RT8863 - Richtek

®
RT8863
Dual-Output, Phase Interleaved Synchronous Step-Down
Controller with Tracking Control
General Description
Features
The RT8863 is a high performance switching controller
that drives all N-MOSFETs for dual-output synchronous
step-down converters. Constant frequency current-mode
architecture allows a phase-lockable frequency up to
640kHz. The TRCKx pins provide soft-start tracking
function. Multiple RT8863s can be daisy chained in
applications requiring more than two voltages to be
tracked.

The precision 0.8V reference and power good output
indicator are compatible with a 7V to 28V input supply
range, encompassing all battery chemistries.









The RUN pins control their respective channels
independently. The PLLIN pin selects among skip cycle
mode and continuous current mode. Current foldback limits
MOSFET dissipation during short-circuit conditions.




Dual, 180 Degree Phased Controllers Reduce
Required Input Capacitance and Power Supply
Induced Noise
Start-Up Tracking for Both Outputs
Constant Frequency Current-Mode Control
±1% Output Voltage Accuracy
Foldback Output Current Limiting
Wide Input Voltage Range : 7V to 28V Operation
Power Good Indicator
Adjustable Soft-Start Current Ramping
No Reverse Current During Soft-Start Interval
Dual N-MOSFET Synchronous Drive
Phase Lockable Fixed Frequency 210kHz to 640kHz
Output Over-Voltage Protection
Small 32-Lead WQFN Package
RoHS Compliant and Halogen Free
Applications
Telecom Infrastructure
 Server Power Supply
 Industry Equipment

Simplified Application Circuit
VIN
C2
VIN
Q3
RT8863
Q1
RSENSE1
TG1
TG2
SW1
SW2
BG1
BG2
L1
VOUT1
L2
RSENSE2
VOUT2
Q4
C6
Q2
PLLIN
PGND
R1 R2
SENSE2-
SENSE1-
Enable
R3 R4
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8863-01 February 2015
TRCK2
RUN1
RUN2
R9
SENSE2+
SENSE1+
VOSENSE1
C9
VOSENSE2
TRCK1
ITH2
R8
C13
CSS
R10
GND
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RT8863
Ordering Information
Pin Configurations
(TOP VIEW)
RT8863
SENSE1SENSE1+
ITH1
TRCK1
CLKOUT
PGOOD
BOOT1
TG1
Package Type
QW : WQFN-32L 5x5 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
24
2
23
3
22
4
RT8863GQW : Product Number
YMDNN : Date Code
21
GND
5
20
19
6
7
33
18
17
8
9
Marking Information
RT8863
GQW
YMDNN
1
SW1
VIN
INTVCC
DRVCC
PGND
BG1
BG2
SW2
10 11 12 13 14 15 16
NC
SENSE2SENSE2+
ITH2
VOSENSE2
RUN2
BOOT2
TG2

32 31 30 29 28 27 26 25
VOSENSE1
PLLFLTR
RUN1
NC
PLLIN
SGND
TRCK2
NC
WQFN-32L 5x5
Functional Pin Description
Pin No.
Pin Name
1, 13
VOSENSE1
VOSENSE2
Pin Function
3, 14
RUN1
RUN2
Error Am plifier Feedback Voltage Input. It receives the remotely sensed
feedback voltage for each controller from an external resistive divider across the
output.
Filter Connection for Phase Locked Loop. Alternatively, this pin can be driven
with an AC or a DC voltage source to vary the frequency of the internal
oscillator.
Run Control Inputs. Forcing RUN pins below 1V would shut down the circuitry
required for that channel. Forcing the RUN pins over 2V would turn on the IC.
4, 8, 9
NC
No Internal Connection.
5
PLLIN
External Synchronization Input to Phase Detector. Feeding an external clock
signal will synchronize the chip to the external clock.
6
SGND
Signal Ground. It is common to both controllers. It must be routed separately
from high current grounds to the common () terminals of the output capacitors.
7, 29
TRCK2
TRCK1
Output Voltage Tracking Inputs. An internal 1.2A soft-start current always
charges these pins.
10, 32
SENSE2
SENSE1
Negative inputs of the Differential Current Comparators.
