P320h HHHL PCIe NAND SSD

P320h HHHL PCIe NAND SSD
Features
P320h Half-Height and Half-Length PCIe
NAND Flash SSD
MTFDGARxxxSAH-1Nxxx
Features
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Micron® SLC NAND Flash (34nm)
ONFI 2.1-compliant Flash Interface
PCIe Gen2 x8 host interface
Capacity:1 350GB, 700GB
Endurance (total bytes written)2, 3
– 350GB: 25PB (4KB random write),
50PB (128KB sequential write)
– 700GB: 50PB (4KB random write),
100PB (128KB sequential write)
Temperature
– Operating: 0°C to +85°C4
– Storage (in system): 0°C to +40°C5
– Storage (on shelf): –40°C to +85°C5
– Temperature throttling support
ATA modes supported
– PIO modes 3 and 4
– Multiword DMA modes 0, 1, 2
– Ultra DMA modes 0, 1, 2, 3, 4, 5, 6
– ATA8-ACS2 command set support
– ATA security feature command set and password
login support
Industry-standard 512-byte sector size support
Full end-to-end data protection
Native command queuing up to 256 commands
Bootable6
Power: 25W RMS
Random read/write (steady state) performance at
25W7
– Random read: Up to 785,000 IOPS (4KB)
– Random write: Up to 205,000 IOPS (4KB)
Sequential read/write (steady state) performance at
25W7
– Sequential read: Up to 3.2 GB/s (128KB)
– Sequential write: Up to 1.9 GB/s (128KB)
Latency (queue depth = 1)7
– READ latency: <47µs
– WRITE latency: <311µs (nonposted)
Custom drivers
– Windows Server 2012 R2 (x86-64), Hyper-V
(x86-64)
– Windows Server 2012 (x86-64), Hyper-V (x86-64)
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– Windows Server 2008 R2 SP1 (x86-64), Hyper-V
(x86-64)
– Windows 8, 8.1 (x86-64 and x86)
– Windows 7 (x86-64 and x86)
– RHEL 5.5–5.10, 6.0–6.5, 7 (x86-64)
– SLES 11 SP1, SP2, SP3 (x86-64)
– VMware 5.0, 5.1 (x86-64)
– VMware 5.5 (inbox driver)
– Citrix XenServer 6.0.2, 6.1, 6.2
– Ubuntu 12.04–12.04.4, 14.04 LTS Server (64-bit)
Reliability
– MTTF: 2 million hours
– Static and dynamic wear leveling
– Field-upgradable firmware
– Uncorrectable bit error rate (UBER): <1 sector
per 1017 bits read
Micron RAIN (redundant array of independent
NAND) technology
SMART command set support
On-chip temperature monitoring
Mechanical/electrical
– 68.90mm x 167.65mm x 18.71mm
– PCIe-compliant, x8 lane PCB connector
– 12V power (±8%)
– Weight: 350GB – 127.2g; 700GB – 135.3g
Shock: 400g at 2ms
Vibration: 3.1 grms 5–500Hz at 30 min/axis
RoHS-compliant
Notes:
1
1. User capacity: 1GB = 1 billion bytes.
2. Lifetime endurance is measured not in
years, but in the number of bytes that can
be written to the device.
3. Workloads are 100% writes.
4. Operating temperature is the drive case
temperature as measured by the SMART
temperature attribute.
5. Assumes system is powered off and ready to
be powered on.
6. Bootable option determined by part number; see Part Numbering Information
(page 2). Boot ability may not be compatible on some systems.
7. Values vary by capacity. See Performance
Specifications (page 4) for details.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
P320h HHHL PCIe NAND SSD
Features
Part Numbering Information
The Micron® P320h SSD is available in different configurations and densities. Visit www.micron.com for a list of
valid part numbers.
