uClamp3311P Low Voltage μClampTM for ESD and CDE Protection PROTECTION PRODUCTS - MicroClampTM Description Features The μClamp series of Transient Voltage Suppressors (TVS) are designed to replace multilayer varistors (MLVs) in portable applications where low operating voltage is vital. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD), lightning, electrical fast transients (EFT), and cable discharge events (CDE). The μClampTM3311P is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over siliconavalanche diode processes. They feature a true operating voltage of 3.3 volts for superior protection when compared to traditional pn junction devices. The μClampTM3311P is in an 2-pin, RoHS/WEEE compliant, SLP1006P2 package. It measures 1.0 x 0.6 x 0.5mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 3.3 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 610004-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.5mm) Protects one data line Low clamping voltage Working voltage: 3.3V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P2 package RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.5 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.0 0.60 0.65 0.50 Maximum Dimensions (mm) Revision 08/22/2007 SLP1006P2 (Bottom View) 1 www.semtech.com uClamp3311P PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 90 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 5 Amps ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) V PP +/- 25 +/- 20 kV Op erating Temp erature TJ -40 to +85 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics (T=25oC) Parameter Reverse Stand-Of f Voltage Symbol Conditions Minimum Typical VRWM Maximum Units 3.3 V Punch-Through Voltage VPT IPT = 2μA 3.5 V Snap-Back Voltage VSB ISB = 50mA 2.8 V Reverse Leakage Current IR VRWM = 3.3V Clamping Voltage VC Clamping Voltage Junction Capacitance © 2007 Semtech Corp. 0.5 μA IPP = 1A, tp = 8/20μs 8 V VC IPP = 5A, tp = 8/20μs 18 V I/O pin to Gnd VR = 0V, f = 1MHz 12 15 pF Cj I/O pin to Gnd VR = 3.3V, f = 1MHz 10 2 0.05 pF www.semtech.com uClamp3311P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or I PP Peak Pulse Power - PPP (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0 0 0.01 0.1 1 10 100 25 1000 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (us) Clamping Voltage vs. Peak Pulse Current Junction Capacitance vs. Reverse Voltage 1.4 20 1.2 16 CJ(VR) / CJ(VR=0) Clamping Voltage - VC (V) 18 14 12 10 8 6 Waveform Parameters: tr = 8μs td = 20μs 4 2 1 0.8 0.6 0.4 0.2 0 f = 1 MHz 0 0 1 2 3 4 5 6 0 0.5 1 1.5 2 2.5 3 3.5 Reverse Voltage - VR (V) Peak Pulse Current - IPP (A) Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: -3.0120 dB 616.229 MHz 2: -3.8355 dB 900 MHz 0 dB 1 -6 dB 2 3 4 -12 dB 3: -5.9804 dB 1.8 GHz 4: -8.1629 dB 2.5 GHz -18 dB -24 dB -30 dB -36 dB 1 MHz START. 030 MHz © 2007 Semtech Corp. 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz 3 www.semtech.com uClamp3311P PROTECTION PRODUCTS Applications Information Device Schematic & Pin Configuration Device Connection Options The μClamp3311P is designed to protect one data line operating up to 3.3 volts. It will present a high impedance to the protected line up to 3.3 volts. It will “turn on” when the line voltage exceeds 3.5 volts. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. These devices are not recommended for use on dc power supply lines due to their snap-back voltage characteristic. EPD TVS Characteristics These devices are constructed using Semtech’s proprietary EPD technology. The structure of the EPD TVS is vastly different from the traditional pn-junction devices. At voltages below 5V, high leakage current and junction capacitance render conventional avalanche technology impractical for most applications. However, by utilizing the EPD technology, these devices can effectively operate at 3.3V while maintaining excellent electrical characteristics. EPD TVS IV Characteristic Curve IPP The EPD TVS employs a complex nppn structure in contrast to the pn structure normally found in traditional silicon-avalanche TVS diodes. The EPD mechanism is achieved by engineering the center region of the device such that the reverse biased junction does not avalanche, but will “punch-through” to a conducting state. This structure results in a device with superior DC electrical parameters at low voltages while maintaining the capability to absorb high transient currents. ISB IPT VF IR VRWM VSB VPT VC IF Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2007 Semtech Corp. 4 www.semtech.com uClamp3311P PROTECTION PRODUCTS Applications Information - Spice Model Figure 1 - uClamp3311P Spice Model Table 1 - uClamp3311P Spice Parameters © 2007 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 1E-20 1E-20 BV Volt 3.8 3.8 VJ Volt 0.7 0.7 RS Ohm 1.1 1.1 IB V Amp 1E-3 1E-3 CJO Farad 20E-12 20E-12 TT sec 2.541E-9 2.541E-9 M -- 0.214 0.214 N -- 1.1 1.1 EG eV 1.11 1.11 5 www.semtech.com uClamp3311P PROTECTION PRODUCTS Outline Drawing - SLP1006P2 A B D DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX E TOP VIEW A SEATING PLANE aaa C C A1 A A1 b D E e L R N aaa bbb .016 .020 .022 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 0.40 0.50 0.55 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 PIN 1 ID R bxN bbb C A B 2x L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2 DIMENSIONS Y (C) DIM C G X Y Z Z G X INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2007 Semtech Corp. 6 www.semtech.com uClamp3311P PROTECTION PRODUCTS Marking Code Ordering Information X Part Number Working Voltage Qty per Reel Reel Size uClamp3311P.TCT 3 .3 V 3 ,0 0 0 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation PIN 1 ID Tape and Reel Specification A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2007 Semtech Corp. 7 www.semtech.com