 3 6 FB 4 5 SS/VRF C B B 2mm x 3mm x 0.6mm MLPD-UT8 Marking Information, MSOP-8 A Marking Information, MLPD-UT8 5 4 3 2 A 1 Bottom Mark Top Mark nnnn=Part Number Code (Example AS00)- Reference Part No. Code for MSOP yyww=Date Code (Example: 0752) xxxx = Semtech Lot No. (Example: E901) xxxx = Semtech Lot No. (Example: 01-1) nnn=Part Number (Example FSA) - Reference Part No. Code for small MLP yw =Datecode (Reference Package Marking Design Guide lines, Appendix A) xxx = Semtech Lot No. (Example: 901) Ordering Information Device Package SC2604MSTRT(1)(2) MSOP-8 SC2604ULTRT(1)(2) 2mm x 3mm x 0.6mm MLPD-UT8 SC2604EVB-1 Evaluation Board, MSOP-8 SC2604EVB-2 Evaluation Board, MLPD-8 © 2010 Semtech Corp. Notes: (1) Available in tape and reel only. A reel contains 2,500 devices. (2) Available in lead-free package only. Device is Pb Free, Halogen Free, and WEEE/RoHS compliant. www.semtech.com 2 SC2604 Absolute Maximum Ratings Thermal Information VIN Supply Voltage ……………………………… -0.3 to 20V CS Pin Voltage………………………………………-0.3 to 20V GATE Pin Voltage……………………………………-0.3 to 20V DRV Pin Voltage ……………………………………-0.3 to 25V Thermal Resistance, Junction to Ambient(1) MSOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 °C/W MLPD-UT8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 °C/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . 15 0°C Storage Temperature Range . . . . . . . . . . . . . . .-45 to +150 °C Lead Temperature (Soldering) 10 sec . . . . . . . . . . . . . . . . . . 300 °C OCP/EN Pin Voltage …………………………………-0.3 to 7V Recommended Operating Conditions SS/VREF Pin Voltage …………………………………-0.3 to 7V FB Pin Voltage ………………………………………-0.3 to 7V Peak IR Reflow Temperature …………………………. 260°C Input Voltage Range …………………………… 4.5V to 16V ESD Protection Level(2) ………………………………… 2000V Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES(1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. (2) Tested according to JEDEC standard JESD22-A114-B. Electrical Characteristics Unless otherwise noted, VIN = 12V, VO = 25V, -40°C < TA = TJ < 125°C. Parameter Conditions Min Typ Max Units 16 V 4.5 V Input Supply VIN Supply Voltage 4.5 VIN Start Voltage VIN Rising 4.2 VIN Start Hysteresis 400 VIN Supply Current Switching, GATE pin floating VIN Shutdown Current 6.0 mV 9.0 mA 200 µA 1.250 1.275 V 0.5 1.0 µA OCP/EN = Low Error Amplifier Feedback Voltage IO = 100mA Feedback Bias Current Error Amplifier Gain 1.225 VIN = 12V, VFB = VSS/VREF V/V 90 (1) Oscillator Oscillator Frequency 320 400 480 kHz Maximum Duty Cycle 86 90 % Internal Ramp Peak (2) 1.4 V Internal Ramp Valley (2) 0.4 V Regulation Load Regulation Line Regulation © 2010 Semtech Corp. IO = 0.1A to 1A 0.5 VIN = 5V to 16V, IO = 0.1A 0.125 VIN = 5V to 16V, IO = 0.1A, TJ = 25°C 0.065 % %/V www.semtech.com 3 SC2604 Electrical Characteristics (Cont.) Unless otherwise noted, VIN = 12V, VO = 25V, -40°C < TA = TJ < 125°C. Parameter Conditions Min Typ Max Units Gate Source Current VIN = 12V, CGATE = 10nF 0.5 0.8 A Gate Sink Current VIN = 12V, CGATE = 10nF 0.5 0.8 A 55 µA PWM Switch Gate Drive PWM Switch Soft Start Soft Start Charge Current SS/VREF Threshold to Shutdown Switch SS/VREF Threshold to Turn-on Switch Pull down below this level to disable PWM Switch gate Pull above this level to enable PWM Switch gate 100 310 mV mV Disconnect Switch Gate Drive DRV Source Current DRV Sink Current Charge Pump Voltage VIN = 12V, VDRV = 15.5V 45 µA VIN = 12V, VDRV = 8V 45 µA VIN = 5V 2.15 VIN = 12V 4.3 VIN - CS 61 Pull down below this level to disable Disconnect FET gate 520 V 5.8 V 72 83 mV 590 660 mV Over Current Protection Current Limit Threshold OCP/EN Threshold OCP/EN Charge Current 37 µA OCP/EN Discharge Current 1.0 µA CS Input Current 0.2 µA Note: (1). Guaranteed by Characterization (2). Guaranteed by design © 2010 Semtech Corp. www.semtech.com 4 SC2604 Pin