ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Brief Description Benefits The ZSSC3016 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3016 can perform offset, st nd span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. Features Flexible, programmable analog front-end design; up to 16-bit scalable, charge-balancing, twosegment analog-to-digital converter (ADC) Fully programmable gain amplifier for optimizing sensor signals: gain range 14 to 72 (linear factor) Internal auto-compensated temperature sensor Digital compensation of individual sensor offset; st nd 1 and 2 order digital compensation of sensor gain st nd Digital compensation of 1 and 2 order temperature gain and offset drift Intelligent power management unit Typical sensor elements can achieve accuracy of better than ±0.10% FSO @ -40 to 85 °C Support Evaluation Kit Physical Characteristics Supply voltage range: 1.8 to 3.6V Current consumption: 1mA (operating mode) Sleep State current: 70nA (25°C) Temperature resolution: <0.003K/LSB Operation temperature: –40°C to +85 °C Small die size Delivery options: die for wafer bonding ZSSC3016 Application Example VSS VDD VSS Batte ry EOC VDD Sensor Module VDD EOC VSS Sensor Bridge SEL SEL ZSSC3016 SS SS 4 VSSB 3 INN MISO MISO 2 VDDB 1 INP MOSI SDA MOSI_SDA VPP Microcontroller Signal Output / Post-processing The measured and corrected bridge values are provided at the digital output pins, which can be 2 configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory. Programming the ZSSC3016 is simple via the serial interface and the PC-controlled calibration software provided in the ZMDI Development Kit. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The digital mating is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines. Integrated 18-bit calibration math DSP Fully corrected signal at digital output Minimize calibration costs through the one-pass calibration concept No external trimming components required Highly integrated CMOS design Layout customized for die-die bonding with sensor for high-density chip-on-board assembly Excellent for low-voltage and low-power battery applications SCLK SCL SCLK_SCL VPP 6.75V … programming voltage for setup & calibration * I2C™ is a trademark of NXP. For more information, contact ZMDI via [email protected] © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC ZSSC3016 Block Diagram Applications The ZSSC3016 is designed for operation in calibrated resistive (e.g., pressure) sensor modules: Barometric altitude measurement for portable navigation Altitude measurement for emergency call systems and car navigation Inside hard disk pressure measurement Weather forecast Fan control Ordering Information (Contact ZMDI Sales for additional options.) Ordering Examples Description Package ZSSC3016CC1B Temperature range: –40°C to +85°C, consumer-level parameters according to section 1 of the data sheet ZSSC3016CI1B Temperature range: –40°C to +85°C, industrial-level parameters according Wafer (304µm) unsawn to section 1 of the data sheet, 10 years MTP data retention ZSSC3016CI1D ES Engineering samples, temperature range: –40°C to +85°C Dice in waffle pack ZSSC3016KIT ZSSC3016 Evaluation Kit, including sample and modular evaluation board (Evaluation Software is downloadable from www.zmdi.com/zssc3016) Kit Sales and Further Information www.zmdi.com Wafer (304µm) unsawn [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. 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European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building 11th Floor, Unit JA-1102 670 Sampyeong-dong Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.