Figure 1: Part Number Chart
MT FD
G
AR 350
S AH – 1
N
A
4
AB ES
Production Status
Micron Technology
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Product Family
FD = Flash drive
Hardware Feature Set
AB = Contact factory
Drive Interface
G = PCIe Gen2
Security Feature Set
Blank = Default
4 = Bootable
Drive Form Factor
AR = Half height, half length, x8
BOM Revision
1 = First generation
A to Z = ES designation
Device Density
350 = 350GB
700 = 700GB
NAND Component
N = 16Gb, SLC, x8, 3.3V (34nm)
NAND Flash Type
Sector Size
S = SLC
1 = 512 byte
Flash Drive Product Family
AH = P320H
Warranty: Contact your Micron sales representative for further information regarding the product,
including product warranties.
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© 2011 Micron Technology, Inc. All rights reserved.
P320h HHHL PCIe NAND SSD
General Description
General Description
Micron's P320h solid state drive (SSD) is targeted at applications that require high performance and enterprise-class storage reliability. The P320h delivers extremely high
IOPS performance due to its ability to support up to 256 outstanding commands while
ensuring full end-to-end data protection.
The P320h comes in a half-height, half-length (HHHL) form factor and uses a secondgeneration (Gen2) PCIe x8 lane interface on the host side and 32 ONFI 2.1-compliant
channels on the Flash side.
Figure 2: Functional Block Diagram
NAND
NAND
NAND
NAND
NAND
NAND
NAND
NAND
32 channels, 64 placements of NAND memory
NAND
NAND
NAND
NAND
NAND
NAND
NAND
NAND
Controller
DDR3
DRAM
NAND Storage
PCIe x 8 edge
connector
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P320h HHHL PCIe NAND SSD
Architecture
Architecture
The single-chip, Micron-developed ASIC controller, along with the host and Flash interfaces, provide an embedded ATA host bus adapter, a host/Flash translation layer, Flash
maintenance, channel control, and Flash RAID (RAIN) protection.
Flash endurance and reliability are optimized through the Flash maintenance features,
including static and dynamic wear leveling and RAIN protection. Most of these functions are implemented directly within the controller hardware to optimize performance. The device is shipped in the configurations shown below.
Table 1: P320h HHHL Configurations
User Capacity
NAND Flash Process
NAND Flash Density
Package Count
Die per BGA Package
350GB
34nm
16Gb
64
4
700GB
34nm
16Gb
64
8
Performance Specifications
Table 2: Performance Specifications
Specification
350GB
700GB
Sequential read (up to)
3.2 GB/s
3.2 GB/s
Sequential write (up to)
1.9 GB/s
1.9 GB/s
Random read (up to)
785,000 IOPS
785,000 IOPS
Random write (up to)
175,000 IOPS
205,000 IOPS
READ latency
<47µs
<47µs
WRITE latency
<311µs (nonposted)
<311µs (nonposted)
Notes:
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1. Transient peaks above 25W are possible under heavy write workloads. 10ms RMS average measurements taken.
2. Drive is erased and filled with zeroes to achieve preconditioned state .
3. 128KB transfers are used for sequential read/write values; 4KB transfers are used for
random read/write values.
4. I/O performance numbers are measured in steady state using FIO with a preconditioned
drive under RHEL 6.3 with a queue depth of 256 and with raw device access on systems
with a single Intel Xeon E5-2667 2.90 GHz processor with 6 cores, 12 logical and hyperthreading enabled.
5. Steady state performance is defined as conforming to the SNIA V1.0 Performance Test
Specification.
6. Performance numbers derived from tests at room temperature.
7. Latency performance numbers are measured using FIO with queue depth 1, random
transfer, 512-byte transfer size for READ latency, 4KB transfer size for WRITE latency.
8. Performance numbers are notated in base 10.
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© 2011 Micron Technology, Inc. All rights reserved.
P320h HHHL PCIe NAND SSD
Functional Description
Functional Description
Data Retention
Data retention refers to the SSD's media (NAND Flash) capability to retain programmed
data when the SSD is powered off. The two primary factors that influence data retention
are degree of use (the number of PROGRAM/ERASE cycles on the media) and temperature.
Degree of use: As NAND Flash is used (programmed and erased), its natural ability to
retain charge (programmed data) decreases. When the SSD ships from the factory, it is
typically able to retain user data for up to 10 years when powered off. As the SSD is used,
this typically decreases to one year.
Temperature: As the temperature increases, data retention decreases.
Note: All data retention related to values in the data sheet are with the SSD powered off.