2
PLLFLTR
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RT8863
Pin No.
Pin Name
11, 31
SENSE2+
SENSE1+
12, 30
ITH2, ITH1
15, 26
BOOT2,
BOOT1
16, 25
TG2, TG1
17, 24
SW2, SW1
18, 19
BG2, BG1
Pin Function
Positive Input of the Differential Current Comparators. The ITHx pin voltage
and controlled offsets between the SENSE and SENSE+ pins in
conjunction with RSENSEx set the current trip threshold.
Error Amplifier Output and Switching Regulator Compensation Point. Each
associated channel’s current comparator trip point increases with this control
voltage.
Bootstrap Supplies for the High-Side Gate Drivers. Capacitors are connected
between the BOOTx, and SWx pins and Schottky diodes are tied between
the BOOT and INTVCC pins. Voltage swing at the BOOTx pins is from
INTVCC to (VIN + INTVCC) .
High Current Gate Drives for High-Side N-MOSFETs. These are the output
of floating drivers with a voltage swing equal to INTVCC 0.5V
superimposed on the switch node voltage SW.
Switch Node Connections to Inductors. Voltage swing at these pins is from a
Schottky diode (external) voltage drop below ground to VIN. To prev ent the
spike happened during switching operation, placed a 10 between SW pin
and MOSFET.
High Current Gate Drives for Low-Side N-MOSFETs. Voltage swing at these
pins is from ground to INTVCC.
Power Ground. Connect to internal gate drivers’ ground. It also connects to
negativ e terminal of input capacitors and the anodes of the Schottky
rectifiers.
External Power Input to Gate Drives. It can be connected with INTVCC pin
and uses INTVCC as gate drives power supply.
Output of the Internal 5V Linear Low Dropout Regulator. The driver and
control circuits are powered from this voltage source. It must be decoupled to
PGND pin with a minimum 4.7F tantalum or other low ESR capacitor.
Main Supply Input. A bypass capacitor of 0.1F should be tied between this
pin and the SGND pin.
20
PGND
21
DRVCC
22
INTVCC
23
VIN
27
PGOOD
Open-Drain Logic Output of Power Good Indication.
28
CLKOUT
Output Clock Signal. Available to daisy chained other controller ICs for
additional MOSFET driver stages.
GND
Power Ground. The exposed pad must be soldered to a large PCB and
connected to GND for maximum power dissipation.
33 (Exposed
Pad)
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RT8863
Functional Block Description
PHASE DET
Duplicate For Second Controller Channel
PLLFLTR
Oscillator
CLKOUT
S
R
INTVCC
BOOTx
DROP
OUT
DET
CLK1
CLK2
TGx
SHDN
Q
0.55V
+
MOSEFT
Driver
-
PLLIN
BGx
Pll
Detector
PGND,
GND
PGOOD
Current Sense
Monitor Unit
VOSENSE1
VOSENSE2
SWx
INTVCC
+
0.8VREF
SENSEx+
Slope
Comp
SENSEx-
DRVCC
5V LDO REG
2.4V
VOSENSEx
+
INTVCC
-
Internal
Supply
VIN
EA
+
0.86V
1.2µA
0.8V
TRCKx
ITHx
SoftStart
SGND
RUNx
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RT8863
Operation
The RT8863 is a dual, constant frequency, current mode
synchronous Buck controller with embedded MOSFET
drivers. The two controllers operate with 180 degrees out
of phase. During normal operation, each top MOSFET is
turned on when the clock for that channel sets the RS
latch, and turned off when the main current monitor unit
resets the RS latch.
The RT8863 uses an inductor peak current detect
architecture. The inductor peak current level is controlled
by ITHx pin voltage which is also the output of the error
amplifier (EA). The main current monitor unit trips when
the peak value of inductor current is sensed. The error
amplifier compares the output voltage feedback signal at
TRCKx pin to the internal reference voltage (0.8V). When
the load current increased, it causes a slight voltage
decrease in TRCKx pin. To rebalance the voltage, EA
increases the ITHx voltage until the average inductor current
matches the new current load.
After the top MOSFET is turned off at each cycle, the
bottom MOSFET is turned on until either the inductor
current starts to reverse, or a new clock cycle is started.
