RB520G-30 Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Low power loss, high current capability, low VF - Surface mount device type - Moisture sensitivity level (MSL): 1 - Packing code with suffix "G" means green compound (halogen-free) SOD-723F MECHANICAL DATA - Case: Flat lead SOD-723F small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Polarity: Indicated by cathode band - Weight: 0.847 ± 0.5 mg - Marking Code: F MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER Reverse Voltage Mean Forward Current Non-Repetitive Peak Forward Surge Current (8.3ms) SYMBOL VALUE UNIT VR 30 V IF(AV) 0.1 A IFSM 0.5 TJ Junction Temperature TSTG Storage Temperature Range PARAMETER A 125 o C -40 to +125 o C SYMBOL MIN MAX UNIT Forward Voltage IF = 10 mA VF - 0.45 V Reverse Leakage VR = 10 V IR - 0.50 μA Document Number: DS_S1412014 Version: D14 RB520G-30 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Forward Characteristics Fig. 2 Reverse Characteristics 1000 1000000 150°C 100000 150°C 10 -25°C 1 25°C 0.1 75°C 0.01 125°C IR, Reverse Current (mA) Forward Current : IF (mA) 100 125°C 10000 75°C 1000 25°C 100 -25°C 10 0.001 1 0 100 200 300 400 500 Forward Voltage : VF (mV) 600 700 0 10 20 30 40 VR, Reverse Voltage (V) Fig. 3 Capacitance Between Terminals Characteristics CT, Capacitance Between Terminals (pF) 100 10 1 0 5 10 15 20 25 30 VR, Reverse Voltage (V) Document Number: DS_S1412014 Version: D14 RB520G-30 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 1) CODE SUFFIX -xx RL G PART NO. RB520G-30 PACKAGE PACKING SOD-723F 5,000 / 7" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PART NO. PACKING CODE PREFERRED P/N PART NO. RB520G-30 RL RB520G-30 RL RB520G-30 RLG RB520G-30 RL G Multiple manufacture source Green compound RB520G-30-B0 RLG RB520G-30 RL G Define manufacture source Green compound Document Number: DS_S1412014 SUFFIX -B0 PACKING CODE SUFFIX DESCRIPTION Multiple manufacture source Version: D14 RB520G-30 Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 0.500 0.700 0.020 0.028 B 1.300 1.500 0.051 0.059 C 0.230 0.350 0.009 0.014 D 0.900 1.100 0.035 0.043 E 0.470 0.625 0.019 0.025 F 0.050 0.150 0.002 0.006 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. A 0.50 0.020 B 0.80 0.031 C 1.10 0.043 DIM. Document Number: DS_S1412014 Version: D14 RB520G-30 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412014 Version: D14