Bcs-u1623 Datasheet

GlobalTop Technology Inc.
Orchid-1
BLE Module
Datasheet (Tape Reel)
Data Sheet
Part Number: Bcs-u1623
Revision: V0H
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior
permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
th
No.16 Nan-ke 9 Rd, Science-Based Industrial Park, Tainan, 741, Taiwan, R.O.C.
Tel: +886-6-5051268 / Fax: +886-6-5053381 / Email: [email protected] /
Web: www.GlobalTop-tech.com
GlobalTop Technology
Orchid-1 Datasheet (Tape Reel)
Document #
Ver. V0H
Version History
Title:
Subtitle:
Doc Type:
Revision
V0A
V0B
V0C
V0D
V0E
V0F
V0G
V0H
GlobalTop Orchid-1 Datasheet (Tape Reel)
BLE Module
Datasheet
Date
Author
Description
2013/11/05
Frank
First Release
2014/02/24
Frank
Modify Temperature Rang
2014/03/19
Yingjie
Add 1.3,2.1.2.2.2.3,2.5
Update Orchid-1 picture
2014/04/25
Dylan
Modify 1.3 System Block Diagram
Modify 4.5 ESD Handling
Modify 5.1 SMT Reflow Soldering
Temperature Profile
2014/05/14
Yingjie
Add 2.8 Operating conditions(UART)
Modify TX,RX current
Modify Power supply
2014/11/04
Yingjie
Remove 2.9 Flow Control
Add 2.10 and 2.11 item
2015/03/03
Dylan
Modified Bluetooth v4.1
2015/03/12
Dylan
Modify moisture coded card
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
2
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Orchid-1 Datasheet (Tape Reel)
Document #
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3
Table of Contents
1. Functional Description ........................................................................................................... 4
1.1 Overview ...................................................................................................................... 4
1.2 System Block Diagram ................................................................................................. 5
1.3 Bluetooth Smart Stacks ................................................................................................ 5
2. Specifications ........................................................................................................................ 6
2.1 Mechanical Dimension ................................................................................................. 6
2.2 Recommended PCB Pad Layout .................................................................................. 7
2.3 Pin Configuration ......................................................................................................... 8
2.4 Pin Assignment ............................................................................................................. 9
2.5 Description of I/O Pin................................................................................................. 10
2.6 Specification ............................................................................................................... 12
2.7 Absolute Maximum Ratings ....................................................................................... 12
2.8 Operating Conditions .................................................................................................. 12
2.9 UART Setting Conditions ........................................................................................... 13
2.10 TX Power vs. HW Configuration Setting ................................................................. 13
2.11 RX/TX Current vs. HW Configuration Setting ........................................................ 13
3. Reference Design ..................................................................................................................14
3.1 Reference Design Circuit (Operation mode) .............................................................. 14
3.2 SPI Firmware Download ............................................................................................ 14
4. Packing and Handling ............................................................................................................15
4.1 Moisture Sensitivity.................................................................................................... 15
4.2 Tape Reel Packing Information .................................................................................. 16
4.3 Storage and Floor Life Guideline ............................................................................... 19
4.4 Drying ......................................................................................................................... 19
4.5 ESD Handling ............................................................................................................. 20
5. Reflow Soldering Temperature Profile ...................................................................................21
5.1 SMT Reflow Soldering Temperature Profile .............................................................. 21
5.2 Manual Soldering ....................................................................................................... 24
6. Contact Information..............................................................................................................24
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
GlobalTop Technology
Orchid-1 Datasheet (Tape Reel)
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1. Functional Description
1.1 Overview
Orchid-1 is a GlobalTop BluetoothTM low
energy module, which utilizes CSR1010 –the
CSR new generation BluetoothTM low energy
chipset built with μEnergy platform, is
designed specifically for the rapid
development of cost-effective BluetoothTM
low energy applications. It enables ultra low
power connectivity and basic data transfer for
applications previously limited by the power
consumption, size constraints and complexity
of other wireless standards.
Orchid-1 provides everything required for
BluetoothTM low energy product with RF
communication, baseband, MCU, Memory,
qualified BluetoothTM v4.1 stack and customer
application running on a single mode module.
Orchid-1 connects seamlessly while backward
compatible to BLE version 4.0 devices.
Due to its small size, outstanding performance
at low power consumption and easy modular
handling, Orchid-1 is leading the way for the
new generation of BluetoothTM low energy
(BLE) modules.
Application

Automotive

Watches

Healthcare

Commercial

Sports and fitness

Asset management

Home entertainment

Human interface devices

Office and mobile accessories
Highlights and Features

Bluetooth v 4.1 Single-mode
 Support master and slave modes
 PCB-Print antenna

Bluetooth Smart Profile Stack
 Host stack including ATT, GATT,
SMP, L2CAP, GAP
 AES-128 Encryption Engine

G.top Profile Customization
 SPP (Serial Port Profile)
 Security
 Lighting
 Beacon with iBeacon Technology

Radio Freq. Performance
 Transmit power: 7.5dBm
 Receiver sensitivity: -92.5dBm
 RF Data rate: 1Mbps. GFSK Mod.