When the SSD is powered on, data retention is expected to exceed these limits. Micron
SSD data retention with power removed is one year at 40°C (MAX).
Micron RAIN Technology
Redundant array of independent NAND (RAIN) is a technology developed by Micron
designed to extend the lifespan of the P320h.
Residing in the P320h ASIC controller, RAIN is similar to redundant array of independent disks (RAID) technology, but instead of grouping and striping disks, RAIN groups
and stripes storage elements on the SSD across multiple channels, generating and storing parity data along with user data (one page of parity for every seven pages of user
data). This data structure (user data plus parity) enables complete, transparent data recovery if a single storage element (NAND page, block, or die) fails. If a failure occurs, the
P320h automatically detects it and transparently rebuilds the data. During this RAIN rebuild process, the drive's performance is reduced temporarily but will recover after the
rebuild process completes.
Wear Leveling
Wear leveling is a technique that spreads Flash block use over the entire memory array
to equalize the PROGRAM/ERASE cycles on all blocks in the array. This helps to enhance the lifespan of the SSD. The P320h supports both static and dynamic wear leveling.
Static wear leveling considers all Flash blocks in the SSD regardless of data content or
access and maintains an even level of wear across the drive. Dynamic wear leveling
monitors available free space on the drive and dynamically moves data between Flash
blocks to equalize wear on each block. Both techniques are used together within the
controller to optimally balance the wear profile of the Flash array along with the drive's
lifespan.
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P320h HHHL PCIe NAND SSD
SMART Attribute Summary
SMART Attribute Summary
Table 3: SMART Command Reference1
Attribute ID
Hex ID
Name
SMART Trip
Description
9
0x09
Power-on hours count
No
Lifetime powered-on hours, from the time the
device leaves the factory
12
0x0C
Power cycle count
No
Count of power cycles
170
0xAA
New failing block
count
No
Grown defects
171
0xAB
Program fail count
No
Number of NAND program status failures
172
0xAC
Erase fail count
No
Number of NAND erase status failures
174
0xAE
Unexpected power loss
count
No
Number of unexpected power-loss occurrences
187
0xBB
Reported uncorrectable errors count
No
Number of ECC correction failures
188
0xBC
Command timeout
count
No
Number of command timeouts, defined by an
active command being interrupted by a HRESET,
COMRESET, SRST, or other command
194
0xC2
Temperature
No
The on-die temperature sensor within the controller ASIC in degrees C, capturing the lifetime
high and low temperatures measured
202
0xCA
Percentage of the rated lifetime used
No
Cumulative erase count / lifetime erase count as
expressed as a percent. Lifetime erase count is
the total number of available blocks * block endurance for the flash technology, read directly
from the NAND device.
232
0xE8
Available reserved
space
No
Percentage of spare blocks remaining
Spare block count
241
0xF1
Power-on (minutes)
No
Lifetime power-on time in minutes
242
0xF2
Write protect progress
No
Progress toward WRITE PROTECT mode: reports
100% when the drive becomes read only
Note:
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1. Attribute/Hex IDs are noted for distribution product. Specific OEMs may have different
ID values, but the same list of SMART commands applies.
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P320h HHHL PCIe NAND SSD
Logical Block Address Configuration
Logical Block Address Configuration
The number of logical block addresses (LBAs) reported by the P320h ensures sufficient
storage space for the specified capacity. Standard LBA settings based on the IDEMA
standard (LBA1-02) are shown below.
Table 4: Standard LBA Settings
Total LBA
Capacity
Decimal
Hexadecimal
Decimal
Hexadecimal
User Available
Bytes (Unformatted)
350GB
683,747,568
28C128F0
683,747,567
28C128EF
350,078,754,816
700GB
1,367,473,968
5181FF30
1,367,473,967
5181FF2F
700,146,671,616
Note:
Max LBA
1. Note: 1GB = 1 billion bytes; user capacity.
Physical Configuration
Table 5: Nominal Dimensions and Weight
Specification
Value
Unit
Height
68.90
mm
Width
18.71
mm
Length
167.65
mm
Unit weight (HH bracket)
350GB: 127.2
700GB: 135.3
g
Unit weight (FH bracket)
350GB: 132.3
700GB: 140.4
g
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P320h HHHL PCIe NAND SSD
Interface Connectors
Interface Connectors
The host interface connector conforms to the PCIe Electromechanical Specification
V2.0, section 5, Table 5-1. It is an eight-lane, gold-finger connector with 1mm pitch
spacing.
