Wireless Components Ceramic Chip Antenna 2.4 and 5

DATA SHEET
WIRELESS COMPONENTS
Ceramic Chip Antenna
ANT1003LL05R2455A
2.4 AND 5 GHZ
Product Specification – February 19, 2013 V.0
1003 Series
Product specification
WIRELESS COMPONENTS
FEATURES
 Compact size
 Omni-directional radiation
 Dual-band design
 Tape & reel automatic
mounting
 Reflow process compatible
 RoHS compliant
2
2
Ceramic Chip Antenna
ORDERING INFORMATION
All part numbers are identified by the series, packing type, material, size,
antenna type, working frequency and packing quantity.
PART NUMBER
ANT 1003 L
(1)
(2)
L05 R 2455A
(3)
(4)
(5)
(6)
(1) PRODUCT
APPLICATIONS
2.4 & 5 GHz WiFi device
 ISM band equipment

ANT = Antenna
(2) SIZE
1003 = 10 × 3 mm
(3) ANTENNA TYPE
L,F,A=Chip Antenna
(4) SERIAL NO.
L05
(5) PACKING STYLE
R = Tape and Reel
(6) WORKING FREQUENCY
2455 = 2.4/5 GHz
PHYCOMP CTC
CAN4311756052521K
12NC
431175605252
www.yageo.com
Feb. 19, 2013 V0
Product specification
WIRELESS COMPONENTS
3
3
Ceramic Chip Antenna
SPECIFICATION
Table 1
VALUE
DESCRIPTION
Centre Frequency
2.45/5 GHz
Bandwidth
120/900 MHz (Typ.)
Return Loss
6.5 dB min
Polarization
Linear
Azimuth Beamwidth
Omni-directional
Peak Gain
2.50/ 2.48 dBi ( Typ. )
Impedance
50 Ω
Operating Temperature
-40~105 degree
Maximum Power
1W
Termination
Ag (Environmentally-Friendly Leadless)
Resistance to Soldering Heats
260℃ , 10sec.
NOTE
1. The specification is defined on Yageo evaluation board
DIMENSIONS
Table 2 Machinical Dimension
DIMENSION
L (mm)
10.00 ± 0.20
W (mm)
3.20 ± 0.20
T (mm)
1.60 ± 0.20
A (mm)
1.20 ± 0.10
OUTLINES
Top View
Side View
L
T
W
Bottom View
A
A
S1
S2
YNH00112
Table 3 Termination configuration
TERMINAL NAME
FUNCTION
S1
Feeding Point
S2
Soldering Point
Fig. 1 Antenna outlines
www.yageo.com
Feb. 19, 2013 V0
Product specification
WIRELESS COMPONENTS
4
4
Ceramic Chip Antenna
REFERENCE DESIGN OF EVALUATION BOARD
88
38
Unit : mm
Fig. 2 Outlook and dimension of evaluation board
Top Layer
Bottom Layer / GND
Unit : mm
0.4
0.2
0.8
1.7
Matching Circuit
3.2
6.0
1.7
7.4
11.6
YNH00113
Fig. 3 Details of soldering pad
www.yageo.com
Feb. 19, 2013 V0
Product specification
WIRELESS COMPONENTS
Ceramic Chip Antenna
5
5
ELECTRICAL PERFORMANCES
Return loss
(dB)
YNH00114
50
30
10
3
−10
1 2
4
5
6
−30
−50
2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 6.0
f (GHz)
Marker data
1.
2.
3.
4.
5.
6.
2.40GHz , -12.5dB
2.45GHz , -12.4dB
2.484GHz , -9.5dB
5.15GHz , -8.7dB
5.50GHz , -13dB
5.86GHz , -10dB
Fig. 4 Return loss
www.yageo.com
Feb. 19, 2013 V0
Product specification
WIRELESS COMPONENTS
6
6
Ceramic Chip Antenna
Gain (dBi)
5.00 −
Z axle
0.00 −
− 5.00 −
− 10.00 −
− 15.00 −
− 20.00 −
− 25.00 −
X axle
Y axle
− 30.00 −
X
Z
− 35.00 −
Frequency= 2.45 GHz
Max gain = 2.50dBi, at (120, 0)
MEG (mean effective gain)= -2.43 dBi
Directivity (dB) = 4.15
Efficiency = -1.65dB, 68.41 %
Y
Evaluation board and XYZ direction
Gain (dBi)
5.00 −
Z axle
0.00 −
− 5.00 −
− 10.00 −
− 15.00 −
− 20.00 −
− 25.00 −
X axle
Y axle
− 30.00 −
− 35.00 −
YNH00115
Frequency= 5.47 GHz
Max gain = 2.48 dBi, at (30, 0)
MEG (mean effective gain)= -1.31 dBi
Directivity (dB) = 4.27
Efficiency = -1.79dB, 66.18 %
Fig. 5 Radiation pattern
www.yageo.com
Feb. 19, 2013 V0
Product specification
WIRELESS COMPONENTS
7
7
Ceramic Chip Antenna
REVISION HISTORY
REVISION DATE
CHANGE NOTIFICATION
Version 0
-
Feb. 19, 2013
DESCRIPTION
- New data sheet for SMD type antenna, 2.4/5GHz application,
1003 series
www.yageo.com
Feb. 19, 2013 V0