MOSFET drivers with another power supply. Put the
bypass cap at DRVCC pin in this case to reject noise;
and a small 1uF cap at INTVCC for loop compensation.
Frequency Selection and Synchronization
It is a trade-off between efficiency and component size
when select a proper switching frequency. Low frequency
operation increases efficiency by reducing MOSFET
switching losses, but it requires larger inductance and/or
capacitance to maintain low output ripple voltage.
Sometimes system requires a particular switching
frequency to avoid noise interference at some frequency
band.
RT8863 provides various switching frequency selection
for users. When PLLFLTR pin is biased at different voltages
range from 0 to 3V, the internal clock frequency is set
from 250KHz to 700KHz. A built-in Phase-lock loop (PLL)
can also synchronize the internal oscillator to an external
clock source that feeds to PLLIN pin. A loop filter (series
R-C) should be connected between PLLFLTR pin and
SGND pin.
Channels On/Off Control and Current Sharing Mode
The two channels are independently controlled by RUNx
pin. When both RUNx pin are pulled low, the whole chip
is in shutdown mode. When either RUNx pin voltage
reaches ~1V, its control loop is enabled.
RT8863 can be configured to an accurate current sharing
mode: configure its two channels in parallel by tying RUN2
pin to GND and use RUN1 pin to enable both channels. In
this configuration, ITHx pins needs to tie together; same
for VOSENSEx pins and TRCKx pins.
INTVCC and DRVCC as Power Pins
RT8863 has an internal high voltage LDO that provides a
5V supply at INTVCC pin that can powers all internal 5V
circuitry. DRVCC pin powers all the MOSFETs drivers.
When DRVCC pin is connected to INTVCC pin, an external
5V power supply is no longer needed. The whole system
can be powered by one input power at VIN. DRVCC pin
can also provides flexibility is user want to power the
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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RT8863
Absolute Maximum Ratings



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




(Note 1)
Supply Input Voltage, VIN -----------------------------------------------------------------------------------Top-side Driver Voltage BOOT1, BOOT2 -----------------------------------------------------------------Switch Voltages, SW1, SW2 -------------------------------------------------------------------------------INTVCC ----------------------------------------------------------------------------------------------------------DRVCC, RUN1, RUN2 ---------------------------------------------------------------------------------------SENSE1+, SENSE2+, SENSE1−, SENSE2− ---------------------------------------------------------PLLIN, PLLFLTR, CLKOUT ---------------------------------------------------------------------------------TRCK1, TRCK2, PGODD ------------------------------------------------------------------------------------ITH1, ITH2 -------------------------------------------------------------------------------------------------------Power Dissipation, PD@ TA = 25°C
WQFN-32L 5x5 ------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
WQFN-32L 5x5, θJA -------------------------------------------------------------------------------------------WQFN-32L 5x5, θJC ------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------Storage Temperature Range --------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------MM (Machine Model) ------------------------------------------------------------------------------------------
Recommended Operating Conditions



−0.3V to 30V