A mechanical indent is used to separate the PCIe power pins from the differential signal
contacts. The pins are numbered below in ascending order from left to right. Side B refers to component side and Side A refers to the solder side.
Table 6: PCIe Interface Connector Pin Assignments
Side B
Side A
Pin
Number
Name
Description
Name
Description
1
+12V
12V power
PRSNT1#
Hot Plug Presence Detect
2
+12V
12V power
+12V
12V power
3
+12V
12V power
+12V
12V power
4
GND
Ground
GND
Ground
5
SMCLK
DNU
JTAG2
DNU
6
SMDAT
DNU
JTAG3
DNU
7
GND
Ground
JTAG4
DNU
8
+3.3V
DNU
JTAG5
DNU
9
JTAG1
DNU
+3.3V
DNU
10
3.3Vaux
DNU
+3.3V
DNU
11
WAKE#
DNU
PERST#
PCIe Reset
12
RSVD
Reserved
GND
Ground
13
GND
Ground
REFCLK+
PCIe REFCLK p
14
PETp0
PCIe TX Lane 0 p
REFCLK-
PCIe REFCLK n
15
PETn0
PCIe TX Lane 0 n
GND
Ground
Mechanical Key
16
GND
Ground
PERp0
PCIe RX Lane 0 p
17
PRSNT2#
Hot Plug Presence Detect
PERn0
PCIe RX Lane 0 n
18
GND
Ground
GND
Ground
19
PETp1
PCIe TX Lane 1 p
RSVD
Reserved
20
PETn1
PCIe TX Lane 1 n
GND
Ground
21
GND
Ground
PERp1
PCIe RX Lane 1 p
22
GND
Ground
PERn1
PCIe RX Lane 1 n
23
PETp2
PCIe TX Lane 2 p
GND
Ground
24
PETn2
PCIe TX Lane 2 n
GND
Ground
25
GND
Ground
PERp2
PCIe RX Lane 2 p
26
GND
Ground
PERn2
PCIe RX Lane 2 n
27
PETp3
PCIe TX Lane 3 p
GND
Ground
28
PETn3
PCIe TX Lane 3 p
GND
Ground
29
GND
Ground
PERp3
PCIe RX Lane 3 p
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P320h HHHL PCIe NAND SSD
Interface Connectors
Table 6: PCIe Interface Connector Pin Assignments (Continued)
Side B
Side A
Pin
Number
Name
Description
Name
Description
30
RSVD
Reserved
PERn3
PCIe RX Lane 3 n
31
PRSNT2#
Hot Plug Presence Detect
GND
Ground
32
GND
Ground
RSVD
Reserved
33
PETp4
PCIe TX Lane 4 p
RSVD
Reserved
34
PETn4
PCIe TX Lane 4 n
GND
Ground
35
GND
Ground
PERp4
PCIe RX Lane 4 p
36
GND
Ground
PERn4
PCIe RX Lane 4 n
37
PETp5
PCIe TX Lane 5 p
GND
Ground
38
PETn5
PCIe TX Lane 5 n
GND
Ground
39
GND
Ground
PERp5
PCIe RX Lane 5 p
40
GND
Ground
PERn5
PCIe RX Lane 5 n
41
PETp6
PCIe TX Lane 6 p
GND
Ground
42
PETn6
PCIe TX Lane 6 n
GND
Ground
43
GND
Ground
PERp6
PCIe RX Lane 6 p
44
GND
Ground
PERn6
PCIe RX Lane 6 n
45
PETp7
PCIe TX Lane 7 p
GND
Ground
46
PETn7
PCIe TX Lane 7 n
GND
Ground
47
GND
Ground
PERp7
PCIe RX Lane 7 p
48
PRSNT2#
Hot Plug Presence Detect
PERn7
PCIe RX Lane 7 n
49
GND
Ground
GND
Ground
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P320h HHHL PCIe NAND SSD
PCIe Header
PCIe Header
Figure 3: HHHL PCIe Header
Byte
offset
0
31
Device ID = 5150h
Vendor ID = 1344h
00h
Status
Command
04h
Class code = 018000h
BIST
Header type = 00h
Master latency timer
Revision ID = 03h
08h
Cache line size
0Ch
~
~
~
~
Subsystem ID = 12xxh (350GB)
Subsystem ID = 22xxh (700GB)
Note:
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Subsystem vendor ID = 1344h
2Ch
1. Standard Distribution Subsystem ID is 1200h for 350GB and 2200h for 700GB. A nonzero value for xx indicates an OEM product.