Descriptions Pin Pin Name 1 CS Current sense input (negative) 2 VIN Device supply voltage (also positive current sense input) 3 GATE PWM gate driver output for boost converter. This pin swings from 0V to VIN. 4 GND Device ground 5 SS/VREF 6 FB 7 OCP/EN 8 DRV Thermal Pad © 2010 Semtech Corp. Pin Function Soft start and reference voltage pin Error amplifier inverted input When a capacitor is tied to this pin, the maximum inrush current is controlled during start-up. The capacitor value also determines the off-time after the device has entered hiccup mode. Pulling this pin low can disable the linear and the switcher to turn off the circuit. Gate drive of input disconnect FET limiting system input current Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not connected internally. www.semtech.com 5 SC2604 Block Diagram OSCILLATOR FB VIN Error Amplifier Gm=3.6mA/V Gate PWM S Q 25K 1.25V SS/VREF VIN 55uA 0.4V 4.2V üüüüü VIN 6.25K CS VIN 0.625V HICCUP OSCILLATOR 1.25V 1uA CHARGE PUMP DRV LOW CURRENT SHUTDOWN 1.5V 0 – 120mV GND 38uA OCP/EN 1uA Figure 2. SC2604 Function Diagram © 2010 Semtech Corp. www.semtech.com 6 Typical Characteristics SC2604 Load Characteristic (VIN =12V, VO=25V) Efficiency (VIN=12V, VO=25V) 30 100 95 25 Output Voltage (V) 90 Efficiency (%) 85 80 75 70 20 15 10 5 65 0 60 0.00 0.50 1.00 0.00 1.50 0.50 1.00 1.50 2.00 2.50 Output Current (A) Output Current (A) SC2604 04 Error Amplifier: Gain and Phase Line Regulation (VO=25V, IO=1.5A) 25.250 40 35 25.125 30 135 25 25.000 Gain (dB) Output Voltage (V) 180 24.875 24.750 20 90 15 10 5 45 Gain Phase 0 24.625 Phase (deg) C2604 SC2604 0 -5 -10 24.500 8 10 12 14 16 1.E+02 Input Voltage (V) -45 1.E+04 1.E+06 1.E+08 Frequency (Hz) Simulation © 2010 Semtech Corp. www.semtech.com 7 Typical Characteristics (Cont.) SC2604 Current Limit Threshold vs Temperature 85 1.260 80 Feedback Voltage (V) Current Limit Threshold (mV) C2604 SC2604 75 70 65 60 Feedback Voltage vs Temperature V IN = 12V 1.250 V IN = 5V 1.240 1.230 1.220 -50 -25 0 25 50 75 100 125 -50 -25 o 0 25 50 75 100 125 o Temperature ( C) Temperature ( C) SC2604 C2604 Oscillator Frequency vs Temperature 6.0 TA = 125oC 5.5 410 5.0 400 Voltage (V) Oscillator Frequency (kHz) 420 Floating Driving Voltage (VDRV-VIN ) of DRV Pin vs VIN 390 380 4.5 TA = 25oC 4.0 3.5 TA = -40oC 3.0 2.5 370 2.0 360 1.5 -50 -25 0 25 50 75 o Temperature ( C) © 2010 Semtech Corp. 100 125 4 5 6 7 8 9 10 11 12 13 14 15 16 Input Voltage (V) www.semtech.com 8 SC2604 Applications Information PWM Control Loop The SC2604 is a voltage-mode PWM controller with a fixed switching frequency of 400kHz for use in high efficiency, boosted voltage, DC/DC power supplies. As shown in Figure 2, the PWM control loop of the SC2604 consists of a 400kHz oscillator, a PWM comparator, a voltage error amplifier, and a FET driver. The boost converter output voltage is fed back to FB (error amplifier negative) and is regulated to the reference voltage at SS/VREF pin. The error amplifier output is compared with the 400kHz ramp to generate a PWM wave, which is amplified and used to drive the boost FET (Q2 in Figure 1) for the converter. The PWM controller works with soft start and fault monitoring circuitry to meet application requirements. UVLO, Start-up, and Shutdown allow a complete shutdown of the output. Pulling the SS/ VREF pin below 0.1V only shuts the boost FET (Q2 in Figure 1) off and the output voltage will be (VIN-Vd). 