−0.3V to 36V
−0.3V to 30V
−0.3V to 7V
−0.3V to (1.1) INTVCC V
−0.3V to (1.1) INTVCC V
−0.3V to (1.1) INTVCC V
−0.3V to (1.1) INTVCC V
−0.3V to 2.7V
3.64W
27.5°C/W
6°C/W
260°C
150°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------ 7V to 28V
Junction Temperature Range --------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range --------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 15V, TA = 25°C, unless otherwise specified)
Parameter
Regulated Feedback
Voltage
Feedback Current
Reference Voltage
Line Regulation
Output Voltage Load
Regulation
Transconductance
Amplifier gm
Symbol
VOSENSE1
VOSENSE2
IOSENSE1
IOSENSE2
Test Conditions
VITHx = 1.2V
Min
Typ
Max
Unit
0.792
0.8
0.808
V
--
--
1
A
--
0.002
0.02
%/V
0.5
0.1
0.5
%
VREFLNREG
VIN = 7V to 28V
VLOADREG
Measured in servo loop,
0.7V  VITH  2
gm1, gm2
VITHx = 1.2V, Sink/Source 5A
--
1.3
--
A/V
Transconductance
Amplifier GBW
gmGBW1
gmGBW2
VITHx = 1.2V
--
3
--
MHz
Input DC Supply
Current
IQ
Normal Mode VIN = 15V, VRUNx = 3V
--
2
3
mA
Shutdown Mode VIN = 15V, VRUNx = 0V
--
1
10
A
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RT8863
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Clock Input Current
IPLLIN
VPLLIN = 0.85V
5
2
0.5
A
Under-Voltage Lockout
VUVLO
VIN pin ramping down
--
5.6
6
V
Feedback Voltage Lockout
Sense Pin Total Source
Current
VOVL
Measure VOSENSEx
0.84
0.82
0.88
V
ISENSE
Each Channel VSENSEx = 0V
90
45
--
A
Maximum Duty Factor
DMAX
98
99.4
--
%
Soft-Start Charge Current
ITRCK1
ITRCK2
VTRCKx = 0.2V
2
1
--
A
Run Pin ON Threshold
VRUN1
VRUN2
VRUNx Rising
1.0
1.5
2.0
V
Maximum Current Sense
Threshold
VSENSEx(MAX)
VOSENSEx = 0.7V, VSENSEx(n) = 5V,
VPLLIN < 0.5V
57
76
95
mV
TG1, TG2 Rising Time
tr
--
55
100
TG1, TG2 Falling Time
tf
--
55
100
BG1, BG2 Rising Time
tr
--
65
100
BG1, BG2 Falling Time
tf
--
55
100
Top Gate Off to Bottom
Gate On Delay,
Synchronous Switch On
Delay Time
Bottom Gate Off to Top
Gate On Delay, Top
Switch On Delay Time
CLOAD = 3300pF
CLOAD = 3300pF
ns
ns
t1D
CLOAD = 3300pF at Each Driver
--
60
--
ns
t2D
CLOAD = 3300pF at Each Driver
--
80
--
ns
tON(MIN)
Tested with a Square wave
--
120
--
ns
Internal VCC Voltage
VINTVCC
7V < VIN < 30V
4.8
5
5.5
V
INTVCC Load Regulation
VLDO
ICC = 0 to 20mA
--
0.5
2
%
Minimum On-Time
INTVCC Linear Regulator
Oscillator and Phase Locked Loop
Nominal Frequency
f NOR
VPLLFLTR = 1.7V
400
450
510
kHz
Lowest Frequency
f LOW
VPLLFLTR = 0V
210
250
290
kHz
Highest Frequency
f HIGH
VPLLFLTR 3V
520
580
640
kHz
Phase Detector Output
Current Sinking Capability
IPLLFLTR
VPLLFLTR = 1.7V, f PLLIN < f NOR
--
17
--
A
Phase Detector Output
Current Sourcing
Capability
IPLLFLTR
VPLLFLTR = 1.7V, f PLLIN > f NOR
--
17
--
A
PGOOD Voltage Low
VPGOOD
IPGOOD = 2mA
--
0.1
0.3
V
PGOOD Leakage Current
IPGOOD
VPGOOD = 5V
--
--
1
A
PGOOD Output
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RT8863
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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RT8863
Typical Application Circuit
VIN
C1
C2
C3
23
21
VIN DRVCC
D1
22
INTVCC
26 BOOT1
BOOT2 15
C5
C4
RSENSE1
Q1
R11
L1
VOUT1
D3
R13
C6
RT8863
25 TG1
Q2
SW2 17
24 SW1
19 BG1
BG2
31 SENSE1+
C7
R6
32 SENSE11 VOSENSE1
7 TRCK2
2 PLLFLTR
30
C11
R5
ITH1
C12
RUN1
14 RUN2
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DS8863-01 February 2015
Q3
10
Q4
18
RSENSE2
L2
C9
R14
C15
R9
SENSE2+ 11
SENSE2-
VOUT2
D4
C8
10
VOSENSE2 13
R10
CLKOUT 28
PGOOD 27
R7
VINTVCC
TRCK1 29
3
Enable
R12
PLLIN 5
20 PGND
C14
C10
TG2 16
10
R1 R2
R3 R4
D2
ITH2
SGND
6
12
R8
C13
CSS
GND
33 (Exposed Pad)
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RT8863
