ANT1204LL00R0918A

DATA SHEET
WIRELESS COMPONENTS
Ceramic Chip Antenna
ANT1204LL00R0918A
Cellular-Band
Product Specification – August 10, 2015 V.0
1204 Series
Product specification
Wireless Components
FEATURES
 Compact size
 High radiation efficiency
 Multi-band coverage
 Tape & reel automatic
mounting
 Reflow process compatible
 RoHS compliant
2
6
Ceramic Chip Antenna
ORDERING INFORMATION
All part numbers are identified by the series, packing type, material, size,
antenna type, working frequency and packing quantity.
PART NUMBER
ANT 1204 L L00 R 0918A
(1)
(2)
(3) (4)
(5)
(6)
(1) PRODUCT
APPLICATIONS
 Global cellular network
devices
 Telematics
 Cellular broadband access
 M2M module
ANT = Antenna
(2) SIZE
1204= 12*4
(3) ANTENNA TYPE
L,F,A = Chip Antenna
(4) SERIAL NO.
L00
(5) PACKING STYLE
R = Tape and Reel
(6) WORKING FREQUENCY
0918 =0.9/1.8GHz
PHYCOMP CTC
CAN4311759009181K
12NC
431175900918
www.yageo.com
Aug. 10, 2015 V.0
Product specification
Wireless Components
3
6
Ceramic Chip Antenna
SPECIFICATION
Table 1
VALUE
DESCRIPTION
Centre Frequency
900/1800 MHz
Bandwidth
20 MHz (Typ.)
VSWR
3.0 Max.
Polarization
Linear
Azimuth Beamwidth
Omni-directional
Peak Gain
-1.60dBi / 1.08dBi (Typ.)
50 Ω
Impedance
– 40 °C ~ 105 °C
Operating Temperature
Maximum Power
2W
Termination
Ni / Sn (Environmentally-Friendly Leadless)
Resistance to Soldering Heats
260℃ , 10sec.
NOTE
1. The specification is defined on Yageo evaluation board
DIMENSIONS
Table 2 Machinical Dimension
OUTLINES
DIMENSION
L (mm)
12.0 ±0.50
W (mm)
4.40 ±0.50
T (mm)
1.20 ±0.30
A (mm)
0.80±0.30
B (mm)
1.00±0.30
C (mm)
0.80±0.30
D (mm)
0.80±0.30
E (mm)
0.80±0.30
F (mm)
3.00 ±0.50
Table 3 Termination configuration
TERMINAL NAME
L
F
Fig. 1 Antenna outlines
FUNCTION
A
Solder termination
B
Feed termination
C
Solder termination
D
Solder termination
E
Solder termination
F
Solder termination
www.yageo.com
Aug. 10, 2015 V.0
Product specification
Wireless Components
Ceramic Chip Antenna
4
6
REFERENCE DESIGN OF EVALUATION BOARD
Fig. 2 Outlook and dimension of evaluation board
Fig. 3 Details of soldering Pad
www.yageo.com
Aug. 10, 2015 V.0
Product specification
Wireless Components
Ceramic Chip Antenna
5
6
ELECTRICAL PERFORMANCES
Fig. 4 Return loss
Fig. 5 Radiation pattern
www.yageo.com
Aug. 10, 2015 V.0
Product specification
Wireless Components
6
6
Ceramic Chip Antenna
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION
Version 0
-
Jan. 11, 2013
DESCRIPTION
-
New data sheet for SMD type antenna, Cellular-Band application,
1204 series.
www.yageo.com
Aug. 10, 2015 V.0