4.2V Enable Hiccup VIN 1.25V+ 0.625V VIN+VGS OCP/EN 1.25V DRV 0.5V SS/VREF GATE VIN -Vd VO T2 T1 Note: T1=COCP/EN*0.625V / 37µA To initiate the SC2604, a supply voltage is applied to VIN. The DRV and GATE are held low. When VIN voltage exceeds UVLO (Under Voltage Lockout) threshold, typically 4.2V, an internal current source (37µA) begins to charge the OCP/EN pin capacitor. The OCP/EN voltage ramps from near ground to over 1.25V but the voltage between 0.625V and 1.25V provides the linear soft-start range for the disconnect FET (Q1). When the OCP/EN voltage is over 1.25V, the OCP hiccup is enabled, and SS/VREF pin is released. At this moment, another internal current source (55µA) begins to charge the SS/VREF pin capacitor. When the SS/VREF pin voltage reaches 0.5V, the error amplifier output will rise to 0.4V, then the PWM comparator begins to switch. The switching regulator output is slowly ramping up for a soft turn-on. The details of SC2604 startup timing is shown in Figure 3. If the supply voltage at VIN pin falls below UVLO threshold (3.8V typically) during a normal operation, the DRV pin is pulled low to cut off the supply power of the boost converter, while the OCP/EN pin capacitor is discharged with a 1µA internal current source. When the OCP/EN pin falls below 1.25V, the SS/VREF pin is forced to ground. This completely shuts down the boost conveter. Directly pulling the OCP/EN pin below 0.52V can also © 2010 Semtech Corp. T2=CSS/VREFüüüüü µA Figure 3. Start-up Timing Diagram Hiccup Mode Short Circuit Protection Hiccup mode over-current protection is utilized in the SC2604. When an increasing load causes a voltage of 72mv to occur from VIN to CS then a current limit hiccup sequence is started. The sequence starts by pulling DRV low and discharging the OCP/EN pin with a 1µA current source. When the OCP/EN pin falls below 1.25V, the SS/ VREF pin is forced to ground (similar to the UVLO shutdown described in the last setion). When the voltage on the OCP/EN pin falls to near zero volt, the 1µA discharge current becomes a 37µA charging current and the OCP/EN pin starts to charge and DRV is enabled. When the OCP/EN voltage rises from 0.625V to 1.25V, the current in the disconnect FET is allowed to increase from zero to a maximum of 72mV/(Current Sense Resistor Value). If the over-current condition still exists when OCP/EN crosses 1.25V then the hiccup sequence will re-start. If there is no over-current as OCP/EN crosses 1.25V then the SS/VREF pin is released to rise and allow a www.semtech.com 9 SC2604 Applications Information (Cont.) soft-start of the switching boost regulator. Capacitor at OCP/EN Pin - COCP/EN The DRV pin of the SC2604 is meant to drive an N-Channel FET that the input supply in the event of an VOcan 1 U T disconnect = over-current VIN condition. 1 − DMA X The OCP/EN capacitor becomes part of a hiccup oscillator that is charged with 37µA and discharged with 1µA to provide a low duty cycle for the FET Q1. As the current at start-up may hit its current limit threshold, VO Urate 1 current must be slow enough to allow the ramp of the T = the output VIN capacitor 1 − DMA Xto be fully charged to a voltage one diode drop Vd less than input voltage VIN. To guarantee a successful start-up at no load, the value of the capacitor at the OCP/EN pin has to satisfy the following formula: It should be understood fast ramp rates C ( V that RC S − Vd )sufficiently C O C P/ E N > O U T IN on the OCP/EN pin 0and pin can trigger a .625the SS/VREF 750 hiccup event because of the charging current demanded by the boost regulator output capacitor. 72mV Voltage SettingRthe =Output CS IPEAK In Figure 1, an external resistive divider R3 and R5 with its center tap tied to the FB pin sets the output voltage. V R3 = R 5 OUT − 1 1 . 