Typical Operating Characteristics
Efficiency vs. Output Current
Efficiency vs. Input Voltage
100
100
IOUT = 3A
90
95
IOUT = 6A
80
Efficiency (%)
Efficiency (%)
90
85
80
75
70
70
VIN
VIN
VIN
VIN
60
50
40
30
10
Force Continuous Mode, VOUT = 5V, f = 300kHz
7
10
13
16
19
22
25
Force Continuous Mode, VOUT = 5V, f = 300kHz
0
0.001
60
28
0.01
0.1
1
10
Output Current (A)
Input Voltage (V)
Supply Current vs. Input Voltage
Shutdown Current vs. Input Voltage
3.0
1.0
Shutdown Current (µA)1
2.5
Supply Current (mA)
7V
12V
15V
20V
20
65
2.0
1.5
1.0
0.5
0.0
0.8
0.6
0.4
0.2
0.0
7
10
13
16
19
22
25
28
7
10
13
16
Input Voltage (V)
19
22
25
28
Input Voltage (V)
Sense Threshold vs. Input Voltage
Sense Threshold vs. Input Voltage
60
89
59
VSENSE1
87
Sense Threshold (mV)
Sense Threshold (mV)
=
=
=
=
85
83
81
79
VSENSE2
77
VSENSE1
58
57
56
55
54
VSENSE2
53
52
51
VPLLIN = 1.5V
VPLLIN = 0V
50
75
7
9
11
13
15
17
19
21
23
25
Input Voltage (V)
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27
7
9
11
13
15
17
19
21
23
25
27
Input Voltage (V)
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RT8863
Operation Frequency vs. PLLFLTR Voltage
Oscillator Frequency vs. Temperature
650
VPLLFLTR = 2.4V
600
Operation Frequency (kHz)1
Oscillator Frequency (kHz)1
700
VPLLFLTR = 1.7V
500
VPLLFLTR = 1.2V
400
300
VPLLFLTR = 0V
200
600
550
500
450
400
350
300
250
200
100
-50
-25
0
25
50
75
100
0
125
1
3
4
PLLFLTR Voltage (V)
Temperature (°C)
Internal LDO Line Regulation
Internal LDO Voltage vs. Temperature
6.0
6.0
5.5
5.5
Internal LDO Voltage (V)
Internal LDO Line Regulation (V)1
2
5.0
4.5
4.0
3.5
3.0
5.0
4.5
4.0
3.5
3.0
2.5
2.5
2.0
2.0
VIN = 12V
7
10
13
16
19
22
25
-50
28
-25
0
Input Voltage (V)
25
50
75
100
125
Temperature (°C)
UVLO vs. Temperature
Internal LDO Load Regulation
5.20
6.0
INTVCC Voltage (V)
5.9
UVLO (V)
5.8
5.7
5.6
5.5
5.16
5.12
5.08
5.04
5.4
VIN = 12V
5.3
5.00
-50
-25
0
25
50
75
100
Temperature (°C)
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DS8863-01 February 2015
125
0
5
10
15
20
25
30
35
40
Output Current (mA)
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RT8863
Output Voltage vs. Output Current
Output Voltage vs. Input Voltage
3.50
3.40
VIN
VIN
VIN
VIN
VIN
3.32
=
=
=
=
=
3.42
7V
10V
15V
20V
25V
Output Voltage (V)
Output Voltage (V)
3.36
IOUT
IOUT
IOUT
IOUT
IOUT
IOUT
IOUT
3.28
3.34
= 0.01A
= 0.1A
= 1A
= 3A
= 5A
= 8A
= 10A
3.26
3.18
3.24
VOUT = 3.3V, IOUT = 10mA to 10A
VIN = 7V to 28V, VOUT = 3.3V
3.10
3.20
0
2
4
6
8
7
10
11.6
16.2
20.8
25.4
Output Current (A)
Input Voltage (V)
Power On from RUNx
Power Off from RUNx
VIN
(5V/Div)
VOUT
(2V/Div)
VIN
(5V/Div)
VOUT
(2V/Div)
RUNx
(5V/Div)
RUNx
(5V/Div)
VIN = 15V, VOUT = 5V, VRUNx = 0V to 3V
30
VIN = 15V, VOUT = 5V, VRUNx = 3V to 0V
Time (25ms/Div)
Time (10ms/Div)
Load Transient Response
Switching
VOUT
(10mV/Div)
VOUT
(100mV/Div)
IL
(2A/Div)
TGx
(20V/Div)
IOUT
(1A/Div)
BGx
(5V/Div)
VIN = 15V, VOUT = 3.3V, IOUT = 0A to 2A
Time (100μs/Div)
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VIN = 15V, VOUT = 3.3V, IOUT = 2A
Time (1μs/Div)
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RT8863
Coincident Tracking
(1V/Div)
Ratiometric Tracking
V OUT1
V OUT1
V OUT2
V OUT2
VIN = 12V, VOUT1 = 5V, VOUT2 = 3.3V
Time (2.5ms/Div)
(1V/Div)
VIN = 12V, VOUT1 = 5V, VOUT2 = 3.3V
Time (2.5ms/Div)
Internal Soft-Start
V OUT1
V OUT2
(1V/Div)
VIN = 12V, VOUT1 = 5V, VOUT2 = 3.3V
Time (2.5ms/Div)
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RT8863
Application Information
The RT8863 allows users to program how the channel
outputs ramp up either as coincidentally or ratiometrically
tracking as shown as in Figure 1.