Peripheral Interfaces
 UART / SPI / I2C / GPIO

Power Consumption
 Transmit / Receive
[email protected] Current (Typ.)
Deep Sleep: 5uA (Typ.)

Dimension
 16 x 23 x 2.3 mm

Working Temperature
 -20°C to +75°C
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
4
1.2 System Block Diagram
Antenna
18
23
BLE
Radio and Modem
SAW
I/O
7
6
UART
VCC
21
8
9
16
15
14
LDO/Switch Regulators
LED PWM
MCU
PIO
GlobalTop Technology Inc.
SEL
WAKE
RX
TX
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
Bcs-u1623
BLE Module
Datasheet (Tape Reel)
16MHz
Crystal
32.768KHz
Crystal
ROM/RAM
AIO
Clock
Generation
I2C/SPI
2 AIO2
3
AIO1
4 AIO0
1
SCL
24
SDA
10
CLK
11
MOSI
12
CSB
13
MISO
Flash /EEPROM
Revision: V0F
5,17,19,20,22
1.3 Bluetooth Smart Stacks
Application Layer
User App
Device
Generic Att. Profile
(GATT)
Manager
Library
Attribute Profile
(ATT)
Security Manager
(SM)
L2CAP
Link Layer Control
Hardware
Software Radio Ctrl
Digital Radio Control
Physical Layer
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior
permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
th
No.16 Nan-ke 9 Rd, Science-Based Industrial Park, Tainan, 741, Taiwan, R.O.C.
Tel: +886-6-5051268 / Fax: +886-6-5053381 / Email: [email protected] / Web: www.GlobalToptech.com
GlobalTop Technology
Bcs-u1623 Datasheet (Tape Reel)
Document #
Ver. V0H
2. Specifications
2.1 Mechanical Dimension
Dimension: (Unit: mm, Tolerance: +/- 0.2mm)
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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2.2 Recommended PCB Pad Layout
(Unit: mm, Tolerance: 0.1mm)
(Top view)
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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2.3 Pin Configuration
(Top view)
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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2.4 Pin Assignment
Pin
Name
I/O
Description & Note
1
SCL
I/O
I2C - Serial Clock Line
2
AIO2
I/O
Analogue Input/Output
3
AIO1
I/O
Analogue Input/Output
4
AIO0
I/O
Analogue Input/Output
5
GND
P
Ground
6
TX
O
UART transmit data output
7
RX
I
UART receive data input
8
GPIO4
I/O
Parallel Input/Output
9
GPIO3
I/O
Parallel Input/Output
10
CLK
I/O
SPI clock
11
MOSI
I
SPI_ Master out Slave in
12
CSB
I/O
SPI chip select
13
MISO
O
SPI _ Master in Slave out
14
GPIO0
I/O
Parallel Input/Output
15
GPIO1
I/O
Parallel Input/Output
16
GPIO2
I/O
Parallel Input/Output
17
GND
P
Ground
18
SEL
I
Operation mode / SPI interface enable
19
GND
P
Ground
20
GND
P
Ground
21
VCC
PI
Supply voltage
22
GND
P
Ground
23
WAKE
I
Operation mode /Wake-up interrupt (option)
24
SDA
I/O
I2C- Serial Data Line
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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2.5 Description of I/O Pin
GND, Pin5, 17, 19, 20, 22
Ground
SCL, Pin1
I2C bus_ Serial Clock Line, followed I2C specification and can support 100 kHz and 400 kHz speed.
AIO2, AIO1, AIO0, Pin2, 3, 4
These Pin are analogue general purpose I/O.
The behavior of these I/O pins can be configured by customized firmware for different
applications.
Keeps it floating if not used.
TX, Pin6
This is the UART transmit pin of the module which outputs data to Host.
RX, Pin7
This is the UART receive pin of the module which is used to receive commands from Host.
GPIO4, GPIO3, GPIO0, GPIO1, GPIO2, Pin 8, 9,14,15,16
These Pins are parallel general purpose I/O.
The I/O behavior of this pin can be configured by custom firmware for different applications.
Keep it floating if not used.
CLK, Pin10
SPI bus_ Serial Clock Line.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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MOSI, Pin11
SPI bus_ Master out Slave in.
CSB, Pin12
SPI bus_Chip select.
MISO, Pin13
SPI bus_ Master in Slave out.
SEL, Pin18
The pin is used to set the operation mode (4.7K Ohm to GND) or SPI Mode (4.7K Ohm to VCC) .
Please make sure the SEL setting here as below.
SEL(Pin18)
Pull low
Pull high
Operation Mode
SPI Mode
(for Firmware download)
VCC, Pin21
The main DC power supply of the module, the voltage should be kept between from 1.8V to 3.6V
(Typical: 3V).
WAKE, Pin23
The pin is connected to ground via 4.7Kohm.
SDA, Pin24
I2C bus_ Serial Data Line, follow I2C specification and can support 100 kHz and 400 kHz speed.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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2.6 Specification
Description
BLE Solution
CSR 1010
Frequency
2402-2480MHz
Sensitivity
-92.5dBm(chipset ability)
Power Output
7.5dBm(chipset ability)
RF Data rate
1Mbps, GFSK, 250KHz deviation
Channel Spacing
2MHz