25 V In some applications, a RC branch (R6, C12 in the Typical Schematic on page 12) will be needed for loop stability. Maximum Duty Cycle The maximum duty cycle, Dmax defines the upper limit of VO U T 1ratio power conversion = VIN 1 − DMA X VO U T 1 = VIN 1 − DMA X Calculating Current Sense Resistor C ( V − Vd ) R C S C O C P/ E N > O U T IN 0.625 750 Current sense resistor is placed at the input to sense C ( V V ) R − O U T IN d C inductor current of the boostSregulator. The value of C Opeak C P/ E N > 0.625 by750 the resistor can be calculated 72mV IPEAK 72mV R CSis=the allowed boost inductor peak current. where IPEAK IPEAK R CS = In many applications, V a noise filter circuit (R1=200, C10=10nF R3 = R 5 OUT − 1 in the Typical Schematic 1.25 V on page 12) may be needed for the input current sensing. V R3 = R 5 OUT − 1 1.25 V © 2010 Semtech Corp. C O C P/ E N > C O U T( VIN − Vd ) R C S 0.625 750 Disconnect FET Selection 72mV IPEAK voltage of DRV pin drops slightly as The floating driving R CS = the supply voltage VIN is below 7.5V (Typical Characteristics on page 8), where a FET with low gate threshold voltage (VGS(TH)) has to be used for the disconnect FET. In a 5V input VOUT R3 = Ra5FET −GS(TH) 1 =2V, such as FDD6672A from with V application, 1.25 V Fairchild, is needed. Layout Guidelines Careful attentions to layout requirements are necessary for successful implementation of the SC2604 PWM controller. High currents switching at 400kHz are present in the application and their effect on ground plane voltage differentials must be understood and minimized. 1) The high power parts of the circuit should be laid out first. A ground plane should be used, the number and position of ground plane interruptions should be such as to not unnecessarily compromise ground plane integrity. Isolated or semi-isolated areas of the ground plane may be deliberately introduced to constrain ground currents to particular areas, for example the input capacitor and bottom Schottky ground. 2) The loop formed by the output Capacitor(s) (COUT ), the FET (Q1), the current sensing resistor, and the Schottky (D1) must be kept as small as possible, as shown on the layout diagram in Figure 4. This loop contains all the high current, fast transition switching. Connections should be as wide and as short as possible to minimize loop inductance. Minimizing this loop area will reduce EMI, www.semtech.com 10 yout SC2604 Applications Information (Cont.) lower ground injection currents, resulting in electrically “cleaner” grounds for the rest of the system and minimize source ringing, resulting in more reliable gate switching signals. 5) The SC2604 is best placed over an isolated ground plane area. The soft-start capacitor and the Vin decoupling capacitor should also connected to this ground pad area. This isolated ground area should be connected to the main ground by a trace that runs from the GND pin to the ground side of the output capacitor. If this is not possible, the GND pin may be connected to the ground path between the Output Capacitor and the CIN, Q1, D1 loop. Under no circumstances should GND be returned to a ground inside the CIN, Q1, D1 loop. 3) The connection between the junction of Q1, D1 and the output capacitor should be a wide trace or copper region. It should be as short as practical. Since this connection has fast voltage transitions, keeping this connection short will minimize EMI. 4) The Output Capacitor(s) (COUT ) should be located as close to the load as possible, fast transient load currents are supplied by COUT only, and connections between COUT and the load must be short, wide copper areas to minimize diagram inductance and resistance. 6) Input voltage of the SC2604 should be supplied from the power rail through a 1Ω resistor, the Vin pin should be decoupled directly to GND by a 0.1µF~1µF ceramic capacitor, trace lengths should be as short as possible. Vout VIN Ra D1 4.7uH Rcs Cin 1 + SC2604 2 5 1uF 0.1uF 1 3 VIN SS/VREF CS DRV FB GATE OCP/EN GND 6 Rb Cout 8 7 4 0.1uF Note: Heavy lines indicate the critical loop carrying high pulsating current. The inductance of the loop needs to be minimized. Figure 4. SC2604 Layout Diagram © 2010 Semtech Corp. www.semtech.com 11 SC2604 Applications Information (Cont.) Typical