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P320h HHHL PCIe NAND SSD
Commands
Commands
Table 7: Supported ATA Command Set
See ATA–8 ACS–2 specification for command details
Commands
ATA Protocol
CMD Code
Feature Codes
CHECK POWER MODE
ND
0xE5
–
DEVICE CONFIGURATION FREEZE LOCK
ND
0xB1
0xC1
DEVICE CONFIGURATION IDENTIFY
PI
0xB1
0xC2
DEVICE CONFIGURATION RESTORE
ND
0xB1
0xC0
DEVICE CONFIGURATION SET
PO
0xB1
0xC3
DOWNLOAD MICROCODE
PO
0x92
–
EXECUTE DEVICE DIAGNOSTIC
DD
0x90
–
FLUSH CACHE
ND
0xE7
–
FLUSH CACHE EXT
ND
0xEA
–
IDENTIFY DEVICE
PI
0xEC
–
IDLE
ND
0xE3
–
IDLE IMMEDIATE
ND
0xE1
–
INITIALIZE DEVICE PARAMETERS
ND
0x91
–
PI
0xE4
–
READ DMA
DM
0xC8
–
READ DMA WO RETRIES
DM
0xC9
–
READ BUFFER
READ DMA EXT
PI
0x25
–
NCQ
0x60
–
READ LOG EXT
PI
0x2F
–
READ MULTIPLE
PI
0xC4
–
READ FPMDA QUEUED
READ MULTIPLE EXT
PI
0x29
–
READ NATIVE MAX ADDRESS
ND
0xF8
–
READ NATIVE MAX ADDRESS EXT
ND
0x27
–
READ SECTORS
PI
0x20
–
READ SECTORS WO RETRIES
PI
0x21
–
READ SECTORS EXT
PI
0x24
–
READ VERIFY SECTORS
ND
0x40
–
READ VERIFY SECTORS WO RETRIES
ND
0x41
–
READ VERIFY SECTOR EXT
ND
0x42
–
RECALIBRATE
ND
0x1x
–
SECURITY DISABLE PASSWORD
PO
0xF6
–
SECURITY ERASE PREPARE
ND
0xF3
–
SECURITY ERASE UNIT
PO
0xF4
–
SECURITY FREEZE LOCK
ND
0xF5
–
SECURITY SET PASSWORD
PO
0xF1
–
SECURITY UNLOCK
PO
0xF2
–
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P320h HHHL PCIe NAND SSD
Commands
Table 7: Supported ATA Command Set (Continued)
See ATA–8 ACS–2 specification for command details
Commands
ATA Protocol
CMD Code
Feature Codes
SEEK
ND
0x7x
–
SET FEATURES
ND
0xEF
VARIOUS
SET MAX ADDRESS
ND
0xF9
0x00
SET NATIVE MAX ADDRESS EXT
ND
0x37
–
SET MAX SET PASSWORD
ND
0xF9
0x01
SET MAX LOCK
ND
0xF9
0x02
SET MAX FREEZE LOCK
ND
0xF9
0x04
SET MAX UNLOCK
ND
0xF9
0x03
SET MULTIPLE MODE
ND
0xC6
–
SLEEP
ND
0xE6
–
SMART DISABLE OPERATIONS
ND
0xB0
0xD9
SMART ENABLE/DISABLE AUTOSAVE
ND
0xB0
0xD2
SMART ENABLE OPERATIONS
ND
0xB0
0xD8
SMART EXECUTE OFF–LINE IMMEDIATE
ND
0xB0
0xD4
SMART READ DATA / READ ATTRIBUTE
VALUES
PI
0xB0
0xD0
SMART READ LOG
PI
0xB0
0xD5
SMART RETURN STATUS
ND
0xB0
0xDA
SMART WRITE LOG
PO
0xB0
0xD6
SMART READ ATTRIBUTE/WARRANTY
THRESHOLDS
PI
0xB0
0xD1
STANDBY
ND
0xE2
–
STANDBY IMMEDIATE
ND
0xE0
–
WRITE BUFFER
PO
0xE8
–
WRITE DMA
DM
0xCA
–
WRITE DMA WO RETRIES
DM
0xCB
–
WRITE DMA EXT
DM
0x35
–
WRITE DMA FUA EXT
DM
0x3D
–
WRITE FPDMA QUEUED
NCQ
0x61
–
WRITE LOG EXT
PO
0x3F
–
WRITE MULTIPLE
PO
0xC5
–
WRITE MULTIPLE EXT
PO
0x39
–
WRITE MULTIPLE FUA EXT
PO
0xCE
–
WRITE SECTORS
PO
0x30
–
WRITE SECTORS WO RETRIES
PO
0x31
–
WRITE SECTORS EXT
PO
0x34
–
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P320h HHHL PCIe NAND SSD