Modulation
GFSK
Power Supply
2.5V to [email protected](Typ.)
Current Consumption
Deep Sleep: 5μA (Typ.)
RX / TX active :20mA@ peak current (Typ.)
Working Temperature
-20 °C to +75 °C
Storage Temperature
-30 °C to +85 °C
Dimension
16 x23 x 2.3 mm, SMD
Weight
1.3g
2.7 Absolute Maximum Ratings
The voltage applied for VCC should not exceed 3.6VDC.
Power Supply Voltage
Symbol
Min.
Typ.
Max.
Unit
VCC
2.5
3.0
3.6
V
2.8 Operating Conditions
Condition
Min.
Typ.
Max.
Unit
GPIO Input L Level
VCC=1.8~3.6V
-0.4
-
0.3xVCC
V
GPIO Input H Level
VCC=1.8~3.6V
0.7xVCC
-
VCC+0.4
V
GPIO Output L Level
VCC=1.8~3.6V
-
-
0.4
V
GPIO Output H Level
VCC=1.8~3.6V
0.75xVCC
-
-
V
AIO Input Voltage
-
0
-
1.35
V
AIO Output Voltage
-
0
-
1.35
V
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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2.9 UART Setting Conditions
Parameter
Baud rate
Possible Values
Minimum
1200 baud (≤2%Error)
9600 baud (≤1%Error)
Maximum
2Mbaud (≤1%Error)
Parity
-
None, Odd or Even
Number of stop bits
-
1 or 2
Bits per byte
-
8
2.10 TX Power vs. HW Configuration Setting
2.11 RX/TX Current vs. HW Configuration Setting
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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3. Reference Design
This chapter introduces the reference schematic design for the best performance. Additional tips
and cautions on design are detail documented on Application Note, which is available upon request.
3.1 Reference Design Circuit (Operation mode)
Note:
1. Ferrite bead L1 is added for power noise reduction. You may use other component with
impedance of 600Ω at 100 MHz, IDC Max. 200mA.
2. C1, C2 and C3 bypass capacitors should be placed in proximity to the module.
3. Damping resistors R1 and R2 can be modified based on system application for EMI.
3.2 SPI Firmware Download
Note:
1. Ferrite bead L1 is added for power noise reduction. You may use other component with
impedance of 600Ω at 100 MHz, IDC Max. 200mA.
2. C1, C2 and C3 bypass capacitors should be placed in proximity to the module.
※If you need more support and information on antenna implementation, please contact us
at [email protected]
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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4. Packing and Handling
BLE modules, like any other SMD devices, are sensitive to moisture, electrostatic discharge, and
temperature. By following the standards outlined in this document for GlobalTop BLE modules
storage and handling, it is possible to reduce the chances of them being damaged during production
set-up. This document will go through the basics on how GlobalTop packages its modules to ensure
they arrive at their destination without any damages and deterioration to performance quality. It
includes cautionary notes for prior to the surface mount process.
Please read the sections II to V carefully to avoid permanent damages due to moisture
intake.
BLE modules contain highly sensitive electronic circuits and are electronic sensitive devices.
Improper handling without ESD protections may lead to permanent damages to the
modules. Please read section VI for more details.
4.1 Moisture Sensitivity
GlobalTop BLE modules are moisture sensitive, and must be pre-baked before going through the
solder reflow process. It is important to know that:
GlobalTop BLE modules must complete solder reflow process in 72 hours after pre-baking.
This maximum time is otherwise known as “Floor Life”
If the waiting time has exceeded 72 hours, it is possible for the module to suffer damages during the
solder reflow process such as cracks and delaminating of the SMD pads due to excess moisture
pressure.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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4.2 Tape Reel Packing Information
750pcs/Reel
Spec: H: 44.5±1.5, T: 2.2±0.2 D: 99±1.5
Note: 13”Reel, Material: P.S
Unit: (mm)
Figure 1: Reel Dimension
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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Ao
Bo
Ko
W
P
F
16.4±0.10
23.5±0.10
2.8±0.10
44±0.30
24±0.10
20.2±0.10
Unit: (mm)
Figure 2: Tape Dimension
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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The moisture color coded card provides an insight to the relative humidity in percentage (RH). When
the BLE modules are taken out, it should be around or lower than 30% RH level.
Outside each electrostatic bag is a caution label for moisture sensitive device.
Figure 3: Example of moisture color coded card and caution label