application schematic with 12V input and 25V/1.5A output Rs 10m, Sen. Res. 12V INPUT + C1 220uF C3 1uF Rcc 1R0 Q1 IRF7821 C11 1uF Da MA729 1 D1 2 C4 15uH 1uF R1 200 C10 10nF L1(CD1-150) A 25V/1.5A OUTPUT C C6 4.7uF CMSH2-40L Q2 AO4412 + C7 220uF U1 1 CS DRV 8 2 VIN OCP/EN 7 3 GATE FB 6 SS/VREF 5 4 GND SC2604 R3 499k C12 C13 0.33uF C14 0.1uF 0.33uF R6 1.43k R5 26.3k Note: A small Schottky diode (Da) may be required in some applications to clamp negative spike at the GATE pin. Bill of materials 5 Item Quantity Reference 1 1 C1 2 3 C3,C4,C11 3 1 C6 4 1 C7 5 1 C10 6 1 C12 7 1 C13 8 1 C14 9 1 D1 10 1 Da 11 1 L1 12 1 Q1 13 1 Q2 14 1 Rs 15 1 R1 16 1 Rcc 17 1 R3 18 1 R5 19 1 R6 20 1 U1 © 2010 Semtech Corp. Part (P/N of Vender) 220uF/10V 1uF/16V 4.7uF/50V 220uF/35V/160m 10nF 0.33uF 0.33uF 0.1uF CMSH2-40L (Schottky diode) MA729 (Schottky diode) 15uH/3.5A (CD1-150) 4 IRF7821 AO4412 15m(Sensing Res.) 200 1R0 499k 26.1k 1.43k SC2604 Vendor Rubycon, ZL Vishay Murata Rubycon, YXF Vishay Vishay Vishay Vishay Central Semi Panasonic Coiltronics 3 IR Alpha & Omega Semi. Vishay Vishay Vishay Vishay Vishay Vishay Semtech Title Size A Date: SEMTECH CORPORATIO SC2604 (MSOP-8) EVB Sc Document Number 12V Input, 25V/1.5A Output, 4 Tuesday, October 23, 2007 2 www.semtech.com 12 Sheet SC2604 12V Input (5V/DIV) Applications Information (Cont.) Start up 12V Input (5V/DIV) 25V output (10V/DIV) SS/VREF (1V/DIV) OCP/EN (1V/DIV) X=5ms/DIV Inductor current and DRV pin voltage at OCP 25V Output (1V/DIV) OCP/EN (1V/DIV) Inductor Current (5A/DIV) DRV Voltage (5V/DIV) © 2010 Semtech Corp. X=10ms/DIV www.semtech.com 13 SC2604 MSOP-8 Outline Outline Drawing - MSOP-8 ü DIM A A A1 A2 b c D E1 E e L L1 N 01 aaa bbb ccc D N 2X E/2 E1 PIN 1 INDICATOR ü C E 1 2 2X N/2 TIPS e B ü D C A .043 .006 .037 .015 .009 .118 .122 .118 .122 .193 BSC .026 BSC .016 .024 .032 (.037) 8 8° 0° .004 .005 .010 1.10 0.00 0.15 0.75 0.95 0.22 0.38 0.08 0.23 2.90 3.00 3.10 2.90 3.00 3.10 4.90 BSC 0.65 BSC 0.40 0.60 0.80 (.95) 8 0° 8° 0.10 0.13 0.25 ü ü c GAGE PLANE A1 C .000 .030 .009 .003 .114 .114 H A2 SEATING PLANE DIMENSIONS INCHES üüüüü MIN NOM MAX MIN NOM MAX 0.25 C A-B D L (L1) DETAIL SEE DETAIL SIDE VIEW 01 A A MSOP-8 Landing Pattern NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE ü 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-187, VARIATION AA. Land Pattern - MSOP-8 X DIM ü G Y Z C G P X Y Z DIMENSIONS INCHES üüüüü (.161) .098 .026 .016 .063 .224 (4.10) 2.50 0.65 0.40 1.60 5.70 P NOTES: 1. © 2010 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. www.semtech.com 14 SC2604 Outline Drawing - 2x3 MLPD-UT8 A B D DIM E PIN 1 INDICATOR (LASER MARK) A ü C A2 A1 SEATING PLANE A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS üüüüü INCHES MIN NOM MAX MIN NOM MAX - .024 .002 (.006) .007 .010 .012 .075 .079 .083 .059 .065 .069 .114 .118 .122 .065 .071 .075 .020 BSC .012 .016 .020 8 .003 .003 .020 .000 0.50 0.60 0.00 0.05 (0.1524) 0.18 0.25 0.30 1.90 2.00 2.10 1.50 1.65 1.75 2.90 3.00 3.10 1.65 1.80 1.90 0.50 BSC 0.30 0.40 0.50 8 0.08 0.08 C D1 1 2 ü ü E1 N ü e ü C A B ü ü NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - 2x3 MLPD-UT8 K DIM ü G H Y X Z C G H K P X Y Z DIMENSIONS INCHES üüüüü (.116) .087 .071 .069 .020 .012 .030 .146 (2.95) 2.20 1.80 1.75 0.50 0.30 0.75 3.70 P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. © 2010 Semtech Corp. www.semtech.com 15 SC2604 © Semtech 2010 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected operation resulting from misuse, neglect improper installation, repair or improper handling or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified range. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. Contact Information Semtech Corporation Power Mangement Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com © 2010 Semtech Corp. www.semtech.com 16