The TRCKx pins act as clamps on the channels' reference
voltages. VOUT is referenced to the TRCKx voltage when
the TRCKx < 0.8V and to the internal precision reference
when TRCKx > 0.8V.
Output Voltage
VOUT1
VOUT1
R1
R3
To
TRCKSS2
pin
VOUT2
To
VOSENSE1
pin
R4
R3
To
VOSENSE2
pin
R4
R2
Figure 2. (a) Coincidentally Tracking Setting
VOUT1
VOUT2
VOUT2
R1
R3
To
TRCKSS2
pin
To
VOSENSE1
pin
To
VOSENSE2
pin
R2
R4
Time
Figure 1. (a) Coincident Tracking
Output Voltage
VOUT1
Figure 2. (b) Ratiometrically Tracking Setting
Figure 2. Setups for Different Output Voltage Tracking
RSENSEx Selection For Output Current
VOUT2
RSENSEx is chosen based on the required output current.
The current comparator has a maximum threshold of
76mV, yielding a maximum average output current IMAXx.
The RSENSEx design could be followed as :
Time
Figure 1. (b) Ratiometrically Tracking
Figure 1. Two Different ways of Output Voltage Tracking
RSENSEx = 76mV / IMAXx
When using the controller in very low dropout conditions,
the maximum output current level will be reduced.
Feedback and Compensation
To implement the tracking in Figure 1, connect an extra
resistive divider to the output of the master channel and
connect its midpoint to the slave channel’s TRCKx pin.
The ratio of this divider should be selected the same as
that of channel 2’s feedback divider (Figure 2). In this
tracking mode, the master channel’s output must be set
higher than slave channel’s output. To implement the
ratiometric tracking in Figure 2b, no extra divider is needed;
simply connect one of TRCKx pins to the other.
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14
The RT8863 allows the output voltage of the DC/DC
converter to be adjusted from 0.8V to 85% of VIN supply
via an external resistor divider. It will try to maintain the
VOSNESEx pin at internal reference voltage (0.8V).
VOUT
R1
FB
R2
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RT8863
According to the resistor divider network above, the output
voltage is set as :


VREF
R2 = R1 

 VOUT  VREF 
The RT8863 is a current-mode controller and requires
external compensation to have an accurate output voltage
regulation with fast transient response.
If the output voltage have been detected over-voltage and
made FB voltage exceed 0.85V, the over-voltage protection
of RT8863 will be triggered. In this case, the high-side
MOSFET is turned off and the bottom MOSFET is turned
on until the over-voltage condition is cleared.
Operating Frequency
The IC uses a constant frequency phase-lockable
architecture with the frequency determined by an internal
capacitor. This capacitor is charged by a fixed current plus
an additional current which is proportional to the voltage
applied to the PLLFLTR pin. When PLLIN = 0V, the internal
frequency depends on PLLFLTR voltage.