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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4.3 Storage and Floor Life Guideline
Since GlobalTop BLE modules must undergo solder-reflow process in 72 hours after it has gone
through pre-baking procedure, therefore if it is not used by then, it is recommended to store the BLE
modules in dry places such as dry cabinet.
The approximate shelf life for GlobalTop BLE modules packages is 6 months from the bag seal date,
when store in a non-condensing storage environment (<30°C/60% RH)
It is important to note that it is a required process for GlobalTop BLE modules to undergo
pre-baking procedures, regardless of the storage condition.
4.4 Drying
Because the vapor pressures of moisture inside the BLE modules increase greatly when it is exposed
to high temperature of solder reflow, in order to prevent internal delaminating, cracking of the
devices, or the “popcorn” phenomenon, it is a necessary requirement for GlobalTop BLE module to
undergo pre-baking procedure before any high temperature or solder reflow process.
The recommendation baking time for GlobalTop BLE modules is as follows:
 60°C for 8 to 12 hours
Once baked, the module’s floor life will be “reset”, and has additional 72 hours in normal factory
condition to undergo solder reflow process.
Please limit the number of times the BLE modules undergoes baking processes as repeated
baking process has an effect of reducing the wetting effectiveness of the SMD pad contacts.
This applies to all SMT devices.
Oxidation Risk: Baking SMD packages may cause oxidation and/or inter metallic growth of
the terminations, which if excessive can result in solder ability problems during board
assembly. The temperature and time for baking SMD packages are therefore limited by
solder ability considerations. The cumulative bake time at a temperature greater than 90°C
and up to 125°C shall not exceed 96 hours. Bake temperatures higher than 125°C are now
allowed.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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4.5 ESD Handling
Please carefully follow the following precautions to prevent severe damage to
BLE modules.
GlobalTop BLE modules are sensitive to electrostatic discharges, and thus are Electrostatic Sensitive
Devices (ESD). Careful handling of the BLE modules, must follow the standard ESD safety practices:
 Unless there is a galvanic coupling between the local GND and the PCB GND, then the first
point of contact when handling the PCB shall always be between the local GND and PCB GND.
 Please do not touch the mounted PCB antenna to prevent electrostatic discharge from the
RF input
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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5. Reflow Soldering Temperature Profile
The following reflow temperature profile was evaluated by GlobalTop and has been proven to be
reliable qualitatively. Please contact us beforehand if you plan to solder this component using a
deviated temperature profile as it may cause significant damage to our module and your device.
All the information in this sheet can only be used only for Pb-free manufacturing process.
5.1 SMT Reflow Soldering Temperature Profile
(Reference Only)
Average ramp-up rate (25 ~ 150°C): 3°C/sec. max.
Average ramp-up rate (270°C to peak): 3°C/sec. max.
Preheat: 175 ± 25°C, 60 ~ 120 seconds
Temperature maintained above 217°C: 60~150 seconds
Peak temperature: 250 +0/-5°C, 20~40 seconds
Ramp-down rate: 6°C/sec. max.
Time 25°C to peak temperature: 8 minutes max.
Peak:250+0/-5°C
°C
Slop:3°C /sec. max.
Slop:6°C /sec. max.
(217°C to peak)
217°C
Preheat: 175±5°C
60 ~120 sec.
20 ~ 40 sec.
60 ~150 sec.
Slop:3°C /sec. max.
25°C
Time (sec)
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Details
Before proceeding with the reflowsoldering process, the BLE module must
be pre-baked.
Document #
Ver. V0H
Suggestions
Pre-bake Time:
6 Hours @ 60°±5°C or
Notes
The maximum tolerated
temperature for the tray is
100°C.
4 Hours @ 70°±5°C
After the pre-baking
process, please make sure
the temperature is
sufficiently cooled down to
35°C or below in order to
prevent any tray
deformation.
Because PCBA (along with the PCB
antenna) is highly endothermic during
the reflow-soldering process, extra care
must be paid to the BLE module's solder
joint to see if there are any signs of cold
weld(ing) or false welding.
The parameters of the
reflow temperature
must be set accordingly
to module’s reflowsoldering temperature
profile.
Double check to see if the
surrounding components
