Thyristor Surge Suppressor Series: FEATURES : ◎ UL94V-0 Flammability Classification ◎ Peak Off-State Voltage from 6 to 390 volts ◎ ESD Protection>40 kilovolts ◎ Low Capacitance for T1/E1 Trunk and Line Card Application ◎ High Surge Current Capability ■ Applications ● ◎ Meet IEC 61000-4-4 & -5 Industry Requirement ◎ Provides Protection in Accordance FCC Part 68, UL1459,Bellcore 1089, ITU-TK 20 & K. 21 ■ Mechanical Data DO-214AA (SMB J-Bend) High voltage lamp ignitors ● Natural gas ignitors 0.155 (3.94) 0.130 (3.30) 0.086 (2.20) 0.077 (1.95) ● Gas oil ignitors ● High voltage power supplies 1.0 (25.4) MIN. 0.140 (3.6) 0.104 (2.6) DIA. 0.180 (4.57) 0.160 (4.06) 0.300 (7.6) 0.230 (5.8) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) ● Xenon ignitors ● Over voltage protector DO-204AC (DO-15) 0.008 (0.203) MAX. 0.060 (1.52) 0.030 (0.76) 0.220 (5.59) 0.205 (5.21) Dimensions in inches and(millimeters) ● Pulse generators Dimensions in inches and(millimeters) TO - 92 ● Fluores cent lighting ignitors ● HID surge current capability 0.173 (4.4) 0.197 (5.0) 0.063 (1.6) MAX. 0.500 (12..7) MIN. PIN 1 ■ V-I Characteristics Leakage current at stand-off voltage Breakdown voltage Breakdown current Breakover voltage Breakover current Holding current On state voltage Peak pulse current Off state capacitance 0.150 (3.81) MIN. 0.012 (0.30) 0.018 (0.45) 0.095 (2.41) 0.105 (2.67) PIN 3 0.088 (2.23) 0.098 (2.50) 0.135 (3.43) 0.145 (3.68) 0.046 (1.16) 0.054 (1.37) 0.012 (0.30) 0.035 (0.90) 0.088 (2.23) 0.096 (2.44) 0.176 (4.47) 0.186 (4.73) Dimensions in inches and(millimeters) I SYMBOL PARAMETER VDRM Stand-off Voltage IDRM VBR IBR VBO IBO IH VT IPP CO 1.0 (25.4) MIN. 0.034 (0.86) 0.028 (0.71) DIA. IPP IBR IBO IH IDRM VT VBR VDRM VBO V Part Nuber System : P 3100 (1) (2) S (3) B (4) (1) Type (2) Series: 0080, 0300, 0640, 0720, 0800, 1800, 2300, 2600, 3100, 3500,4200 etc. (3) Package: E: TO-92; S: SMB/DO214AA; R: SMA/DO214AC; L: DO-15; M: DO-27 (4) Rating surge current (10/1000μS): A: 50A ; IDRM μA B: 80A; C: 100A VS V IS mA Max VT V Max IT A IH mA Min CO pF Max IPP A Max 1 50 100 100 4 1 50 100 100 800 4 1 150 50 100 88 800 4 1 150 50 100 5 98 800 4 1 150 50 100 5 130 800 4 1 150 40 100 120 140 5 160 800 4 1 150 40 100 5 180 800 4 1 150 40 100 5 220 800 4 1 150 30 100 P2300 170 190 5 260 800 4 1 150 30 100 P2600 220 5 300 800 4 1 150 30 100 P3100 275 5 350 800 4 1 150 30 100 P3500 320 5 400 800 4 1 150 30 100 P4200 390 5 500 800 4 1 150 30 100 Part Number VDRM V P0080 6 5 25 800 4 P0300 25 5 40 800 P0640 58 65 5 77 5 75 90 P0720 P0900 P1100 P1300 P1500 P1800 Max Notes: ● Vs is measured at 100KV/S ● Off-state capacitance is measured in 1MHz@DC2V ● All measurements are made at an ambient temperature of 25℃ Reliability Items Item Criterion Condition Method In the oven of regulated temperature, apply specific bias Voltage on the two electrodes of GDT for a specific period of time High temperature with voltage test MIL-STD-750B METHOD-1026 TA=150℃ BiasV=80%VDRM T=96 Hours Soldering Thermal test MIL-STD-750B METHOD-2031 TA=260+5℃/-0℃ T=10Sec Put into the Sn stove Solder ability test MIL-STD-202E EMTHOD-208 TA=230℃ T=5Sec Put into the Sn stove Result primary, last tests should meet the requirements of regulations primary, last tests should meet the requirements of regulations primary, last tests should meet the requirements of regulations RATINGS AND CHARACTERISTIC CURVES (TA=25℃ unless otherwise noted) 100 Peak Value I IDRM - Peak Off-State Current - μA Test Waveform Example tf 10 μs td = 1000 μs tf IPP - Peak Pulse Current - %IPP Fig.2 Typical Peak Off-State Current Vs Junction 10 T t Fig.1 Pulse Wave Form Example 125 75 Half Value: IPP / 2 = td 50 25 1 0.1 e-t 0.01 0 0 500 1000 1500 2000 2500 3000 -40 0 t - Time-μs Fig.3 Typical On-State Current Vs On-State Voltage 100 40 80 tJ - Temperature - °C 120 Fig.4 Typical Holding Current Vs Junction Temperature 2.50 BPXXXXXC 2.00 BPXXXXXA IH / IH (tJ 25°C) IT - On - State Current - A BPXXXXXB 10 1.50 1.00 0.05 1 0 1 2 3 4 5 6 VT - On - State Voltage - V 0 40 80 120 tJ - Temperature - °C Fig.5 Typical normalized VS Vs Junction Temperature Fig.6 On-State Current Vs Surge Current 100 Non-Repetitive On-State Current (ITSM) - 1.15 1.10 1.05 Normalized VS 0.00 -40 7 1.00 0.9 0.90 BPXXXXXC BPXXXXXB 10 BPXXXXXA Supply Frequency : 60Hz Sinusoidal Load: Resistive Rms On-State Current(IT(RMS)) : Maximum Rated Value at Specified Case Temperature 0.85 1 0.80 -40 0 40 80 1 120 10 tJ - Temperature - 100 1000 Surge Current Duration - Full WAVEFORM STANDARD IPP (A) 2/10 us GR-1089-CORE 250 8/20 us IEC 61000-4-5 250 10/160 us FCC Part 68 150 10/560 us FCC Part 68 100 10/700 us ITU-T K20/K21 90 10/1000 us GR-1089-CORE 80 IPP, PEAK PULSE CURRENT (%) MAXIMUM RATED SURGE WAVEFORM 100 Peak value (Ipp) tr= rise time to peak value tp= Decay time to half value Half value 50 0 tr tp TIME Solder Reflow Recommendations T(℃) 250 200 Maximum package Body Temperature (240℃) z Recommended reflow methods: IR, vapor Melting Temperature of Solder (183℃) phase oven, hot air oven, wave solder. 150 z The device can be exposed to a maximum temperature of 265°C for 10 seconds. 100 50 z Devices can be cleaned using standard Preheat 40 80 Reflow Stable Heat 120 160 200 240 280 Cool 320 360 industry methods and solvents. t (sec) Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Product Dimensions Ref.（mm） A1 A2 b c E E1 D L Min. 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 E1 D E A1 c L A2 b