DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1%, 0.5% sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512 Product specification – April 01, 2015 V.3 RoHS compliant & Halogen free Product specification Chip Resistor Surface Mount AF 2 9 0201 to 2512 SERIES SCOPE This specification describes AF0201 to AF2512 chip resistors with anti-sulfuration capabilities. ORDERING INFORMATION - GLOBAL PART NUMBER Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. APPLICATIONS Industrial Equipment Power Application Networking Application High-end Computer & Multimedia Electronics in high sulfur environment AF XXXX X X X XX XXXX L GLOBAL PART NUMBER (1) (2) (3) (4) (5) (6) (7) (1) SIZE 0201/0402/0603/0805/1206/1210/1218/2010/2512 (2) TOLERANCE D = ±0.5% F = ±1% FEATURES Superior resistance against sulfur containing atmosphere Halogen free product and production RoHS compliant - Products with lead free terminations meet RoHS requirements - Pb-glass contained in electrodes, resistor element and glass are exempted by RoHS Reduces environmentally hazardous waste High component and equipment reliability Saving of PCB space Moisture sensitivity level: MSL 1 J = ±5% (for jumper ordering, use code of J) (3) PACKAGING TYPE R = Paper taping reel K = Embossed plastic tape reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE – = Base on spec (5) TAPING REEL 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel (6) RESISTANCE VALUE There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point. Detailed resistance rules are displayed in the table of “Resistance rule of global part number”. (7) DEFAULT CODE Letter L is system default code for ordering only (Note) Resistance rule of global part number Resistance coding rule Example XRXX (1 to 9.76 Ω) 1R = 1 Ω 1R5 = 1.5 Ω 9R76 = 9.76 Ω XXRX (10 to 97.6 Ω) 10R = 10 Ω 97R6 = 97.6 Ω XXXR (100 to 976 Ω) 100R = 100 Ω XKXX (1 to 9.76 KΩ) 1K = 1,000 Ω 9K76 = 9760 Ω XMXX (1 to 9.76 MΩ) 1M = 1,000,000 Ω 9M76= 9,760,000 Ω O RDERING EXAMPLE The ordering code for an AF0402 chip resistor, value 100 KΩ with ±1% tolerance, supplied in 7-inch tape reel with 10Kpcs quantity is: AF0402FR-07100KL. NOTE 1. All our R-Chip products are RoHS compliant and Halogen free. "LFP" of the internal 2D reel label states "Lead-Free Process" 2. On customized label, "LFP" or specific symbol can be printed www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 3 9 0201 to 2512 MARKING AF0201 / AF0402 No marking Fig. 1 AF0603 / AF0805 / AF1206 / AF1210 / AF2010 / AF2512 E-24 series: 3 digits, ±5%, ≥10Ω First two digits for significant figure and 3rd digit for number of zeros Fig. 2 Value=10 KΩ AF0603 Fig. 3 Value = 24 Ω E-24 series: 3 digits, ±1% One short bar under marking letter E-96 series: 3 digits, ±1% First two digits for E-96 marking rule and 3rd letter for number of zeros Fig. 4 Value = 12.4 KΩ AF0805 / AF1206 / AF1210 / AF2010 / AF2512 Fig. 5 Value = 10 KΩ Both E-24 and E-96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros AF1218 E-24 series: 3 digits, ±5% First two digits for significant figure and 3rd digit for number of zeros Fig. 6 Value = 10 KΩ Both E-24 and E-96 series: 4 digits, ±1% First three digits for significant figure and 4th digit for number of zeros Fig. 7 Value = 10 KΩ NOTE For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF CONSTRUCTION The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a lead-free glass. The composition of the glaze is adjusted to give the approximate required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.8 SERIES 0201 to 2512 4 9 OUTLINES For dimensions see T bl 1 DIMENSIONS Table 1 For outlines see fig. 8 TYPE AF0201 L (mm) W (mm) H (mm) I1 (mm) I2 (mm) 0.60±0.03 0.30±0.03 0.23±0.03 0.12±0.05 0.15±0.05 AF0402 1.00 ±0.05 0.50 ±0.05 0.32 ±0.05 0.20 ±0.10 0.25 ±0.10 AF0603 1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15 AF0805 2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20 Fig. 8 Chip resistor outlines AF1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20 AF1210 3.10±0.10 2.60±0.15 0.50±0.10 0.45±0.15 0.50±0.20 AF1218 3.10±0.10 4.60±0.10 0.55±0.10 0.45±0.20 0.40±0.20 AF2010 5.00±0.10 2.50±0.15 0.55±0.10 0.55±0.15 0.50±0.20 AF2512 6.35±0.10 3.10±0.15 0.55±0.10 0.60±0.20 0.50±0.20 www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 5 9 0201 to 2512 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS TYPE AF0201 RESISTANCE RANGE ±5% (E24), 1Ωto 10MΩ ±0.5%, ±1% (E24/E96), 1Ω to 10MΩ Zero Ohm Jumper < 0.05Ω Operating Max. Max. Dielectric Temperature Working Overload Withstanding Range Voltage Voltage Voltage Temperature Coefficient of Resistance Jumper Criteria Rated Current 0.5A -55°C to +125°C 25 V 50 V 50 V AF0402 50 V 100 V 100 V AF0603 75 V 150 V 100 V 1Ω≤ R ≤10Ω, -100/+350 ppm/°C 10Ω＜R ≤ 10MΩ, ±200 ppm/°C Max. Current 