1SS133M Taiwan Semiconductor Small Signal Product 300mW, Hermetically Sealed Glass Switching Diodes FEATURES - Fast switching device (trr < 4.0 ns) - Through-hole mount device type - DO-34 package (JEDEC DO-204) - Hermetically sealed glass - Compression bonded construction - All external surfaces are corrosion resistant and leads are readily solderable - RoHS compliant DO-34 - Solder hot dip Tin (Sn) lead finish - Cathode indicated by polarity band MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Power Dissipation PD 300 mW Working Inverse Voltage W IV 90 V Average Rectified Current IO 150 mA Non-Repetitive Peak Forward Current IFM 450 mA Peak Forward Surge Current Operating Junction Temperature Storage Temperature Range PARAMETER IFSURGE 2 TJ + 175 o C TSTG -65 to +200 o C A SYMBOL MIN MAX UNIT 80 -- V Breakdown Voltage IR=500nA BV Forward Voltage IF=100mA VF 1.2 V 500 nA Reverse Leakage Current Junction Capacitance Reverse Recovery Time VR=80V IR VR=0, f=1.0MHz Cj -- 4.0 pF (Note 1) trr -- 4.0 ns Notes: 1. Reverse Recovery Test Conditions: IF=IR=10mA, RL=100Ω, IRR=1mA Document Number: DS_S1403003 Version: B14 1SS133M Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Forward Characteristics Fig. 2 Reverse Characteristics 100 10000 Reverse Current : IR (nA) Forward Current : IF (mA) TA=100oC 10 TA=125oC TA=75oC TA=25oC TA=-25oC 1 1000 TA=75oC TA=50oC 100 TA=25oC 10 1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 1.6 20 40 Forward Voltage : VF (V) 80 100 120 Fig. 4 Reverse Recovery Time Characteristics Fig. 3 Capacitance Between Terminals Characteristics 5 3.0 f = 1 MHz 2.5 4 Reverse Recovery Time : tr (ns) Capacitance Between Terminals : CT (pF) 60 Reverse Voltage : VR (V) 2.0 1.5 1.0 0.5 3 2 1 0 0.0 0 5 10 15 20 25 30 0 4 8 12 16 20 Forward Current : IF (mA) Reverse Voltage : VR (V) Fig. 5 Surge Current Characteristics Surge Current : ISURGE (A) 100 10 1 0.1 1 10 100 1000 10000 Pulse Width : Tw (ms) Document Number: DS_S1403003 Version: B14 1SS133M Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. MANUFACTURE PACKING CODE CODE 1SS133M 1SS133M (Note) 1SS133M GREEN PACKING COMPOUND PACKAGE R0 CODE G DO-34 10K / 14" Reel A0 G DO-34 5K / Box (Ammo) A2 G DO-34 5K / Box (Ammo) Note: Manufacture special control, if empty means no special control requirement. EXAMPLE PREFERRED P/N PART NO. 1SS133M R0G 1SS133M 1SS133M-L0 R0G 1SS133M MANUFACTURE Document Number: DS_S1403003 CODE L0 PACKING CODE GREEN COMPOUND DESCRIPTION R0 CODE G Green compound R0 G Green compound Version: B14 1SS133M Taiwan Semiconductor Small Signal Product DIMENSIONS DIM. Document Number: DS_S1403003 Unit (mm) Unit (inch) Min Max Min Max A 0.30 0.55 0.012 0.022 B 2.16 3.04 0.085 0.120 C 25.40 38.10 1.000 1.500 D 1.27 2.00 0.050 0.079 Version: B14