Reliability
Reliability
Micron’s SSDs incorporate advanced technology for defect and error management.
They use various combinations of hardware-based error correction algorithms and
firmware-based static and dynamic wear-leveling algorithms.
Over the life of the SSD, uncorrectable errors may occur. An uncorrectable error is defined as data that is reported as successfully programmed to the SSD but when it is read
out of the SSD, the data differs from what was programmed.
Table 8: Uncorrectable Bit Error Rate
Uncorrectable Bit Error Rate
1 sector per
1017
Operation
bits read
READ
Mean Time to Failure
The mean time to failure (MTTF) for the device can be predicted based on the component reliability data using the methods referenced in the Telcordia SR-322 reliability
prediction procedures for electronic equipment.
Table 9: MTTF
Capacity
MTTF (Operating Hours)
350GB
2 million
700GB
Endurance
Endurance for the device can be predicted based on the usage conditions applied to the
device, the internal NAND component PROGRAM/ERASE cycles, the write amplification factor, and the wear-leveling efficiency of the drive. The table below shows the
drive lifetime for each SSD density based on predefined usage conditions. The SSD implements wear leveling in hardware to optimize performance and efficiency while
maintaining Flash endurance.
Table 10: Drive Lifetime
Capacity
350GB
700GB
Workload
Total Bytes Written
Drive Fills Per Day
Retention
4KB random writes
25PB
39
1 year
128KB sequential writes
50PB
78
1 year
4KB random writes
50PB
39
1 year
128KB sequential writes
100PB
78
1 year
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P320h HHHL PCIe NAND SSD
Electrical and Environmental Characteristics
Electrical and Environmental Characteristics
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 11: Operating Voltage and Power
Electrical Characteristic
Value
Voltage requirement
+12Vdc (±8%)
Active power
25W RMS
Standby power (idle)
10W
Table 12: Environmental Conditions
Temperature and Airflow
Min
Max
Unit
Notes
Operating temperature (as indicated by SMART temperature)
0
85
°C
1
Operating ambient temperature
0
55
°C
2
Storage temperature (in system)
0
40
°C
3
Storage temperature (offline)
–40
85
°C
4
Operating airflow
1.0
–
m/s
5
Notes:
1.
2.
3.
4.
5.
If SMART temperature exceeds 85°C, write performance is throttled.
Temperature of air impinging on the drive.
Assumes system is powered off and ready to be powered on.
Contact Micron for additional information.
Airflow must flow along the length of the drive, parallel to and through any cooling
fins; 1.5m/s operating airflow is recommended.