1.0A Rated Current 1.0A Max. Current AF0805 ±5% (E24), 1 Ω to 22 MΩ ±0.5%, ±1% (E24/E96), 1 Ω to 10 MΩ Zero Ohm Jumper < 0.05 Ω 2.0A 1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C 150 V 300 V 300 V 10 Ω< R ≤ 10 MΩ, ±100 ppm/°C 10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C 200 V 400 V 500 V 10.0A Rated Current 2.0A 200 V 500 V 500 V Max. Current 10.0A ±5% (E24), 1Ω to 10MΩ ±0.5%, ±1% (E24/E96), Zero Ohm Jumper < 0.05Ω AF2512 1Ω≤ R≤ 10Ω, ±200 ppm/°C Rated Current 2.0A 200 V 500 V 500 V 200 V 500 V 500 V Rated Current 2.0A 500V 500V Max. Current 10.0A 1Ω to 10M AF2010 5.0A Max. Current –55 °C to +155 °C AF1218 Max. Current Rated Current 2.0A AF1206 AF1210 Rated Current 2.0A 200V 10Ω＜R ≤ 10MΩ, ±100 ppm/°C Max. Current 10.0A www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 6 9 0201 to 2512 FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE REEL DIMENSION AF0201 Paper taping reel (R) AF0402 AF0603/0805/ 1206 AF1210 AF1218/2010/ 2512 -- 7" (178 mm) 10,000/20,000 10,000/20,000 5,000 5,000 13" (330 mm) 50,000 50,000 20,000 20,000 -- 7" (178 mm) -- -- -- -- 4,000 Embossed taping reel (K) NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”. FUNCTIONAL DESCRIPTION OPERATING TEMPERATURE RANGE AF0201 Range: -55 °C to + 125 °C (Fig. 7) AF0402 - AF2512 Range: -55 °C to + 155 °C (Fig. 7-1) POWER RATING Each type rated power at 70 °C: AF0201=1/20W (0.05W) AF0402=1/16 W (0.0625W) AF0603=1/10 W (0.1W) AF0805=1/8 W (0.125W) AF1206=1/4 W (0.25W) AF1210=1/2W (0.5W) AF1218=1W AF2010=3/4W (0.75W) AF2512=1W Fig. 7 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (T ) R ATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = �(P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω ) Fig. 7-1 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient (T ) www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 7 9 0201 to 2512 TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 MIL-STD-202 Method 304 At +25/–55 °C and +25/+125 °C REQUIREMENTS Refer to table 2 Formula: R2–R1 T.C.R= ------------------------×106 (ppm/°C) R1(t2–t1) Where t1=+25 °C or specified room temperature t2=–55 °C or +125 °C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Life/Endurance IEC 60115-1 4.25 MIL-STD-202 Method 108 At 70±2 °C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still-air required ±(1.0%+0.05 Ω) High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202 Method 108 1,000 hours at 125±3℃ (0201), 155±3℃ (other sizes), unpowered. ±(1.0%+0.05 Ω) for 0.5%, 1% tol. Moisture Resistance MIL-STD-202 Method 106 ±(1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Thermal Shock <100 mΩ for Jumper MIL-STD-202 Method 107 –55 / +125 °C Number of cycles required is 300. Devices unmounted Short Time Overload IEC60115-1 4.13 Bending IEC 60115-1 4.33 ±(0.5%+0.05 Ω) for 0.5%, 1% tol. ±(1.0%+0.05 Ω) for 5% tol. <100 mΩ for Jumper ±(0.5%+0.05 Ω) for 0.5%, 1% tol. ±(1%+0.05 Ω) for 5% tol. Maximum transfer time is 20 seconds. Dwell time is 15 minutes <100 mΩ for Jumper 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature ±(1.0%+0.05 Ω) Chips mounted on a 90 mm glass epoxy resin PCB (FR4) ±(1.0%+0.05 Ω) Bending: 0201/0402: 5 mm 0603/0805: 3 mm 1206 & above: 2 mm No visible damage No visible damage <100 mΩ for Jumper Bending time: 60±5 seconds www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 8 9 0201 to 2512 TEST TEST METHOD PROCEDURE REQUIREMENTS Humidity (steady state) IEC 60115-1 4.24 Steady state for 1,000 hours at 40°C / 95% R.H. RCWV applied for 1.5 hours on and 0.5 hour off ±(3.0%+0.05 Ω) IEC 60115-1 4.18 MIL-STD-202 Method 215 Condition B, no pre-heat of samples ±(0.5%+0.05 Ω) for 0.5%, 1% tol. Solderability - Resistance to Soldering Heat - Wetting J-STD-002 Lead-free solder, 260±5 °C, 10±1 seconds immersion time ±(1.0%+0.05 Ω) for 5% tol. Procedure 2 for SMD: devices fluxed and cleaned with isopropanol <50 mΩ for Jumper Electrical test not required Magnification 10X Well tinned (≥95% covered) SMD conditions: No visible damage No visible damage (a) Method B, aging 4 hours at 155 °C dry heat, lead-free solder bath at 245 °C (b) Method B, dipping at 215 °C for 3 seconds FOS ASTM-B-809-95 Sulfur (saturated vapor) 1,000 hours, 90±2 °C, unpowered ±(1.0%+0.05Ω) ASTM-B-809-95* Sulfur 750 hours, 105 °C. unpowered ±(4.0%+0.05Ω) * Modified www.yageo.com Apr. 01, 2015 V.3 Product specification Chip Resistor Surface Mount AF SERIES 9 9 0201 to 2512 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 3 Mar. 31, 2015 - - Modified test and requirements Version 2 Nov. 20, 2014 - - Tests and requirement update Version 1 Sep. 27, 2013 - - Size 0201/1210/1218/2010/2512 extend Version 0 Jan 07, 2011 - - First issue of this specification “ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN.” www.yageo.com Apr. 01, 2015 V.3