TELEDYNE RELAYS SERIES CENTIGRID® ESTABLISHED RELIABILITY RELAY 116C DPDT CMOS COMPATIBLE SERIES DESIGNATION RELAY TYPE 116C DPDT general purpose relay with internal power MOSFET driver, Zener diode gate protection and diode coil suppression INTERNAL CONSTRUCTION DESCRIPTION UNI-FRAME UPPER STATIONARY CONTACT ARMATURE LOWER STATIONARY CONTACT The 116C Centigrid® relay is an ultraminiature, hermetically sealed, armature relay capable of being directly driven by most IC logic families. Its low profile height and .100” grid spaced terminals, which precludes the need for spreader pads, make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The basic concept and internal structure are similar to the Teledyne DPDT TO-5 relay (412 Series). The following unique construction features and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes: • • • • • MOVING CONTACT ENVIRONMENTAL AND PHYSICAL SPECIFICATIONS Temperature (Ambient) -65˚C to +125˚C Vibration 30 g’s to 3000 Hz (Note 1) Shock 75 g’s for 6 msec. (Note 1) half-sine Acceleration 50 g’s (Note 1) Enclosure All welded, hermetically sealed Weight 0.11 oz (3.12 gms.) max. All welded construction. Unique uni-frame design providing high magnetic efficiency and mechanical rigidity. High force/mass ratios for resistance to shock and vibration. Advanced cleaning techniques provide maximum assurance of internal cleanliness. Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities. By virtue of its inherently low intercontact capacitance and contact circuit losses, the Centigrid® relay has shown itself to be an excellent ultraminiature RF switch for frequency ranges well into the UHF spectrum. A typical RF application for the Centigrid® relay is in hand held radio transceivers, wherein the combined features of good RF performance, small size, low coil power dissipation and high reliability make it a preferred method of TransmitReceive switching (see Figure 1). The 116C Series utilizes internal silicon diode for coil suppression, a Zener diode to protect the MOSFET gate input, and an N-channel enhancement mode MOSFET chip which enables direct relay interfacing with most Microprocessor and IC logic families (CMOS, TTL and MOS). 26 SERIES 116C GENERAL ELECTRICAL SPECIFICATIONS (-65°C to +125°C unless otherwise noted) (Notes 2 & 7) Contact Arrangement Rated Duty Contact Resistance Contact Load Rating (DC) (See Fig. 2 for other DC resistive voltage/current ratings) 2 Form C (DPDT) Continuous 0.1 ohm max. before life; 0.2 ohm max. after life at 1A/28VDC, (measured 1/8” from header) Resistive: 1 Amp/28VDC Inductive: 200 mA/28VDC (320 mH) Lamp: 100 mA/28VDC Low Level: 10 to 50 µA/10 to 50 mV Resistive: 250 mA/115VAC, 60 and 400Hz (Case not grounded) 100 mA/115VAC, 60 and 400Hz (Case grounded) 10,000,000 cycles (typical) at low level 01,000,000 cycles (typical) at 0.5A/28VDC resistive 00,100,000 cycles min. at all other loads specified above 2A/28VDC Resistive (100 cycles min.) Contact factory 2.5 msec max. at nominal rated coil voltage 4.0 msec max. 1.5 msec max. 0.4 pf typical 10,000 megohms min. between mutually isolated terminals (Note 3) Atmospheric pressure: 500 VRMS/60 Hz 70,000 ft.: 125 VRMS/60Hz (Note 3) Contact Load Ratings (AC) Contact Life Ratings Contact Overload Rating Contact Carry Rating Operate Time Release Time Contact Bounce lntercontact Capacitance Insulation Resistance Dielectric Strength Diode P.I.V. (VDC) Negative Coil Transient (VDC) Zener Voltage (VDC) Zener Leakage Current (µA @ 15.2 VDC) 100 