The IC has a phase-locked loop comprised of an internal
voltage controlled oscillator and phase detector. The
frequency range of the voltage controlled oscillator is ±30%
around the center frequency. A voltage applied to the
PLLFLTR pin of 1.7V corresponds to a frequency of
approximately 450kHz. The operating frequency range of
the IC is 210kHz to 640kHz.
INTVCC Regulator
An internal low dropout regulator produces 5V at the
INTVCC pin from the VIN supply pin. INTVCC powers the
drivers and internal circuitry within the IC. The INTVCC
pin regulator can supply a peak current of 50mA and must
be bypassed to ground with low ESR type capacitor. A
1μF ceramic capacitor placed directly adjacent to the
INTVCC and PGND pins is highly recommended. Good
bypassing is necessary to supply the high transient
currents required by the MOSFET gate drivers and to
prevent interaction between channels.
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RUNx and Soft-Start
The RT8863 RUNx pins shut down their respective
channels independently. The RT8863 is put in a low
quiescent current state (~1μA) if both RUN pin voltages
are below 1V. The TRCKx pins are actively pulled to ground
in this shutdown state. Once the RUNx pin voltages are
above 1.5V, the respective channel of the RT8863 is
powered up. The RT8863 has the ability to either softstart by itself with an external soft-start capacitor or tracking
the output of the other channel or supply. When the device
is configured to soft-start by itself, an external soft-start
capacitor should be connected to the TRCKx pins. A softstart current of 1.2μA is to charge the soft-start capacitor
CSS. The total soft-start time can be estimated as :
tSoft-Start = 0.8V x CSS / 1.2μA
The RT8863 is designed such that the TRCKx pins are
actively pulled down if the channels are shut down.
Minimum On-Time Considerations
Minimum on-time, tON(MIN), is the smallest time duration
that each controller is capable of turning on the high-side
MOSFET. It is determined by internal timing delays and
the gate charge required to turn on the high-side MOSFET.
Low duty cycle applications may approach this minimum
on-time limit.
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the ripple voltage and current will increase. The
minimum on-time for each controller is approximately
120ns.
Inductor Selection
The inductor plays an important role in step-down
converters because it stores the energy from the input
power rail and then releases the energy to the load. From
the viewpoint of efficiency, the dc resistance (DCR) of the
inductor should be as small as possible to minimize the
conduction loss. In addition, because the inductor takes
up a significant portion of the board space, its size is also
important. Low profile inductors can save board space
especially when there is a height limitation. However, low
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RT8863
DCR and low profile inductors are usually not cost effective.
Additionally, larger inductance results in lower ripple
current, which means lower power loss. However, the
inductor current rising time increases with inductance value.
This means the transient response will be slower. Therefore,
the inductor design is a compromise between
performance, size and cost. In general, the inductance is
designed such that the ripple current ranges between 20%
to 40% of the full load current. The inductance can be
calculated using the following equation :
LMIN =
VIN  VOUT
V
 OUT
fSW  k  IOUT_rated
VIN
where k is the inductor ripple current.
Input Capacitor Selection
Voltage rating and current rating are the key parameters
in selecting an input capacitor. For a conservatively safe
design, an input capacitor should generally have a voltage
rating 1.5 times greater than the maximum input voltage.
The input capacitor is used to supply the input RMS
current, which is approximately calculated using the
following equation :
IRMS = IOUT 
VOUT  VOUT 
 1
VIN 
VIN 
The next step is to select a proper capacitor for RMS
current rating. Placing more than one capacitor with low
Equivalent Series Resistance (ESR) in parallel to form a
capacitor bank is a good design. Also, placing ceramic
capacitor close to the Drain of the high-side MOSFET is
helpful in reducing the input voltage ripple at heavy load.
When the chip is used in a hazard environment where
long trace line to Input capacitor and output can be hard
shorted to ground, a bigger capacitor up to 150μF should
be used to reduce the voltage ripple on supply line.
Output Capacitor Selection
The output capacitor and the inductor form a low-pass filter
in the Buck topology. In steady-state condition, the ripple
current that flows into or out of the capacitor results in
ripple voltage. The output voltage ripples contains two
components, VOUT_ESR and VOUT_C.
When load transient occurs, the output capacitor supplies
the load current before the controller can respond.