around the BLE module are
displaying symptoms of
cold weld(ing) or false
welding.
3
Special attentions are needed for PCBA
board during reflow-soldering to see if
there are any symptoms of bending or
deformation to the PCBA board,
possibility due to the weight of the
module. If so, this will cause concerns at
the latter half of the production process.
A loading carrier fixture
must be used with PCBA
if the reflow soldering
process is using rail
conveyors for the
production.
If there is any bending or
deformation to the PCBA
board, this might causes
the PCBA to collide into
one another during the
unloading process.
4
Before the PCBA is going through the
reflow-soldering process, the production
operators must check by eyesight to see
if there are positional offset to the
module, because it will be difficult to
readjust after the module has gone
through reflow-soldering process.
The operators must
check by eyesight and
readjust the position
before reflow-soldering
process.
If the operator is planning
to readjust the module
position, please do not
touch the PCB antenna
Before handling the PCBA, they must be
cooled to 35°C or below after they have
gone through the reflow-soldering
process, in order to prevent positional
shift that might occur when the module is
still hot.
1. Can use electric fans
behind the Reflow
machine to cool them
down.
2. Cooling the PCBA can
prevent the module
from shifting due to
fluid effect.
1
2
5
--
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Ver. V0H
Other Cautionary Notes on Reflow-Soldering Process:
1. Module must be pre-baked before going through SMT solder reflow process.
2. The usage of solder paste should follow “first in first out” principle. Opened solder paste
needs to be monitored and recorded in a timely fashion manner (refer to IPQC standards for
related documentation and examples)
3. Temperature and humidity must be controlled within SMT production line and storage area.
Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC standards
for related documentation and examples)
4. When performing solder paste printing, please notice if the amount of solder paste is in
excess or insufficient, as both conditions may lead to defects such as electrical shortage,
empty solder and etc.
5. Make sure the vacuum mouthpiece is able to bear the weight of the BLE module to prevent
positional shift during the loading process.
6. Before the PCBA is going through the reflow-soldering process, the operators should check
by eyesight to see if there are positional offset to the module.
7. The reflow temperature and its profile data must be measured before the SMT process and
match the levels and guidelines set by IPQC.
8. If SMT protection line is running a double-sided process for PCBA, please process BLE
module during the second pass only to avoid repeated reflow exposures of the BLE modules.
Please contact GlobalTop beforehand if you must process BLE modules during the 1st pass of
double-side process.
Figure 4: Place BLE modules right-side up when running reflow-solder process, do not invert.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
23
GlobalTop Technology
Bcs-u1623 Datasheet (Tape Reel)
Document #
Ver. V0H
5.2 Manual Soldering
Soldering iron:
Heat Temperature: under 380°C
Time: under 3 sec.
Notes:
1. Please do not directly touch the soldering pads on the surface of the PCB board, in order to
prevent further oxidation
2. The solder paste must be defrosted to room temperature before use so it can return to its
optimal working temperature. The time required for this procedure is unique and dependent
on the properties of the solder paste used.
3. The steel plate must be properly assessed before and after use, so its measurement stays
strictly within the specification set by SOP.
4. Please watch out for the spacing between soldering joint, as excess solder may cause
electrical shortage
5. Please exercise with caution and do not use extensive amount of flux due to possible siphon
effects on neighboring components, which may lead to electrical shortage.
6. Please do not use the heat gun for long periods of time when removing the shielding or
inner components of the BLE module, as it is very likely to cause a shift to the inner
components and will leads to electrical shortage.
6. Contact Information
GlobalTop Technology Inc.
Address: No.16 Nan-ke 9th Road Science-based Industrial Park, Tainan 741, Taiwan
Tel: +886-6-5051268
Fax: +886-6-5053381
Website: www.gtop-tech.com
Email: [email protected] -tech.com
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
24