min. 1.0 max. 17 min. to 23 max. 2.5 max. 0.5 3.8 (Note 4) 55 Gate Voltage to Turn Off (VDC, Max.) Gate Voltage to Turn On (VDC, Min.) Drain-Source Voltage (VDC, Max.) Power FET Characteristics -65°C to +125°C DETAILED ELECTRICAL SPECIFICATIONS (-65°C to +125°C unless otherwise noted) (Note 7) BASE PART NUMBERS (See Note 10 for full P/N Example Coil Voltage (VDC) ➧ 116C-5 Nom. Max. Max. Min. Coil Current (mADC @ 25°C) Nominal Coil Operating Power @ 25°C (Milliwatts) Pick-up Voltage (VDC) (Note 4) Drop-out Voltage (VDC) (Note 4) 5.0 5.6 132.3 96.5 641 4.0 0.13 2.3 Max. Min. Max. 116C-6 116C-9 116C-12 116C-18 6.0 8.0 83.9 60.3 462 4.9 0.18 3.2 9.0 12.0 47.1 33.1 368 7.3 0.27 4.9 12.0 16.0 36.1 24.9 369 9.8 0.36 6.5 18.0 24.0 24.1 16.1 368 14.6 0.54 9.8 PERFORMANCE CURVES (NOTE 2) TYPICAL RF PERFORMANCE 0 116C-26 26.5 32.0 19.9 12.9 450 19.5 0.72 13.0 TYPICAL DC CONTACT RATING (RESISTIVE) INSERTIO N LOSS .1 300 .2 LOAD VOLTAGE (VDC) .3 10 1.92 20 1.22 SS (VSWR) RETURN LO 30 1.07 CTS 40 ATION 50 ISOL NTA S CO LES N ATIO 60 1.02 S ACRO ISOL 1.01 PO ROSS AC VSWR dB .4 200 150 100 50 1.00 70 250 1.00 .01 0.5 .1 .5 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 FREQUENCY (GHz) LOAD CURRENT (AMPS DC) FIGURE 1 FIGURE 2 27 0.7 0.8 0.9 1.0 SERIES 116C OUTLINE DIMENSIONS SCHEMATIC DIAGRAMS TERMINAL LOCATIONS (Viewed from Terminals, Numbers for Reference only) CASE DETAIL .375 MAX. (9.53) .335 MAX. (8.51) .035 ± .010 (0.89 ± 0.25) .031 ± .003 (0.79 ± 0.08) .435 MAX. (11.05) .275 MAX. (6.99) PIN 1: + SUPPLY PIN 9L – SUPPLY PIN 10: GATE .475 MAX. (12.06) .100 ± .010 (2.54 ± .25) TYP .75 MIN. (19.05) +0.002 -0.001 DIA. +(0.051) (0.43) -(0.025) .200 ± .010 (5.08 ± 0.25) .017 SCHEMATICS ARE VIEWED FROM TERMINALS 9 LEADS DIMENSIONS ARE SHOWN IN INCHES (MILLIMETERS) SPACER PAD NOTES: Relays can be supplied with a spacer pad attached to the relay header. The pad permits the relay to be spaced away from the mounting surface facilitating solder joint inspection. To order add M9 to the part number (e.g. 116CM9-26). 1. Material: Polyester film 2. Increase contact resistance by 0.01 ohm. .300 MAX (7.62) TYPICAL CMOS INTERFACE CIRCUIT DC Logic Voltage Supply (A) Internal Suppression Diode (B) FET Gate Input (C) Internal Zener Diode (D) Integral FET Body Diode NOTES: 1. Relays contacts will exhibit no chatter in excess of 10 µsec or transfer in excess of 1 µsec. 2. “Typical” characteristics are based on available data and are best estimates. No on-going verification tests are performed. 3. Pins 9 and 10 must be shorted when tested for Insulation Resistance and Dielectric Withstanding Voltage. 4. Maximum rated gate voltage = 15 Vdc. 5. Unless otherwise specified, relays will be supplied with either gold plated or solder coated leads. Contact your local representative for ordering information. 6. The slash and characters appearing after the slash are not marked on the relay. 7. Unless otherwise specified, parameters are initial values. 8. Screened HI-REL versions available. Contact factory. 9. RELIABILITY LEVEL FAILURE RATE %/10,000 CYCLES A 1.5 B 0.75 10. Teledyne Part Numbering System for Established Reliability Relays (See T2R® Program Introduction) EXAMPLE: ER 116C Z M9 – 26 A / Q Established Reliability Designator Termination Variant Q = Solder Coated Leads (Notes 5 and 6) Relay Series Reliability and Screening Level (Note 9) Mounting Variant Ground Pin (See page 112) M9 = 194-19 Spacer Pad Coil Voltage ©1996 TELEDYNE RELAYS 28 12525 Daphne Avenue Hawthorne, California 90250