Therefore, the ESR will dominate the output voltage sag
during load transient. The output voltage sag can be
calculated using the following equation :
VOUT_sag = ESR x ΔIOUT
For a given output voltage sag specification, the ESR value
can be determined. Another parameter that has influence
on the output voltage sag is the equivalent series
inductance (ESL). A rapid change in load current results
in di/dt during transient. Therefore, ESL contributes to
part of the voltage sag. Use a capacitor that has low ESL
to obtain better transient performance. Generally, using
several capacitors in parallel will have better transient
performance than using single capacitor for the same total
ESR.
Unlike the electrolytic capacitor, the ceramic capacitor has
relative low ESR and can reduce the voltage deviation during
load transient. However, the ceramic capacitor can only
provide low capacitance value. Therefore, use a mixed
combination of electrolytic capacitor and ceramic capacitor
for better transient performance.
MOSFET Selection
The majority of power loss in the step-down power
conversion is due to the loss in the power MOSFETs. For
low voltage high current applications, the duty cycle of
the high side MOSFET is small. Therefore, the switching
loss of the high-side MOSFET is of concern. Power
MOSFETs with lower total gate charge are preferred in
such applications. However, the small duty cycle means
the low-side MOSFET is on for most of the switching
cycle. Therefore, the conduction loss tends to dominate
the total power loss of the converter. To improve the overall
efficiency, MOSFETs with low RDS(ON) are preferred in
circuit design. In some cases, more than one MOSFET
are connected in parallel to further decrease the on-state
resistance. However, this depends on the low-side
MOSFET driver capability and the budget.
VOUT_ESR  IL  ESR
VOUT_C  IL 
1
8  COUT  fSW
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is a registered trademark of Richtek Technology Corporation.
DS8863-01 February 2015
RT8863
INTVCC Regulator and DRVCC
Thermal Considerations
RT8863 features an internal NPN linear regulator that
supplies power to INTVCC from Vin supply. The INTVCC
regulator regulates INTVCC voltage to 5V and can supply
50mA current. A 1μF capacitor is needed to ensure the
regulator is stable. DRVCC pin powers the MOSFETs
driver circuitries. It should either connect to INTVCC pin,
or an external power supply. This pin must have a 4.7μF
tantalum, 10μF special polymer, or low ESR type of
electrolytic capacitor. A 1μF ceramic capacitor placed
directly adjacent to the DRVCC and GND IC pin is highly
recommended. This bypassing capacitor is necessary to
supply the high transient currents required by the MOSFET
gate drivers and to prevent interaction between channels.
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
The Maximum rating for the INTVCC pin is 50mA. TO
prevent maximum junction temperature from being
exceeded, the input supply current must be checked
operating in continuous mode at maximum Vin.
Undervoltage Lockout
The RT8863 recommended minimum supply voltage is
7V, where INVVCC will drop below 5V when VIN is below
6V. To protect the controller in case of undervoltage
conditions, the RT8863 has another 2 functions
implemented. An UVLO comparator always monitor the
INTVCC voltage to ensure that an adequate gate driver
voltage is present. It locks out the switching actions when
INTVCC is below 4.5V.
Another way to detect an undervoltage condition is to
monitor the VIN supply voltage. When VIN is below 3.5V,
the internal reference voltage is pulled low and same for
the linear regulator for INTVCC pin. In this case, even
when RUNx pin is pulled above 1V (its turn on threshould
voltage), the IC is still in turn off mode.
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WQFN-32L 5x5 packages, the thermal resistance, θJA, is
27.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (27.5°C/W) = 3.64W for
WQFN-32L 5x5 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 3 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
4.0
Maximum Power Dissipation (W)1
For higher input voltage applications where large MOSFETs
are being driven at high frequencies, power dissipation
need to be checked carefully to avoid the maximum
junction temperature rating for the IC to be exceeded.
PD(MAX) = (TJ(MAX) − TA) / θJA
Four-Layer PCB
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve of Maximum Power Dissipation
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RT8863
Outline Dimension
D2
D
SEE DETAIL A
L
1
E
E2
e
b
1
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
1
2
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
4.950
5.050
0.195
0.199
D2
3.400
3.750
0.134
0.148
E
4.950
5.050
0.195
0.199
E2
3.400
3.750
0.134
0.148
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 32L QFN 5x5 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS8863-01 February 2015