Table 13: Shock and Vibration
Parameter/Condition
Specification
Shock
400g at 2ms
Vibration
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3.1 grms 5–800Hz at 30 min/axis
14
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P320h HHHL PCIe NAND SSD
Compliance
Compliance
The device complies with the following specifications:
•
•
•
•
•
•
•
•
•
•
•
•
•
RoHS - Restriction of Hazardous Substances
China RoHS
WEEE Waste Electric and Electronic Equipment
Halogen Free - meets IPC low-halogen requirements
CE (Europe) EN55022/EN55024 (Class A)
TUV (Germany) EN60950
UL (US/Canada) EN60950
FCC (US) 47CFR Part 15 Class A
BSMI (Taiwan) CNS 13438 Class A
VCCI (Japan) EN 55022/CISPR 22 Class A
C-TICK (AUS/NZ) CISPR22
ICES (Canada) CISPR22 Class A
KC (Korea) - EN55022/EN55024 Class A, KCC-REM-MU2-P320hHHHL
FCC Rules
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual,
may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.
References
•
•
•
•
•
•
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PCI Express Base Specification V2.1
PCI Express CEM Specification V2.0
ATA8-ACS2 Specification
IDEMA Specification
Telcordia SR-322 Procedures
SNIA Performance Test Specification V1.0
15
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P320h HHHL PCIe NAND SSD
Drive Dimensions
Drive Dimensions
Figure 4: Half-Height, Half-Length Dimensions
11.65
[0.459]
64.40
[2.535]
(MAX)
3.65
[0.144]
167.65
[6.600]
(MAX)
DIA SLOT THRU
68.90
[2.713]
(MAX)
53.90
[2.122]
8.50
[0.335]
8.25
[0.325]
(3 PLCS)
4.85
[0.191]
1.90 ±0.06
[0.075 ±0.002]
DIA SLOT THRU
12.15
[0.478]
49.65
[1.955]
14.47
[0.570]
(MAX)
39.15
[1.541]
15.00
[0.591]
2.67
[0.105]
(MAX)
57.15
[2.250]
59.05 ±0.25
[2.325 ±0.010]
1.20
[0.047]
(NAND)
1.20
[0.047]
(NAND)
Notes:
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1.57
[0.062]
(board)
3.00
[0.118]
(stack clearance)
13.42
[0.528]
3.42
[0.135]
(controller)
1.80
[0.071]
1.00
[0.039]
(DRAM)
1.57
[0.062]
(board)
1. All dimensions are in mm.
2. Board will have a x8 PCIe edge connector.
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
P320h HHHL PCIe NAND SSD
Revision History
Revision History
Rev. V – 8/14
• Updated custom drivers status.
Rev. U – 7/14
• Changed documentation status.
Rev. T – 7/14
• Updated custom drivers list.
Rev. S – 3/14
• Updated Compliance section.
Rev. R – 2/14
• Revised endurance, temperature, shock and vibration specifications.
• Updated list of custom drivers.
• Updated Compliance section.
Rev. Q – 10/13
• Updated temperature specification and note.
• Updated list of custom drivers.
Rev. P – 05/13
• Added VMware ESX 5.0, 5.1 to custom drivers in Features section.
Rev. O – 04/13
• Updated custom drivers in Features section.
Rev. N – 02/13
• Updated Functional Description section.
Rev. M – 01/13
• Added Bootable option to Features section.
Rev. L – 10/12
• Added Windows Server 2012 Hyper-V (x64) to Features section.
Rev. K – 8/12
• Added Performance Specifications section.
• Updated write latency value.
• Changed footnotes and footnote numbering in Features section.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
P320h HHHL PCIe NAND SSD
Revision History
• Added SNIA Performance Test Specification to References section.
Rev. J – 5/12
• Updated Features section.
• Changed ...four-lane, gold-finger connector... to ...eight-lane, gold-finger connector...
in Interface Connectors section.
Rev. I – 4/12
• Removed reference to support for Open source GPL (Kernel Rev. 2.6.25+) from Features section.
Rev. H – 3/12
• Revised specifications.
Rev. G – 1/12
• Revised specifications.
Rev. E – 11/11
• Removed FHHL information.
Rev. D – 11/11
• Revised operating temperature, maximum ratings, and performance data.
Rev. C – 10/11
• Inserted SMART table and a note after references section.
Rev. B – 08/11
• Added half-height, half-length information.
Rev. A – 06/11
• Initial release; Preliminary status.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.