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TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 3.2x2.5 26.0MHz
MODEL NO.: TZ1387A
REV. NO.: 6
Revise:
Rev.
Rev.
Page
Rev. Account
Date
Ref. No.
Revised by
1
2
3
4
5
6
N/A
3
3
5
3
4
Initial release
Spec. updated
Spec. updated
Changed T/R drawing
ESR change to 30ohm
Add base 2 drawing
05/15/08
09/04/08
12/05/08
07/01/09
07/27/09
4/29/10
N/A
N/A
N/A
ECN-200900240
ECN-200900328
ECN-201000161
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
Ann Liu
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
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TAI-SAW TECHNOLOGY CO., LTD.
Crystal Unit SMD 3.2x2.5 26.0MHz
MODEL NO.: TZ1387A
REV. NO.: 6
Features:
RoHS Compliant
Lead free
Lead-free soldering
Surface Mount Hermetic Package
Excellent Reliability Performance
Good Frequency Perturbation and Stability over temperature
Ultra Miniature Package
Description and Applications:
Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices,
especially for a need of ultra miniature package for mobility.
Electrical Specifications:
TZ1387A
Specification
Nominal Frequency
26.000000 MHz
Mode of Oscillation
Fundamental
Storage Temperature Range
-40°C to +85°C
Operating Temperature Range
-20°C to +85°C
Frequency Stability over Operating
Temperature Range
+/-10 ppm (referred to the value at 25°C)
Frequency Make Tolerance (FL)
+/-10 ppm @ 25°C +/- 3°C
Equivalent Series Resistance (ESR)
30 Ω max
Nominal Drive Level
100 uW max.
Motional Capacitance (C1)
3.3 fF
Shunt Capacitance (Co)
0.8+/-20%
Load Capacitance (CL)
11.2 pF
Trim Sensitivity (TS)
10.3 +/-20% ppm/pF
Insulation Resistance
500 MΩ min./DC 100V
Aging
+/-1ppm/year
Marking
Laser Marking
Unit Weight
0.017+/-0.005 g
+/- 10%
pF
TAI-SAW TECHNOLOGY CO., LTD.
(Load @ 11.2pF)
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Mechanical Dimensions (mm):
Base 1
#1 pin
#2 pin
#3 pin
#4 pin
Pin Connection
IN/OUT
GND
IN/OUT
GND
Base 2
Recommended Land Pattern: (unit: mm)
Marking:
Line 1: Frequency (26.00)
Line 2: TST Logo + Crystal Product Code + Date Code
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Product Code Table
Date Code Table
WK01
WK02
WK03
WK04
WK05
WK06
WK07
WK08
WK09
WK10
WK11
WK12
A
B
C
D
E
F
G
H
I
J
K
L
WK13
M
WK14
WK15
WK16
WK17
WK18
WK19
WK20
WK21
WK22
WK23
WK24
WK25
WK26
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
WK27
WK28
WK29
WK30
WK31
WK32
WK33
WK34
WK35
WK36
WK37
WK38
WK39
a
b
c
d
e
f
g
h
i
j
k
l
m
WK40
WK41
WK42
WK43
WK44
WK45
WK46
WK47
WK48
WK49
WK50
WK51
WK52
n
o
p
q
r
s
t
u
v
w
x
y
z
Reel Dimensions (mm):
TAI-SAW TECHNOLOGY CO., LTD.
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Tape Dimensions (mm):
[NOTE]
1
UNIT : mm.
2
UNLESS OTHERWISE SPECIFIED TOLERANCEON DIM. +/-0.1mm.
3
MATERIAL : CONDUCTIVE POLYSTYRENE.
4
COLOR : BLACK.
5
10 PITCHES CUMULATIVETOLERANCE +/-0.2mm.
Packing Quantity/Packing:
3K pcs maximum per reel
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
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Reflow Profile:
Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
2. Temperature: 217+/-5 deg C; Time: 90~100 sec
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
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Reliability Specifications
Test name
Reference
standard
Test process / method
Mechanical characteristics
resistance to
Soldering heat
(IR reflow)
Temp./ Duration : 260°C /10sec ×2 times
Total time : 4min.(IR-reflow)
Vibration
Total peak amplitude : 1.5mm
Vibration frequency
: 10 to 55 Hz
Sweep period
: 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration
: 2 hr / direc.
directions : 3 impacts per axis
Acceleration : 3000g's, +20/-0 %
Duration
: 0.3 ms (total 18 shocks)
Waveform : Half-sine
Solder Temperature:265±5°C
Duration time: 5±0.5 seconds.
Mechanical
Shock
Solderability
EIAJED-4701
-300(301)M(II)
MIL-STD 202F
method 201A
MIL-STD 202F
method 213C
MIL-STD 883G
method 2003
Environmental characteristics
Thermal Shock
Humidity test
Dry heat
( Aging test )
PCT test
Heat cycle conditions
-55 ℃ (30min) ←→
* cycle time : 10 times
125 ℃ (30min)
Temperature : 70 ± 2 °C
Relative humidity : 90~95%
Duration
: 96 hours
Temperature : 125 ± 2 °C
Duration
: 168 hours
2
MIL-STD 883G
method 1010.7
MIL-STD 202F
method 103B
5
Pressure: 2.06kg/cm (2.03*10 pa)
Temperature : 121 ± 2 °C
Relative humidity : 100%
Duration
: 24 hours
TAI-SAW TECHNOLOGY CO., LTD.
MIL-STD 883G
method 1008.2
condition C
EIAJED-4701-3
B-123A
TST DCC
Release document