uClamp0801T Low Profile μClamp® 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp® Description Features The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClamp0801T is in a 2-pin, SLP1006P2T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 8 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 610004-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. ® Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.4mm) Protects one data line Low clamping voltage Working voltage: 8V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P2T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.0 2 0.60 0.65 1 0.40 Nominal Dimensions (mm) Revision 03/30/2011 SLP1006P2T (Bottom View) 1 www.semtech.com uClamp0801T PROTECTION PRODUCTS Absolute Maximum Rating R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Value Units VESD +/- 20 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 8 V 12.5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 8V, T=25°C 0.25 μA Clamp ing Voltage VC IPP = 1.5A, tp = 8/20μs 17 V Forward Voltage VF IF = 10mA 1.2 V Junction Cap acitance Cj VR = 0V, f = 1MHz 10 pF Junction Cap acitance Cj VR = 3.3V, f = 1MHz © 2011 Semtech Corp. 2 9.5 1 4.5 pF www.semtech.com uClamp0801T PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss (S21) CH1 S21 LOG Normalized Junction Capacitance vs. Reverse Voltage 6 dB / REF 0 dB 1.2 1: -2.3043 dB 800 MHz 1.1 1 1: -2.6270 dB 900 MHz 0 dB 12 0.9 CJ(VR) / CJ(VR=0) 2: -9.3111 dB 1.8 GHz -6 dB 3 -12 dB 3: -21.903 dB 2.7 GHz -18 dB -24 dB 0.8 0.7 0.6 0.5 0.4 0.3 0.2 -30 dB 0.1 -36 dB f = 1 MHz 0 0 1 MHz 10 MHz 100 MHz 1 2 3 4 5 Reverse Voltage - VR (V) 6 7 8 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz Clamping Voltage vs. Peak Pulse Current 20 Clamping Voltage - VC (V) 18 16 14 12 10 8 6 Waveform Parameters: tr = 8μs td = 20μs 4 2 0 0 0.5 1 1.5 2 Peak Pulse Current - IPP (A) ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) Note: ESD data is taken with a 10x attenuator © 2011 Semtech Corp. 3 www.semtech.com uClamp0801T PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This device is designed to protect one data or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2011 Semtech Corp. 4 www.semtech.com uClamp0801T PROTECTION PRODUCTS Applications Information - Spice Model uClamp0801T Spice Model uClamp0801T Spice Parameters © 2011 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 3.87E-13 BV Volt 10.9 VJ Volt 0.79 RS Ohm 2.71 IB V Amp 1.0E-3 CJO Farad 5.71E-12 TT sec 2.541E-9 M -- 0.27 N -- 1.1 EG eV 1.11 5 www.semtech.com uClamp0801T PROTECTION PRODUCTS Outline Drawing - SLP1006P2T A B D DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX E TOP VIEW A SEATING PLANE aaa C C A1 A A1 b D E e L R N aaa bbb .015 .016 .017 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.37 0.40 0.43 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2T Y (C) DIM C G X Y Z Z G X DIMENSIONS INCHES MILLIMETERS (.033) (0.85) .012 0.30 .024 0.60 .022 0.55 .055 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2011 Semtech Corp. 6 www.semtech.com uClamp0801T PROTECTION PRODUCTS Marking Code Ordering Information 8T Part Number Working Voltage Qty per Reel Reel Size uClamp 0801T.TCT 8V 3,000 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation PIN 1 ID Tape and Reel Specification Cathode Bar User Direction of feed Device Orientation in Tape A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2011 Semtech Corp. 7 www.semtech.com