Data Sheet

ZSSC3016
Low Power 16 Bit Sensor Signal Conditioner IC
Brief Description
Benefits
The ZSSC3016 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3016 can perform offset,
st
nd
span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
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Features
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Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing, twosegment analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
st
nd
1 and 2 order digital compensation of sensor
gain
st
nd
Digital compensation of 1 and 2 order temperature gain and offset drift
Intelligent power management unit
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85 °C
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Support
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Evaluation Kit
Physical Characteristics
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Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 70nA (25°C)
Temperature resolution: <0.003K/LSB
Operation temperature: –40°C to +85 °C
Small die size
Delivery options: die for wafer bonding
ZSSC3016 Application Example
VSS
VDD
VSS
Batte
ry
EOC
VDD
Sensor Module
VDD
EOC
VSS
Sensor
Bridge
SEL
SEL
ZSSC3016
SS
SS
4
VSSB
3
INN
MISO
MISO
2
VDDB
1
INP
MOSI
SDA
MOSI_SDA
VPP
Microcontroller
Signal Output /
Post-processing
The measured and corrected bridge values are
provided at the digital output pins, which can be
2
configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory.
Programming the ZSSC3016 is simple via the serial
interface and the PC-controlled calibration software
provided in the ZMDI Development Kit. The interface
is used for the PC-controlled calibration procedure,
which programs the set of calibration coefficients in
memory. The digital mating is fast and precise,
eliminating the overhead normally associated with
trimming external components and multi-pass
calibration routines.
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Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Minimize calibration costs through the one-pass
calibration concept
No external trimming components required
Highly integrated CMOS design
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Excellent for low-voltage and low-power battery
applications
SCLK
SCL
SCLK_SCL
VPP
6.75V … programming
voltage for setup & calibration
* I2C™ is a trademark of NXP.
For more information, contact ZMDI via [email protected]
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated,
stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
ZSSC3016
Low Power 16 Bit Sensor Signal Conditioner IC
ZSSC3016 Block Diagram
Applications
The ZSSC3016 is designed for operation in calibrated resistive (e.g., pressure) sensor modules:
 Barometric altitude measurement for portable
navigation
 Altitude measurement for emergency call
systems and car navigation
 Inside hard disk pressure measurement
 Weather forecast
 Fan control
Ordering Information (Contact ZMDI Sales for additional options.)
Ordering Examples
Description
Package
ZSSC3016CC1B
Temperature range: –40°C to +85°C, consumer-level parameters
according to section 1 of the data sheet
ZSSC3016CI1B
Temperature range: –40°C to +85°C, industrial-level parameters according Wafer (304µm) unsawn
to section 1 of the data sheet, 10 years MTP data retention
ZSSC3016CI1D ES
Engineering samples, temperature range: –40°C to +85°C
Dice in waffle pack
ZSSC3016KIT
ZSSC3016 Evaluation Kit, including sample and modular evaluation board
(Evaluation Software is downloadable from www.zmdi.com/zssc3016)
Kit
Sales and Further Information
www.zmdi.com
Wafer (304µm) unsawn
[email protected]
Zentrum Mikroelektronik
Dresden AG
Global Headquarters
Grenzstrasse 28
01109 Dresden, Germany
ZMD America, Inc.
1525 McCarthy Blvd., #212
Milpitas, CA 95035-7453
USA
Central Office:
Phone +49.351.8822.306
Fax
+49.351.8822.337
USA Phone 1.855.275.9634
Phone +1.408.883.6310
Fax
+1.408.883.6358
European Technical Support
Phone +49.351.8822.7.772
Fax
+49.351.8822.87.772
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The
information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,
licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or
in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any
customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for
any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,
tort (including negligence), strict liability, or otherwise.
European Sales (Stuttgart)
Phone +49.711.674517.55
Fax
+49.711.674517.87955
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +81.3.6895.7410
Fax
+81.3.6895.7301
Phone +886.2.2377.8189
Fax
+886.2.2377.8199
Zentrum Mikroelektronik
Dresden AG, Korea Office
U-space 1 Building
11th Floor, Unit JA-1102
670 Sampyeong-dong
Bundang-gu, Seongnam-si
Gyeonggi-do, 463-400
Korea
Phone +82.31.950.7679
Fax
+82.504.841.3026
© 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014.
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.